The XCKU3P-L2FFVA676E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in communications, aerospace, defense, and industrial markets.
Product Specifications
The XCKU3P-L2FFVA676E features advanced 20nm FinFET+ technology, providing an optimal balance of performance, power efficiency, and cost-effectiveness. This FPGA incorporates approximately 356,160 logic cells with 1,824 DSP slices for high-speed signal processing applications.
Key specifications include 19.1 Mb of block RAM, supporting complex data buffering and processing requirements. The device operates with a -2L speed grade, ensuring reliable performance across extended temperature ranges while maintaining low power consumption characteristics essential for battery-powered and thermally constrained applications.
The FFVA676 package provides 676 pins in a fine-pitch BGA format, offering extensive I/O capabilities with support for multiple high-speed serial standards including PCIe Gen3, 10G Ethernet, and other industry-standard interfaces. This configuration makes the XCKU3P-L2FFVA676E ideal for applications requiring high-bandwidth connectivity and real-time processing.
Price Information
Pricing for the XCKU3P-L2FFVA676E varies based on order quantity, lead times, and distribution channels. Contact authorized AMD Xilinx distributors for current pricing and availability information. Volume discounts are typically available for production quantities, with evaluation samples offered for qualifying design projects.
Documents & Media
Comprehensive technical documentation supports the XCKU3P-L2FFVA676E implementation process. The complete datasheet provides detailed electrical characteristics, timing specifications, and package information. Reference designs and application notes demonstrate best practices for power management, thermal considerations, and high-speed design techniques.
AMD Xilinx provides extensive software support through the Vivado Design Suite, including synthesis, implementation, and debugging tools specifically optimized for Kintex UltraScale+ devices. Development boards and evaluation kits accelerate prototyping and validation phases.
Related Resources
The XCKU3P-L2FFVA676E integrates seamlessly with AMD Xilinx’s comprehensive ecosystem of IP cores, including soft-core processors, memory controllers, and communication interfaces. The Kintex UltraScale+ family offers scalable solutions ranging from smaller devices to higher-capacity options, enabling design flexibility across different performance requirements.
Compatible development tools include the Vitis unified software platform for embedded software development and the PetaLinux tools for Linux-based applications. Third-party solutions and partner ecosystem support extend the functionality of XCKU3P-L2FFVA676E implementations.
Environmental & Export Classifications
The XCKU3P-L2FFVA676E complies with RoHS environmental standards and meets automotive-grade reliability requirements where applicable. The device operates across commercial and extended temperature ranges, supporting deployment in challenging environmental conditions.
Export classification follows standard semiconductor trade regulations. The XCKU3P-L2FFVA676E falls under standard commercial export categories, though specific applications may require additional compliance verification depending on end-use requirements and destination countries.
Quality certifications include ISO 9001 manufacturing standards, with optional screening available for high-reliability applications in aerospace and defense markets. The device supports various quality and reliability testing standards to meet application-specific requirements.
The XCKU3P-L2FFVA676E represents AMD Xilinx’s commitment to delivering high-performance FPGA solutions that enable innovation across diverse markets and applications.
