The XCKU3P-2FFVD900I represents AMD Xilinx’s advanced Field-Programmable Gate Array (FPGA) technology, designed for demanding applications requiring exceptional processing power and flexibility. This Kintex UltraScale+ series device delivers optimal performance for mid-range applications across telecommunications, aerospace, defense, and industrial automation sectors.
Product Specifications
The XCKU3P-2FFVD900I features a robust architecture built on advanced 16nm FinFET+ technology, providing superior power efficiency and performance capabilities.
Core Architecture:
- Logic Cells: 356,160 system logic cells
- CLB Flip-Flops: 548,160 flip-flops
- CLB LUTs: 274,080 6-input lookup tables
- Block RAM: 17.6 Mb total block RAM
- UltraRAM: 45 Mb integrated UltraRAM blocks
- DSP Slices: 1,968 DSP48E2 slices for signal processing
Memory and Connectivity:
- PCIe Gen3 x16 or Gen4 x8 support
- 100G Ethernet MAC capability
- High-speed serial transceivers: 16 GTY transceivers
- Maximum transceiver speed: 32.75 Gb/s
- DDR4-2666 memory interface support
Package Details:
- Package Type: FFVD900 (Fine Pitch Ball Grid Array)
- Pin Count: 900 pins
- Package Size: 31mm x 31mm
- Operating Temperature: Industrial grade (-40°C to +100°C)
- Speed Grade: -2 (high performance)
Pricing Information
The XCKU3P-2FFVD900I is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities and industrial-grade specifications. Contact authorized distributors for current pricing, volume discounts, and availability. Pricing varies based on:
- Order quantity and volume commitments
- Lead times and delivery requirements
- Additional support and development tools
- Regional market conditions
For accurate pricing quotes, consult with AMD Xilinx authorized partners or distributors who can provide real-time pricing and stock availability information.
Documents & Media
Comprehensive technical documentation supports the XCKU3P-2FFVD900I implementation and development process:
Technical Documentation:
- Complete datasheet with electrical characteristics
- Pin-out and package specifications
- Power consumption guidelines and thermal management
- Programming and configuration user guides
- PCB design recommendations and layout guidelines
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Timing and constraint file templates
- IP core integration guides
Support Materials:
- Errata documents and known issue updates
- Migration guides from previous FPGA families
- Evaluation board schematics and documentation
- Video tutorials and webinar recordings
Access these resources through the official AMD Xilinx documentation portal or authorized distributor technical libraries.
Related Resources
The XCKU3P-2FFVD900I ecosystem includes comprehensive development tools and supporting components:
Development Platforms:
- Compatible evaluation and development boards
- Third-party carrier cards and modules
- Reference design platforms for rapid prototyping
Software Tools:
- Vivado Design Suite (latest version recommended)
- High-Level Synthesis (HLS) tools
- Software Development Kit (SDK) support
- IP catalog and core generators
Compatible Components:
- Power management solutions optimized for Kintex UltraScale+
- Clock generation and distribution circuits
- Memory modules and interfaces
- High-speed connector solutions
Training and Support:
- Online training courses and certification programs
- Technical support forums and community resources
- Application engineering consultation services
- Regional technical support contacts
Environmental & Export Classifications
The XCKU3P-2FFVD900I meets stringent environmental and regulatory standards for global deployment:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting template available
- ISO 14001 environmental management certification
Quality Standards:
- Automotive qualification available (select variants)
- Industrial temperature range operation
- Extended reliability testing and validation
- Quality management system ISO 9001 certified
Export Classifications:
- Export Control Classification Number (ECCN) applicable
- Designed for commercial and industrial applications
- Compliance with international trade regulations
- Regional import/export documentation available
Reliability Specifications:
- Mean Time Between Failures (MTBF) data available
- Accelerated life testing results documented
- Operating lifetime projections and warranty information
- Failure analysis and quality assurance procedures
The XCKU3P-2FFVD900I delivers exceptional performance and reliability for critical applications requiring advanced FPGA capabilities, making it an ideal choice for next-generation system designs across multiple industries.
