The XCKU5P-1FFVA676E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding digital signal processing, networking, and acceleration applications. This advanced FPGA combines high logic density with superior power efficiency, making it an ideal choice for next-generation embedded systems and high-performance computing solutions.
Product Specifications
Core Architecture
- Device Family: Kintex UltraScale+
- Part Number: XCKU5P-1FFVA676E
- Logic Cells: 518,000 system logic cells
- CLB Flip-Flops: 663,360
- CLB LUTs: 331,680
- Block RAM: 34.6 Mb total block RAM
- UltraRAM: 28.6 Mb integrated UltraRAM
Processing & DSP Capabilities
- DSP Slices: 1,368 DSP48E2 slices
- Processing System: None (FPGA fabric only)
- Maximum Operating Frequency: Up to 891 MHz
- Speed Grade: -1 (standard performance)
I/O and Connectivity
- Package Type: FFVA676 (Flip Chip Fine Pitch BGA)
- Total I/O Pins: 400 user I/O
- High-Speed Transceivers: 16 GTY transceivers
- Transceiver Speed: Up to 32.75 Gbps per channel
- PCIe Support: PCIe Gen4 x8 or PCIe Gen3 x16
Memory Interface Support
- DDR4/DDR4L: Up to 2666 Mbps
- DDR3/DDR3L: Up to 1866 Mbps
- LPDDR4: Up to 3200 Mbps
- QDR-IV SRAM: Up to 2133 Mbps
Pricing Information
The XCKU5P-1FFVA676E pricing varies based on quantity and supplier. Contact authorized distributors for current pricing and availability. Volume discounts are typically available for orders above 100 units. Lead times may vary depending on market conditions and demand.
Documents & Media
Technical Documentation
- Product Brief: Kintex UltraScale+ FPGA overview and key features
- Datasheet: Complete electrical specifications and operating conditions
- User Guide: Comprehensive implementation and design guidelines
- Package Information: Detailed pinout diagrams and mechanical drawings
- Migration Guide: Transition assistance from previous FPGA families
Development Resources
- Vivado Design Suite: Latest version compatibility information
- IP Core Catalog: Available IP blocks and reference designs
- Application Notes: Implementation best practices and design examples
- Evaluation Boards: Compatible development and evaluation platforms
Related Resources
Compatible Development Tools
- Vivado Design Suite 2023.2 or later
- Vitis Unified Software Platform
- System Generator for DSP
- ChipScope Pro Analyzer
Evaluation and Development Boards
- KCU116 Evaluation Kit: Full-featured development platform
- Third-party carrier cards: Various specialized development options
- Custom board design files: Reference schematics and layout guidelines
IP Portfolio
- Video Processing IP: H.264/H.265 codecs, video scaling, format conversion
- Networking IP: Ethernet MAC, TCP/IP offload, packet processing
- Signal Processing IP: FFT, FIR filters, digital up/down converters
- Interface IP: PCIe, DDR memory controllers, high-speed serial protocols
Environmental & Export Classifications
Operating Conditions
- Commercial Temperature Range: 0°C to +85°C junction temperature
- Extended Temperature Range: Available upon request
- Supply Voltage: 0.85V core, 1.8V auxiliary, 1.2V/1.8V/2.5V/3.3V I/O
- Power Consumption: Optimized for low-power applications
Environmental Compliance
- RoHS Compliance: Lead-free package construction
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Compliant with Section 1502 of Dodd-Frank Act
- ISO 14001: Manufacturing facility environmental certification
Export Control Classification
- ECCN: 3A001.a.7 (subject to US export regulations)
- Export License: May be required for certain destinations
- ITAR Classification: Not subject to International Traffic in Arms Regulations
- Dual-Use Technology: Standard commercial classification
Package and Environmental Details
- Package Material: Flip-chip BGA with lead-free solder balls
- Moisture Sensitivity Level: MSL-3 per JEDEC J-STD-020
- Storage Temperature: -65°C to +150°C
- Humidity Rating: Up to 85% relative humidity (non-condensing)
The XCKU5P-1FFVA676E represents the latest advancement in FPGA technology, offering designers the flexibility and performance needed for today’s most challenging applications. Whether you’re developing 5G infrastructure, machine learning accelerators, or high-performance computing systems, this Kintex UltraScale+ FPGA provides the processing power and connectivity options necessary for success.
