Product Specifications
The XCKU5P-1FFVA676I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed for demanding embedded applications requiring exceptional processing power and versatility.
Core Technical Specifications
Device Family: Kintex UltraScale+ FPGA
Part Number: XCKU5P-1FFVA676I
Manufacturer: AMD Xilinx
Package Type: 676-Pin FCBGA (Flip Chip Ball Grid Array)
Speed Grade: -1 (Industrial temperature range)
Operating Temperature: -40ยฐC to +100ยฐC (Industrial)
Logic Resources
System Logic Cells: 474,600 cells
Logic Blocks: 216,960 CLBs (Configurable Logic Blocks)
Total RAM: 16.9 Mb (16,900 Kbit) on-chip memory
Technology Node: 20nm manufacturing process
Operating Voltage: 0.95V/1V core voltage
I/O and Connectivity Features
I/O Pins: 256 user I/O pins
High-Speed Serial Transceivers: Up to 10 Gb/s SERDES capability
Package Style: FCBGA surface mount technology
The XCKU5P-1FFVA676I incorporates advanced features including UltraRAM memory blocks, DSP slices for signal processing applications, and multiple clock domains for precise timing control across different functional blocks.
Power Management
The -1I speed grade devices support voltage scaling options including operation at 0.85V or 0.72V for reduced power consumption while maintaining performance specifications. This flexibility makes the XCKU5P-1FFVA676I ideal for power-sensitive applications.
Pricing Information
Current Market Pricing (Subject to quantity and distributor):
- Single unit pricing: Contact authorized distributors
- Volume pricing: Available for quantities of 100+ units
- Lead time: Typically 12-16 weeks for standard orders
Pricing varies by distributor, quantity, and market conditions. Contact authorized distributors for current pricing and availability.
Documents & Media
Technical Documentation
Datasheet: Complete electrical specifications, timing parameters, and package information
User Guide: UG575 – UltraScale and UltraScale+ FPGAs Packaging and Pinout Guide
Application Notes: Implementation guides for specific use cases
Pinout Files: Available in TXT and CSV formats from Xilinx support
Development Resources
Design Software: Vivado Design Suite (recommended development environment)
IP Cores: Extensive library of pre-verified IP blocks
Reference Designs: Sample implementations for common applications
Evaluation Boards: Compatible development platforms available
Programming and Configuration
The XCKU5P-1FFVA676I supports multiple configuration methods including JTAG programming, configuration memory interfaces, and partial reconfiguration capabilities for dynamic system updates.
Related Resources
Compatible Development Platforms
System-on-Module Options: ALINX ACKU5P SoM featuring the XCKU5P with integrated DDR4 memory and QSPI Flash
Evaluation Boards: Various third-party development boards supporting the 676-pin FCBGA package
Programming Tools: JTAG-SMT2-NC and JTAG-SMT3-NC surface-mount programming modules
Software Tools
Primary Development Environment: Vivado Design Suite – user-friendly synthesis and implementation tools
Legacy Support: ISE Design Suite compatibility for migrating designs
Simulation Tools: ModelSim, Questa, and other industry-standard simulators
Application Areas
The XCKU5P-1FFVA676I excels in applications requiring:
- 5G wireless infrastructure and test equipment
- High-speed networking and data center acceleration
- Video processing and machine vision systems
- Industrial automation and control systems
- Aerospace and defense applications
- Medical imaging and diagnostic equipment
Environmental & Export Classifications
Environmental Compliance
RoHS Compliance: Yes – meets European RoHS directive requirements
REACH Compliance: Compliant with European chemical regulations
Conflict Minerals: Compliant with conflict minerals reporting requirements
WEEE Directive: Supports European waste electrical equipment regulations
Operating Environment
Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial grade)
Storage Temperature: -65ยฐC to +150ยฐC
Humidity: 5% to 85% non-condensing
Altitude: Up to 2000 meters operational
Export Classification
ECCN (Export Control Classification Number): Subject to US export administration regulations
Country of Origin: Manufactured in various global facilities
Export Restrictions: May require export licenses for certain destinations
ITAR Status: Not ITAR controlled (commercial grade device)
Quality and Reliability
Quality Standard: ISO 9001:2015 certified manufacturing
Reliability Testing: Meets JEDEC standards for semiconductor reliability
ESD Rating: Class 1C per JEDEC JS-001
Moisture Sensitivity: MSL (Moisture Sensitivity Level) 3
Packaging and Handling
Standard Packaging: Anti-static tray packaging for component protection
Lead-Free: Yes – lead-free solder ball attachment
Halogen-Free: Available upon request
Shelf Life: 12 months in controlled storage conditions
Note: This product requires expertise in FPGA design and implementation. Consult with qualified engineers and refer to official AMD Xilinx documentation for complete technical specifications and design guidelines. All specifications subject to change without notice.
