The XCKU5P-L1FFVB676I is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Kintex UltraScale+ series, designed to deliver exceptional power efficiency and advanced connectivity for next-generation embedded systems and high-performance computing applications.
1. Product Specifications
Core FPGA Specifications
- Part Number: XCKU5P-L1FFVB676I
- FPGA Family: Kintex UltraScale+
- Manufacturer: AMD (formerly Xilinx)
- Logic Elements: 474,600 system logic cells
- CLB Look-Up Tables: 216,960 LUTs
- I/O Count: 280 user I/O pins
- Package Type: 676-FCBGA (Fine Ball Grid Array)
- Speed Grade: -1 (Low power industrial grade)
Memory and Storage Features
- Block RAM: 16.9 Mb embedded block RAM
- Distributed RAM: 6.1 Mb distributed memory
- Ultra-RAM: 64 blocks providing 18 Mb Ultra-RAM capacity
- Memory Interface Support: DDR4, DDR3, LPDDR4, QDRII+
Connectivity and I/O
- High-Speed Transceivers: 16 GTY transceivers supporting up to 32.75 Gbps
- PCIe Support: PCIe Gen3 x16 and PCIe Gen4 x8
- Ethernet Connectivity: 100G Ethernet support
- LVDS Pairs: 45 differential pairs
- HD I/O: 72 High Density I/O pins
- HP I/O: 96 High Performance I/O pins
Power and Thermal Specifications
- Core Voltage (VCCINT): 0.698V to 0.876V (optimized for 0.85V operation)
- I/O Voltage Support: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
- Power Optimization: Low power (-L) variant for reduced static power consumption
- Operating Temperature: -40ยฐC to +100ยฐC (TJ – junction temperature)
- Mounting Type: Surface Mount Technology (SMT)
Advanced Features
- DSP Slices: High-performance DSP48E2 slices for signal processing
- Clock Management: Multiple PLLs and clock management tiles
- Security Features: AES and SHA authentication, bitstream encryption
- Debugging Support: Integrated Logic Analyzer (ILA) and System ILA
2. Price Information
Current Pricing: $2,923.71 (single unit pricing)
Lead Time: 25 weeks manufacturer standard lead time
Availability: Product Status: Active
Packaging: Tray packaging for volume shipments
Note: Pricing may vary based on volume, distributor, and current market conditions. Contact authorized distributors for volume pricing and current availability.
3. Documents & Media
Technical Documentation
- Product Datasheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation and design guidelines
- Package Information: Detailed pinout diagrams and mechanical drawings
- Power Estimation Tools: Xilinx Power Estimator (XPE) spreadsheets
- Design Guidelines: PCB layout recommendations and signal integrity guidelines
Design Resources
- Reference Designs: Evaluation board schematics and layouts
- Example Projects: Starter designs for common applications
- IP Core Library: Pre-verified IP blocks for rapid development
- Development Board Support: Compatible with AMD development platforms
Software Tools
- Vivado Design Suite: Primary development environment
- Vitis Unified Software Platform: Application development framework
- ChipScope Pro: Hardware debugging and analysis tools
- SDK Integration: Software development kit compatibility
4. Related Resources
Development Platforms
- Evaluation Boards: KCU116 evaluation board and similar platforms
- System-on-Module: ALINX ACKU5P SoM with integrated DDR4 and QSPI Flash
- Third-Party Boards: Various partner development platforms available
Application Areas
- 5G Wireless Infrastructure: MIMO technology and baseband processing
- Data Center Acceleration: Network processing and storage acceleration
- Video Processing: 4K/8K video encoding, decoding, and analytics
- Industrial Automation: Machine vision and real-time control systems
- Medical Imaging: High-speed image processing and analysis
- Aerospace & Defense: Radar processing and secure communications
Competitive Products
- Alternative Speed Grades: XCKU5P-2FFVB676I (higher performance variant)
- Different Packages: XCKU5P-1FFVA676E (different pin configuration)
- Related Families: Virtex UltraScale+ for higher-end applications
Support Resources
- Technical Forums: AMD Community forums for design support
- Application Notes: Industry-specific implementation guides
- Training Materials: Online courses and webinar series
- Field Application Engineers: Regional technical support
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: ROHS3 Compliant – Restriction of Hazardous Substances directive compliant
- REACH Compliance: European chemical safety regulation compliant
- Conflict Minerals: Compliant with conflict minerals reporting requirements
- Green Packaging: Environmentally responsible packaging materials
Operating Environment
- Temperature Range: -40ยฐC to +100ยฐC (TJ) junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC for long-term storage
- Humidity: 5% to 85% relative humidity (non-condensing)
- Altitude: Up to 3000 meters operational altitude
Quality and Reliability
- Quality Grade: Industrial grade (-I) temperature classification
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level 3)
- ESD Rating: Class 1C ESD protection
- MTBF: Mean Time Between Failures data available
Export Classifications
- Export Control: Subject to US Export Administration Regulations (EAR)
- ECCN: Export Control Classification Number designation
- Dual-Use Technology: May require export licensing for certain destinations
- Country Restrictions: Check current export restrictions before international shipping
Certifications
- ISO Standards: Manufactured under ISO 9001 quality management
- Automotive: Not qualified for automotive applications (commercial/industrial grade)
- Military: Commercial grade – not qualified for military applications
Keywords: XCKU5P-L1FFVB676I, AMD FPGA, Kintex UltraScale+, Field Programmable Gate Array, 676-FCBGA, Industrial FPGA, Low Power FPGA, High-Speed Transceivers, FPGA Development, Programmable Logic
