The XCKU3P-2SFVB784I is a premium Field Programmable Gate Array (FPGA) from Xilinx’s renowned Kintex UltraScale+ family, engineered for demanding applications requiring exceptional performance and power efficiency. This industrial-grade FPGA delivers the optimal balance between high-performance peripherals and cost-effective system implementation, making it ideal for next-generation digital signal processing, networking, and communication systems.
Product Specifications
Core Technical Specifications
- Part Number: XCKU3P-2SFVB784I
- Manufacturer: AMD Xilinx
- Product Family: Kintex UltraScale+ FPGAs
- Logic Elements/Cells: 355,950 logic cells
- Package Type: 784-Pin FCBGA (Flip Chip Ball Grid Array)
- Technology Node: 20nm TSMC Process Technology
- Speed Grade: -2 (Industrial grade)
- Temperature Range: -40ยฐC to +100ยฐC (TJ) Industrial (I) grade
Power and Voltage Specifications
- Core Voltage (VCCINT): 0.825V to 0.876V
- Supply Voltage: 0.85V standard operation
- Low Power Options: Available with -2LE designation for reduced static power consumption
- Power Efficiency: Advanced power management with multiple voltage domains
I/O and Connectivity
- User I/O Pins: 304 high-performance I/O pins
- Package: 784-FCBGA surface mount configuration
- Mounting Type: Surface Mount Technology (SMT)
- Pin Count: 784 total pins in flip-chip ball grid array
Memory and Processing Features
- On-Chip UltraRAM: Integrated high-density memory blocks
- DSP Capability: Advanced DSP slices for signal processing applications
- Clock Management: Multiple phase-locked loops (PLLs) and clock management tiles
- High-Speed Transceivers: Built-in gigabit transceivers for high-speed communication
Price Information
The XCKU3P-2SFVB784I pricing varies based on quantity, supplier, and market conditions. Current market intelligence indicates:
- Pricing: Contact authorized distributors for real-time quotes
- Lead Time: Approximately 25 weeks from manufacturer
- Availability: Active product status with ongoing production
- Volume Discounts: Available for bulk orders through authorized channels
- Market Monitoring: Real-time price tracking available through electronic component distributors
Request Quote: Contact authorized Xilinx distributors including Avaq, FPGAkey, EBICS, and Microchip USA for competitive pricing and availability updates.
Documents & Media
Official Documentation
- Datasheet: Complete technical specifications and electrical characteristics
- User Guide: Comprehensive implementation and design guidelines
- Programming Guide: Software development and configuration instructions
- Application Notes: Design examples and best practices
- Errata Documents: Known issues and workarounds
Design Resources
- Pinout Information: Complete pin assignment and ball map documentation
- Package Drawings: Mechanical specifications and land pattern guidelines
- Thermal Characteristics: Junction temperature and thermal resistance data
- Power Estimation Tools: Xilinx Power Estimator (XPE) compatibility
- CAD Models: Free downloadable models for PCB design
Software & Tools
- Vivado Design Suite: Primary development environment for XCKU3P-2SFVB784I
- SDK Integration: Software development kit compatibility
- IP Catalog: Extensive library of pre-verified IP cores
- Simulation Models: Behavioral and timing simulation support
Related Resources
Development Platforms
- Evaluation Boards: Kintex UltraScale+ FPGA evaluation kits
- Development Boards: Third-party development platforms supporting XCKU3P
- Starter Kits: Entry-level development solutions for rapid prototyping
- Reference Designs: Pre-built designs for common applications
Technical Support
- Design Services: Professional design assistance and consultation
- Training Resources: Online courses and documentation for FPGA development
- Community Forums: Active user community and technical discussions
- Application Engineering: Direct access to Xilinx technical experts
Compatible Products
- Alternative Speed Grades: XCKU3P-1SFVB784I, XCKU3P-3SFVB784I variants
- Package Alternatives: Different package options within XCKU3P family
- Temperature Variants: Extended and military temperature grade options
- Related ICs: Complementary Xilinx products for system integration
Application Areas
- Wireless Communications: 5G infrastructure and MIMO technology
- Networking Equipment: High-speed packet processing and routing
- Data Centers: Acceleration cards and compute offload applications
- Test & Measurement: High-performance instrumentation and analysis
- Aerospace & Defense: Mission-critical and high-reliability systems
Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant – Restriction of Hazardous Substances Directive compliant
- REACH Compliance: No SVHC (Substances of Very High Concern) as of January 15, 2019
- Conflict Minerals: Compliant with conflict minerals reporting requirements
- Green Product: Meets environmental sustainability standards
- Lead-Free: Manufactured using lead-free processes and materials
Export Control Classifications
- ECCN: 3A991.d (Export Control Classification Number)
- HTS Code: 8542390001 (Harmonized Tariff Schedule)
- TARIC: 8542399000 (EU trade classification)
- Country of Origin: Varies based on manufacturing location
- License Requirements: May require export license depending on destination country
Quality & Standards
- Quality Grade: Industrial temperature range qualification
- Reliability Testing: Extensive qualification and reliability testing
- ESD Protection: Electrostatic discharge protection packaging
- MSL Rating: Moisture Sensitivity Level classification for handling
- Traceability: Full manufacturing traceability and lot tracking
Packaging & Handling
- Packaging Type: Bulk packaging in anti-static trays
- Storage Requirements: Controlled temperature and humidity storage
- Handling Precautions: ESD-sensitive device requiring proper handling procedures
- Shelf Life: Extended shelf life under proper storage conditions
- Warranty: Standard manufacturer warranty coverage
The XCKU3P-2SFVB784I represents the pinnacle of FPGA technology, combining exceptional performance, power efficiency, and flexibility for next-generation applications. Contact authorized distributors for detailed pricing, availability, and technical support.
