The XCKU3P-3FFVD900E is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and industrial sectors.
Product Specifications
The XCKU3P-3FFVD900E features advanced 16nm FinFET+ technology, providing optimal power efficiency and performance characteristics. This FPGA incorporates 356,160 logic cells with 1,728 DSP slices for high-speed signal processing applications. The device includes 19.1 Mb of block RAM and 960 user I/O pins, offering extensive connectivity options.
Key specifications include a -3 speed grade for maximum performance, operating across commercial and extended temperature ranges. The XCKU3P-3FFVD900E supports PCIe Gen3 x16 interfaces and features integrated 100G Ethernet MAC for high-bandwidth networking applications. Memory interfaces include DDR4-2666 support with built-in error correction capabilities.
The FFVD900 package provides a compact 31mm x 31mm form factor with 0.8mm ball pitch, optimizing board space utilization while maintaining excellent thermal characteristics. Power consumption is optimized through advanced clock gating and dynamic voltage scaling technologies.
Price
The XCKU3P-3FFVD900E is competitively priced within the premium FPGA market segment. Pricing varies based on volume commitments, with standard list pricing available through authorized distributors. Contact your regional Xilinx representative for current pricing information and volume discount schedules. Educational and research institutions may qualify for special academic pricing programs.
Documents & Media
Comprehensive technical documentation supports the XCKU3P-3FFVD900E implementation process. The complete datasheet provides detailed electrical specifications, timing parameters, and package information. Product selection guides help engineers choose optimal configurations for specific applications.
Design tools include Vivado Design Suite compatibility with full IP core integration support. Reference designs demonstrate best practices for common implementation scenarios. Application notes cover power management, high-speed design considerations, and thermal management strategies.
Video tutorials and webinar recordings provide step-by-step guidance for new users. Technical support forums offer community-driven problem-solving resources alongside official Xilinx support channels.
Related Resources
The XCKU3P-3FFVD900E integrates seamlessly with Xilinx’s broader ecosystem of development tools and IP cores. Compatible evaluation boards accelerate prototype development and proof-of-concept validation. Software development kits support embedded processor implementations within the FPGA fabric.
IP portfolio includes verified cores for common functions like memory controllers, communication protocols, and digital signal processing algorithms. Third-party IP partnerships expand available functionality for specialized applications.
Training resources include hands-on workshops, online courses, and certification programs to build team expertise. Regional field application engineers provide personalized technical guidance throughout the design process.
Environmental & Export Classifications
The XCKU3P-3FFVD900E meets stringent environmental compliance standards including RoHS directive compliance for lead-free manufacturing processes. The device operates reliably across extended temperature ranges from -40ยฐC to +100ยฐC junction temperature.
Export classification follows current ECCN regulations with appropriate licensing requirements for international shipments. The device qualifies for commercial and industrial applications with optional screening available for enhanced reliability requirements.
Environmental stress testing includes thermal cycling, humidity exposure, and mechanical shock resistance validation. Package materials utilize halogen-free compounds supporting green manufacturing initiatives.
Quality certifications include ISO 9001 manufacturing standards with comprehensive traceability throughout the supply chain. Reliability testing demonstrates superior long-term performance characteristics under accelerated aging conditions.
The XCKU3P-3FFVD900E represents the pinnacle of FPGA technology, combining performance, efficiency, and reliability for next-generation electronic systems requiring programmable logic solutions.
