The XCKU5P-L1FFVA676I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing.
Product Specifications
Core Architecture
The XCKU5P-L1FFVA676I features advanced 16nm FinFET+ technology, providing optimal power efficiency and performance. This FPGA incorporates 216,960 logic cells and 840 DSP slices, making it ideal for complex digital signal processing applications.
Key Technical Features
- Logic Cells: 216,960 system logic cells
- Block RAM: 28.6 Mb total block RAM
- DSP Slices: 840 DSP48E2 slices
- Package Type: FFVA676 (676-pin flip chip BGA)
- Speed Grade: -1L (low power variant)
- Operating Temperature: Industrial grade (-40°C to +100°C)
- I/O Count: 312 user I/Os
Memory and Connectivity
The XCKU5P-L1FFVA676I supports high-speed memory interfaces including DDR4, DDR3, and LPDDR4. It features multiple high-speed transceivers capable of supporting protocols like PCIe Gen3, 10G Ethernet, and custom serial interfaces.
Pricing Information
Pricing for the XCKU5P-L1FFVA676I varies based on quantity and supplier. Contact authorized distributors for current pricing and availability. Volume discounts are typically available for production quantities exceeding 100 units.
Cost Considerations
- Single unit pricing: Contact for quote
- Volume pricing: Available for 25+ units
- Lead time: Standard 12-16 weeks from order
- Extended temperature variants available at premium pricing
Documents & Media
Technical Documentation
- Datasheet: Complete electrical and mechanical specifications for XCKU5P-L1FFVA676I
- User Guide: Comprehensive implementation guide covering design methodology
- Pin-out Documentation: Detailed I/O pin assignments and package information
- Power Estimation Tools: Xilinx Power Estimator (XPE) support files
Development Resources
- Vivado Design Suite: Full development environment compatibility
- Reference Designs: Pre-validated IP cores and example projects
- Application Notes: Implementation guidelines for common use cases
- Video Tutorials: Step-by-step design flow demonstrations
Package and Mechanical Data
- 3D Models: CAD files for mechanical design integration
- Thermal Models: Junction-to-case thermal resistance data
- Package Drawings: Detailed mechanical dimensions and tolerances
Related Resources
Development Boards
Several evaluation and development boards support the XCKU5P-L1FFVA676I, enabling rapid prototyping and system validation. Popular options include Xilinx evaluation boards and third-party development platforms.
IP Core Library
Access to Xilinx’s extensive IP core library accelerates development with pre-verified components for:
- Signal processing functions
- Communication protocols
- Memory controllers
- Video and image processing
Design Tools and Software
- Vivado ML Edition: Advanced synthesis and implementation tools
- Vitis Unified Software Platform: Acceleration platform for embedded applications
- System Generator: MATLAB/Simulink integration tools
- PetaLinux: Embedded Linux development framework
Technical Support
- Online Forums: Community-driven support and knowledge sharing
- Application Engineering: Direct technical support from Xilinx experts
- Training Resources: Online courses and certification programs
- Documentation Portal: Comprehensive library of technical resources
Environmental & Export Classifications
Environmental Compliance
The XCKU5P-L1FFVA676I meets stringent environmental standards and regulations:
- RoHS Compliant: Lead-free manufacturing process
- REACH Compliant: European chemical regulation compliance
- Conflict Minerals: Compliant with Dodd-Frank Act requirements
- Green Product: Meets Xilinx environmental sustainability standards
Temperature and Operating Conditions
- Operating Temperature Range: -40°C to +100°C junction temperature
- Storage Temperature: -65°C to +150°C
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000m operational
Export Control Information
- ECCN Classification: 3A001.a.7 (subject to export regulations)
- Country of Origin: Manufactured in Asia-Pacific region
- Export License: May require export license for certain destinations
- ITAR Status: Not subject to International Traffic in Arms Regulations
Quality and Reliability
- Qualification Standards: Automotive AEC-Q100 qualified variants available
- Reliability Testing: Comprehensive stress testing and qualification
- Quality Management: ISO 9001:2015 certified manufacturing
- Traceability: Full supply chain traceability and lot tracking
The XCKU5P-L1FFVA676I represents the pinnacle of FPGA technology, combining high performance, low power consumption, and comprehensive development support to enable next-generation electronic systems across multiple industries.
