The XCKU3P-L2FFVD900E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered to deliver exceptional performance for demanding applications in aerospace, defense, communications, and industrial sectors.
Product Specifications
The XCKU3P-L2FFVD900E features advanced 20nm FinFET+ technology, providing optimal power efficiency and performance density. This FPGA incorporates 356,160 logic cells with 1,728 DSP slices for intensive signal processing applications. The device includes 19.1 Mb of block RAM and 768 Mb of UltraRAM, ensuring ample memory resources for complex designs.
Key specifications of the XCKU3P-L2FFVD900E include a maximum operating frequency of 741 MHz, supporting high-speed data processing requirements. The device offers 832 user I/O pins in the FFVD900 package, providing extensive connectivity options. Power consumption is optimized through intelligent clock gating and power islands, making it suitable for power-sensitive applications.
The XCKU3P-L2FFVD900E supports multiple high-speed serial transceivers operating up to 32.75 Gbps, enabling seamless integration with modern communication protocols. Built-in security features include AES decryption and authentication capabilities, ensuring robust design protection.
Price Information
Pricing for the XCKU3P-L2FFVD900E varies based on order quantity, lead times, and regional availability. Contact authorized distributors for current pricing and volume discounts. Educational institutions and qualifying organizations may be eligible for special pricing programs.
For real-time pricing and availability, consult major electronic component distributors or contact AMD Xilinx sales representatives directly. Consider total cost of ownership including development tools, IP licensing, and support services when evaluating the XCKU3P-L2FFVD900E for your project.
Documents & Media
Essential documentation for the XCKU3P-L2FFVD900E includes the comprehensive datasheet detailing electrical characteristics, timing specifications, and package information. The user guide provides detailed implementation guidance, design constraints, and best practices for optimal performance.
Technical reference manuals cover advanced features including memory controllers, high-speed transceivers, and power management. Application notes demonstrate real-world implementation examples and design optimization techniques specific to the XCKU3P-L2FFVD900E.
Design files, including package symbols and footprint libraries for popular EDA tools, streamline PCB design processes. Video tutorials and webinar recordings provide visual learning resources for engineers working with the XCKU3P-L2FFVD900E platform.
Related Resources
The XCKU3P-L2FFVD900E is supported by AMD Xilinx’s comprehensive Vivado Design Suite, providing integrated synthesis, implementation, and debugging tools. The Vitis unified software platform enables software developers to leverage FPGA acceleration using familiar programming models.
Development boards featuring the XCKU3P-L2FFVD900E or similar Kintex UltraScale+ devices provide hands-on evaluation platforms. Reference designs demonstrate common use cases including signal processing, machine learning acceleration, and high-speed networking applications.
Community forums and technical support channels offer peer-to-peer assistance and expert guidance for XCKU3P-L2FFVD900E implementations. Training courses and certification programs help engineers maximize their proficiency with this advanced FPGA technology.
Environmental & Export Classifications
The XCKU3P-L2FFVD900E complies with RoHS (Restriction of Hazardous Substances) directives, ensuring environmental responsibility in manufacturing and deployment. The device meets REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) regulations for chemical safety compliance.
Operating temperature range extends from -40ยฐC to +100ยฐC for commercial applications, with extended temperature variants available for harsh environments. The XCKU3P-L2FFVD900E maintains reliable performance across specified humidity and altitude conditions.
Export classification information is available through official channels, as semiconductor devices may be subject to export control regulations depending on end-use applications and destination countries. Consult current export control documentation before international shipments of systems containing the XCKU3P-L2FFVD900E.
The device packaging utilizes environmentally conscious materials and processes, supporting sustainable electronics manufacturing practices. Proper disposal and recycling procedures should be followed at end-of-life to minimize environmental impact.
The XCKU3P-L2FFVD900E represents the pinnacle of FPGA technology, combining high performance, energy efficiency, and comprehensive development support for next-generation electronic systems.
