The XCKU5P-3FFVA676E is a cutting-edge field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing.
Product Specifications
The XCKU5P-3FFVA676E features advanced 16nm FinFET+ technology, providing optimal power efficiency and performance. This FPGA incorporates 504,000 system logic cells and 1,824 DSP slices, making it ideal for complex signal processing and data acceleration tasks.
Key Technical Specifications:
- Device Family: Kintex UltraScale+
- Logic Cells: 504,000
- Package Type: FFVA676 (676-pin Flip Chip BGA)
- Speed Grade: -3 (highest performance grade)
- Operating Temperature: Extended commercial range
- Block RAM: 28.6 Mb total
- UltraRAM: 28.8 Mb
- DSP Slices: 1,824
- I/O Pins: 400
- Transceiver Channels: 20 GTY transceivers
- PCIe Lanes: Up to 8 lanes Gen3/Gen4
The XCKU5P-3FFVA676E supports multiple high-speed interfaces including 100G Ethernet, PCIe Gen4, and DDR4 memory controllers, enabling seamless integration into modern system architectures.
Price Information
Pricing for the XCKU5P-3FFVA676E varies based on quantity, distributor, and current market conditions. Contact authorized distributors for current pricing and availability. Volume discounts are typically available for orders above 100 units. Lead times may vary depending on demand and supply chain conditions.
Documents & Media
Essential Documentation:
- Product Brief and Data Sheet
- UltraScale+ FPGAs Configuration User Guide (UG570)
- Kintex UltraScale+ FPGAs PCB Design Guide
- Power Estimator Tool (XPE)
- Vivado Design Suite compatibility guides
- Package and pinout specifications
Development Resources:
- Reference designs and application notes
- IP core documentation
- Timing and power analysis reports
- Thermal design guidelines
- Signal integrity design recommendations
All documentation is available through AMD Xilinx’s official website and requires registration for access to the latest versions.
Related Resources
Development Tools:
- Vivado Design Suite (recommended version 2023.2 or later)
- Vitis Unified Software Platform
- ChipScope Pro Analyzer for debugging
- System Generator for DSP
Evaluation Platforms:
- Kintex UltraScale+ evaluation boards
- Development kits with XCKU5P-3FFVA676E
- Third-party carrier cards and modules
IP Cores and Libraries:
- LogiCORE IP portfolio compatibility
- DSP and video processing IP
- Connectivity IP (Ethernet, PCIe, DDR4)
- Security and encryption cores
Training and Support:
- Online training modules for UltraScale+ architecture
- Design methodology guides
- Community forums and technical support
- Application-specific design services
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (Lead-free)
- REACH regulation compliance
- Conflict minerals reporting template available
- Green product designation
Export Control Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- Subject to Export Administration Regulations (EAR)
- License requirements may apply for certain destinations
- Dual-use technology restrictions applicable
Quality and Reliability:
- Automotive qualification available (select variants)
- Industrial temperature grade options
- Military and aerospace screening services
- Extended warranty programs available
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Extended commercial: -40ยฐC to +100ยฐC
- Power supply requirements: Multiple voltage rails
- Recommended operating conditions specified in datasheet
The XCKU5P-3FFVA676E represents a powerful solution for engineers requiring high-performance FPGA capabilities in a compact, efficient package. Its combination of processing power, connectivity options, and development tool support makes it an excellent choice for next-generation embedded systems and acceleration platforms.
