Overview
The XCKU5P-1FFVB676I is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Kintexยฎ UltraScale+โข family, designed to deliver optimal price-performance-watt balance for demanding applications. This advanced FPGA combines superior processing capabilities with energy efficiency, making it ideal for wireless communications, networking, data centers, and DSP-intensive applications.
1. Product Specifications
Core Architecture & Performance
- FPGA Family: Kintexยฎ UltraScale+โข
- Part Number: XCKU5P-1FFVB676I
- Manufacturer: AMD (formerly Xilinx)
- Speed Grade: -1 (Industrial temperature range)
- Process Technology: 20nm FinFET
- Maximum Operating Frequency: 630 MHz
Logic Resources
- Logic Elements/Cells: 474,600 cells
- Logic Blocks: 216,960
- CLB Look-Up Tables (LUTs): 216,960
- CLB Flip-Flops: 433,920
- Block RAM: 16,900 Kbit total memory
- UltraRAM: 41,984,000 bits
I/O and Package Details
- I/O Pins: 280 user I/O
- Package Type: 676-pin FCBGA (Flip Chip Ball Grid Array)
- Package Code: FFVB676
- Mounting Type: Surface Mount
- Pin Count: 676 pins total
Power Requirements
- Core Voltage (VCCINT): 0.825V to 0.876V
- I/O Voltage: Multiple voltage standards supported
- Power Consumption: Optimized for low power applications
Operating Conditions
- Operating Temperature Range: -40ยฐC to +100ยฐC (TJ – Junction Temperature)
- Temperature Grade: Industrial (I)
- Humidity: Non-condensing environment
Key Features
- DSP Slices: High-performance digital signal processing capabilities
- Transceivers: High-speed serial connectivity options
- Clock Management: Advanced MMCM and PLL resources
- Memory Interface: Support for DDR4, DDR3, and other memory standards
- Security Features: Built-in encryption and authentication
2. Pricing Information
Current Market Pricing (2025)
The XCKU5P-1FFVB676I is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities:
- Single Unit Price: $2,400 – $2,800 USD (varies by distributor)
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: 25 weeks (standard manufacturing lead time)
- Availability: Active product status with regular production
Cost Considerations
- Competitive pricing within the high-performance FPGA segment
- Total cost of ownership benefits through integrated features
- Reduced BOM costs via on-chip UltraRAM memory
- Energy efficiency translates to lower operational costs
3. Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive specifications and electrical characteristics
- User Guide (UG575): Package and pinout information
- Application Notes: Implementation guides and best practices
- Errata Documents: Known issues and workarounds
Design Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Pre-verified IP cores and reference designs
- Constraint Files: Timing and placement constraints
- CAD Models: PCB footprint and 3D models for design integration
Software Support
- Vivado ML Edition: Advanced synthesis and implementation tools
- Vitis Unified Software Platform: Application acceleration development
- SDK and Drivers: Board support packages and device drivers
- Simulation Models: Behavioral and timing simulation support
4. Related Resources
Development Platforms
- Evaluation Boards: KCU116 and similar development platforms
- Reference Designs: Networking, DSP, and communication examples
- Partner Ecosystem: Third-party development boards and modules
Technical Support
- AMD/Xilinx Forums: Community-driven technical discussions
- Application Engineering: Direct technical support channels
- Training Resources: Online courses and certification programs
- Webinars: Regular technical deep-dive sessions
Competitive Alternatives
- XCKU5P-2FFVB676I: Higher speed grade variant (-2)
- XCKU3P Series: Lower-cost alternative with reduced resources
- Intel/Altera Alternatives: Stratix and Arria series FPGAs
Application Areas
- 5G Wireless Infrastructure: Baseband processing and beamforming
- Data Center Acceleration: AI/ML inference and networking
- High-Performance Computing: Parallel processing applications
- Aerospace & Defense: Secure and high-reliability systems
- Industrial Automation: Real-time control and monitoring
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant (Lead-free)
- REACH Compliance: EU chemical regulation compliant
- Halogen-Free: Environmentally responsible packaging
- Conflict Minerals: Compliant with conflict minerals regulations
Quality Standards
- ISO 9001: Manufacturing quality management certified
- Automotive Grade: AEC-Q100 qualified variants available
- Reliability: MTBF ratings and qualification test results
- Traceability: Full supply chain visibility and lot tracking
Export Classifications
- ECCN Classification: Export control classification number assigned
- Country of Origin: Manufacturing location documentation
- Export Restrictions: Subject to international trade regulations
- Licensing Requirements: May require export licenses for certain destinations
Packaging & Handling
- ESD Protection: Anti-static packaging and handling procedures
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification
- Storage Requirements: Temperature and humidity specifications
- Shelf Life: Component storage life recommendations
Key Benefits of XCKU5P-1FFVB676I
Performance Excellence: Delivers 630 MHz operation with 474,600 logic cells for demanding applications
Power Efficiency: 20nm FinFET technology provides optimal power consumption for battery and thermal-constrained designs
Integration: Built-in UltraRAM and DSP resources reduce external component requirements
Flexibility: Supports wide range of I/O standards and memory interfaces
Reliability: Industrial temperature rating ensures operation in harsh environments
Ecosystem: Comprehensive tool support and extensive IP library accelerate development
The XCKU5P-1FFVB676I represents the pinnacle of mid-range FPGA technology, offering designers the perfect balance of performance, power efficiency, and cost-effectiveness for next-generation electronic systems.
