The XCKU3P-L1FFVD900I is a cutting-edge Field-Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and industrial automation.
Product Specifications
The XCKU3P-L1FFVD900I features advanced 20nm process technology that provides optimal power efficiency and performance. This FPGA includes 356,160 logic cells and 1,404 Digital Signal Processing (DSP) slices, making it ideal for high-throughput signal processing applications. The device offers 27 Mb of block RAM and supports DDR4-2400 memory interfaces for high-bandwidth data processing.
Key specifications of the XCKU3P-L1FFVD900I include 24 transceivers capable of speeds up to 32.75 Gbps, enabling high-speed serial connectivity. The FPGA operates across an industrial temperature range from -40ยฐC to +100ยฐC, ensuring reliable performance in harsh environments. The FFVD900 package provides 900 pins in a flip-chip fine-pitch BGA format, offering excellent thermal characteristics and signal integrity.
Price
Pricing for the XCKU3P-L1FFVD900I varies based on quantity and distributor. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities, with lead times varying based on market conditions and demand.
Documents & Media
Technical documentation for the XCKU3P-L1FFVD900I includes comprehensive datasheets detailing electrical specifications, timing characteristics, and package information. The Kintex UltraScale+ FPGA User Guide provides detailed implementation guidance, while application notes offer specific design examples and optimization techniques.
Development resources include reference designs, IP cores, and software tools through AMD Xilinx Vivado Design Suite. Product briefs and selection guides help engineers choose the optimal FPGA variant for their specific application requirements. All documentation is available through the AMD Xilinx support portal.
Related Resources
The XCKU3P-L1FFVD900I integrates seamlessly with AMD Xilinx development tools and IP portfolio. Vivado Design Suite provides comprehensive design flow support from synthesis through implementation. The device is compatible with various evaluation boards and development kits for rapid prototyping.
Related products in the Kintex UltraScale+ family offer different performance points and package options to meet diverse application needs. System-level solutions include reference designs for common applications such as wireless infrastructure, video processing, and high-performance computing acceleration.
Environmental & Export Classifications
The XCKU3P-L1FFVD900I complies with RoHS directive requirements and meets automotive qualification standards where applicable. The device is manufactured using lead-free processes and packaging materials that support environmental sustainability initiatives.
Export classification information varies by destination and application. Customers should consult current export control regulations and work with AMD Xilinx or authorized distributors to ensure compliance with applicable trade regulations. The XCKU3P-L1FFVD900I may be subject to export licensing requirements depending on the end-use application and destination country.
The XCKU3P-L1FFVD900I represents the pinnacle of FPGA technology, combining high performance, power efficiency, and reliability for the most demanding applications. Contact your local AMD Xilinx representative or authorized distributor for detailed technical support and pricing information.
