The XCKU5P-2FFVB676E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing.
Product Specifications
Core Architecture
The XCKU5P-2FFVB676E features advanced 16nm FinFET+ technology, providing optimal power efficiency and performance. This FPGA incorporates 504,000 system logic cells with 1,824 DSP slices, making it ideal for complex signal processing applications.
Key Technical Features
- Logic Cells: 504,000 system logic cells
- Block RAM: 34.6 Mb total block RAM capacity
- DSP Slices: 1,824 DSP48E2 slices for high-speed arithmetic operations
- Package Type: FFVB676 (Fine-Pitch Ball Grid Array)
- Speed Grade: -2 (industrial temperature range)
- I/O Pins: 400 user I/O pins
- Transceivers: Up to 12 GTY transceivers supporting up to 32.75 Gbps
Memory and Connectivity
The XCKU5P-2FFVB676E supports multiple memory interfaces including DDR4, DDR3, and LPDDR4, enabling seamless integration with various memory architectures. Advanced connectivity options include PCIe Gen3 x8, 10/25/40/50 Gigabit Ethernet, and USB 3.0 support.
Pricing Information
Current market pricing for the XCKU5P-2FFVB676E varies based on quantity and supplier. Contact authorized distributors for volume pricing and availability. Typical pricing ranges from $2,000 to $4,000 per unit depending on order quantities and market conditions.
Note: Prices subject to change based on market conditions and availability.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation guidelines
- Reference Manual: Detailed architectural information
- Application Notes: Design examples and best practices
- Errata: Known issues and workarounds
Development Resources
- Vivado Design Suite: Compatible with latest Vivado versions
- IP Catalog: Access to extensive IP library
- Board Files: Reference designs and constraints
- Simulation Models: Behavioral and timing models
Related Resources
Development Boards
Several evaluation and development boards support the XCKU5P-2FFVB676E, including custom carrier boards and reference designs from AMD Xilinx partners.
Compatible Tools
- Vivado Design Suite 2023.2 or later
- Vitis Unified Software Platform
- System Generator for DSP
- Model Composer
Training and Support
- Online training courses for Kintex UltraScale+ development
- Technical support through AMD Xilinx forums
- Professional services and consulting available
Environmental & Export Classifications
Environmental Compliance
The XCKU5P-2FFVB676E meets stringent environmental standards:
- RoHS Compliant: Lead-free and environmentally friendly
- REACH Compliant: Meets European chemical regulations
- Operating Temperature: 0ยฐC to +85ยฐC (commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
Export Control Information
- ECCN: 3A001.a.7 (subject to EAR regulations)
- HTS Code: 8542.33.0001
- Country of Origin: Various (assembled in multiple locations)
Quality Standards
- ISO 9001:2015 certified manufacturing
- Automotive Grade: AEC-Q100 qualified versions available
- Reliability: MTBF exceeding 1 million hours under normal operating conditions
Package Environmental Data
- Moisture Sensitivity Level: MSL 3
- Peak Reflow Temperature: 260ยฐC
- Package Weight: Approximately 2.5 grams
The XCKU5P-2FFVB676E represents the pinnacle of FPGA technology, combining high performance, energy efficiency, and versatility for next-generation applications requiring advanced programmable logic solutions.
