The XCKU3P-L2FFVB676E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in communications, aerospace, defense, and industrial markets.
Product Specifications
The XCKU3P-L2FFVB676E features advanced 20nm technology with impressive specifications:
Core Architecture:
- Logic Cells: 356,160
- CLB Flip-Flops: 548,160
- CLB LUTs: 274,080
- Block RAM: 17.1 Mb
- UltraRAM: 45 Mb
- DSP Slices: 1,968
I/O and Interface:
- Maximum User I/O: 312
- Package: FFVB676 (Fine-Pitch Ball Grid Array)
- Speed Grade: -2L (Low Power)
- Operating Temperature: Industrial (-40ยฐC to +100ยฐC)
Connectivity Features:
- PCIe Gen3 x16 interfaces
- 100G Ethernet capability
- High-speed serial transceivers
- Advanced clocking and timing resources
The XCKU3P-L2FFVB676E combines high logic density with low power consumption, making it ideal for battery-powered and thermally-constrained applications.
Price
Pricing for the XCKU3P-L2FFVB676E varies based on quantity and supplier. Contact authorized distributors for current pricing and availability. Volume discounts are typically available for production quantities.
Note: Prices subject to change based on market conditions and order volume.
Documents & Media
Technical Documentation:
- Product Brief and Datasheet
- UltraScale+ FPGA Configuration User Guide
- Vivado Design Suite User Guide
- Power and Thermal Design Guidelines
- Package and Pinout Specifications
Development Resources:
- Reference designs and application notes
- IP core documentation
- Software development kits
- Evaluation board user guides
Video Resources:
- Getting started tutorials
- Design methodology webinars
- Application-specific demonstrations
Related Resources
Development Tools:
- Vivado Design Suite (synthesis, implementation, and debugging)
- Vitis Unified Software Platform
- IP Integrator for system-level design
- Hardware debugging tools
Evaluation Platforms:
- Kintex UltraScale+ FPGA development boards
- FMC (FPGA Mezzanine Card) modules
- Reference design platforms
Support Resources:
- AMD Xilinx technical support
- Community forums and knowledge base
- Training courses and certification programs
- Third-party IP and design services
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free)
- REACH regulation compliant
- Conflict minerals reporting template available
- Halogen-free package options
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Various (check specific lot)
Quality Standards:
- ISO 9001:2015 certified manufacturing
- Automotive grade options available (contact for AEC-Q100 qualified versions)
- Military and aerospace grade screening available
Environmental Operating Conditions:
- Storage temperature: -65ยฐC to +150ยฐC
- Relative humidity: 5% to 95% non-condensing
- Altitude: Up to 3,000 meters
The XCKU3P-L2FFVB676E represents the pinnacle of FPGA technology, offering designers the flexibility and performance needed for next-generation applications while maintaining strict compliance with international environmental and export regulations.
For technical support, additional documentation, or to request samples of the XCKU3P-L2FFVB676E, contact your local AMD Xilinx representative or authorized distributor.
