The XCKU3P-2SFVB784E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s acclaimed Kintex UltraScale+ family. This advanced semiconductor device delivers exceptional processing capabilities with optimal power efficiency, making it ideal for demanding applications in telecommunications, data centers, industrial automation, and high-performance computing.
Product Specifications
Core Technical Specifications
- Part Number: XCKU3P-2SFVB784E
- Manufacturer: AMD (formerly Xilinx)
- Product Family: Kintex UltraScale+
- Speed Grade: -2 (High Performance)
- Temperature Grade: E (Extended: 0ยฐC to 100ยฐC TJ)
Logic Resources
- Logic Elements/Cells: 355,950
- Number of LABs/CLBs: 20,340
- Total RAM Bits: 31,641,600
- UltraRAM: On-chip memory for reduced BOM cost
- Number of I/O: 304
Physical Characteristics
- Package Type: 784-FCBGA (Flip Chip Ball Grid Array)
- Package Size: 23mm x 23mm
- Pin Count: 784 pins
- Mounting Type: Surface Mount
- Weight: Lightweight design for compact applications
Power Specifications
- Supply Voltage (VCCINT): 0.825V ~ 0.876V
- Operating Temperature: 0ยฐC ~ 100ยฐC (TJ)
- Power Optimization: Multiple power options for optimal performance/power balance
Advanced Features
- Architecture: 20nm FinFET technology
- MicroBlaze Processor: Soft processor running over 200 DMIPs
- DDR3 Support: 800Mb/s DDR3 memory interface
- Signal Processing: Highest signal processing bandwidth in mid-range devices
- Next-Generation Transceivers: Advanced high-speed connectivity
Price Information
The XCKU3P-2SFVB784E pricing varies based on quantity, supplier, and current market conditions. Key pricing considerations include:
- Lead Time: Typically 25-52 weeks from major distributors
- Product Status: Active production
- Packaging: Bulk packaging standard
- Minimum Order Quantities: Vary by distributor
- Volume Pricing: Available for large quantity orders
Contact authorized distributors for current pricing and availability. Major suppliers include Mouser Electronics, DigiKey, Avnet, and other authorized AMD distribution partners.
Documents & Media
Technical Documentation
- Primary Datasheet: Kintex UltraScale+ FPGAs Data Sheet (DS922)
- Architecture Overview: UltraScale Architecture Product Overview
- Programming Guide: Vivado Design Suite User Guides
- Application Notes: Various application-specific documentation
Development Resources
- CAD Models: Free 3D CAD models available for download
- Reference Designs: Multiple reference implementations
- Evaluation Boards: Compatible development platforms available
- Software Tools: Vivado Design Suite (primary development environment)
Media Resources
- Product Images: High-resolution package photos
- Block Diagrams: Detailed architecture illustrations
- Performance Charts: Benchmark and comparison data
- Video Resources: Technical presentation videos
Related Resources
Development Tools
- Vivado Design Suite: Primary FPGA development environment
- Vitis Unified Software Platform: Application development framework
- IP Catalog: Extensive library of pre-verified IP cores
- LabVIEW FPGA Module: Graphical FPGA programming interface
Compatible Products
- XCKU3P Variants: Other speed grades and package options
- Memory Interfaces: DDR4, DDR3, LPDDR4 controllers
- Connectivity IP: PCIe, Ethernet, USB, and other protocol stacks
- Development Boards: Various evaluation and development platforms
Application Areas
- 5G Wireless Infrastructure: Base station and small cell applications
- Data Center Acceleration: Machine learning and AI inference
- Industrial Automation: Real-time control and processing
- Aerospace & Defense: Mission-critical computing systems
- Test & Measurement: High-speed signal processing
Support Resources
- AMD Support Portal: Technical documentation and forums
- Training Programs: FPGA design methodology courses
- Application Engineering: Direct technical support
- Community Forums: Peer-to-peer technical discussions
Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant
- REACH Compliance: EU REACH regulation compliant
- Halogen-Free: Meets halogen-free requirements
- Moisture Sensitivity Level (MSL): Level 4 (72 Hours)
- SVHC: No Substances of Very High Concern (as of Jan 15, 2019)
Export Control Classifications
- ECCN: 3A991.d (Export Administration Regulations)
- HTSUS: 8542.39.0001 (Harmonized Tariff Schedule)
- TARIC: 8542399000 (EU trade classification)
- Country of Origin: Varies by manufacturing location
Quality Standards
- ISO Compliance: Manufactured under ISO quality standards
- Automotive Grade: Industrial grade suitable for harsh environments
- Quality Assurance: Comprehensive testing and validation
- Traceability: Full supply chain traceability available
Packaging & Handling
- ESD Protection: Requires proper electrostatic discharge precautions
- Storage: Controlled temperature and humidity storage required
- Handling: Professional handling procedures recommended
- Shipping: Anti-static packaging for component protection
Why Choose XCKU3P-2SFVB784E?
The XCKU3P-2SFVB784E represents the pinnacle of mid-range FPGA technology, offering the perfect balance of performance, power efficiency, and cost-effectiveness. With its advanced 20nm FinFET architecture and comprehensive feature set, this device enables rapid innovation across diverse application domains.
Whether you’re developing next-generation 5G infrastructure, accelerating machine learning workloads, or implementing real-time signal processing solutions, the XCKU3P-2SFVB784E provides the computational horsepower and flexibility needed to bring your most ambitious projects to life.
Contact your preferred authorized distributor today to discuss your specific requirements and obtain detailed pricing for the XCKU3P-2SFVB784E.
