The XCKU3P-2FFVD900E is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered to deliver exceptional performance, power efficiency, and versatility for demanding applications. This FPGA combines advanced 20nm FinFET technology with superior connectivity and processing capabilities, making it ideal for a wide range of applications from wireless communications to data center infrastructure.
1. Product Specifications
Core Specifications
- FPGA Family: Kintex UltraScale+
- Part Number: XCKU3P-2FFVD900E
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Logic Cells: 355,950 system logic cells
- Speed Grade: -2 (high performance)
- Temperature Grade: E (Extended: 0ยฐC to +100ยฐC)
Memory and Logic Resources
- Logic Blocks: 162,720 CLBs (Configurable Logic Blocks)
- Total RAM: 13.005 Mb (13,005 Kbit) on-chip memory
- UltraRAM: Advanced on-chip memory for reduced BOM cost
- Registers: 325,440 flip-flops
- DSP Slices: Optimized for signal processing applications
Package and I/O Characteristics
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 900 pins
- I/O Count: 304 user I/O pins
- Package Size: Fine-pitch BGA for space-efficient designs
- RoHS Compliant: Yes
Electrical Specifications
- Core Voltage (VCCINT): 0.85V nominal
- I/O Supply Voltage: 3.3V
- Core Voltage Range: 825mV to 876mV
- Process Technology: 20nm FinFET node
- Maximum Operating Frequency: Up to 667 MHz
- Power Optimization: Multiple power options for optimal performance/power balance
Clock Management
- MMCM (Mixed-Mode Clock Manager): Advanced clock generation and management
- PLL (Phase-Locked Loop): Precision clock synthesis
- Clock Networks: High-performance global and regional clock distribution
Connectivity Features
- High-Speed Transceivers: Support for 100G connectivity cores
- Memory Interface: High-performance memory controller support
- Ethernet Connectivity: Advanced networking capabilities
- PCIe Support: High-speed peripheral interface
2. Price Information
Current market pricing for the XCKU3P-2FFVD900E varies by supplier and quantity:
- Unit Price: $619.27 per piece (Components-Store.com)
- Availability: 55 pieces in stock at select distributors
- Pricing Structure: Volume discounts available for bulk orders
- Quote Requests: RFQ (Request for Quote) available for larger quantities
Note: Prices are subject to market fluctuations and availability. Contact authorized distributors for current pricing and lead times.
3. Documents & Media
Official Documentation
- Product Datasheet: Comprehensive technical specifications and electrical characteristics
- Package Files: ASCII pinout files in TXT and CSV formats available from AMD Xilinx
- User Guides: UG575 reference documentation for package file formats
- Application Notes: Design implementation guidelines and best practices
Design Resources
- Vivado Design Suite: Primary development environment for XCKU3P series
- Development Tools: Vivado Design Suite is user-friendly in synthesis and implementation
- ECAD Models: Electronic CAD models available for PCB design
- Reference Designs: Example implementations and starter projects
Technical Support
- Product Change Notifications: Available through manufacturer channels
- Environmental Documents: Compliance and regulatory information
- Pinout Information: Detailed pin assignment and package data
4. Related Resources
Development Platforms
- Evaluation Boards: Kintex UltraScale+ development and evaluation platforms
- Starter Kits: Complete development solutions for rapid prototyping
- Reference Designs: Pre-verified IP cores and system implementations
Compatible Products
- XCKU3P Series Variants:
- XCKU3P-1FFVD900E (Speed grade -1)
- XCKU3P-2FFVD900I (Industrial temperature range)
- XCKU3P-2SFVB784E (Alternative package option)
Software Tools
- Vivado Design Suite: Complete FPGA design flow from synthesis to implementation
- Vivado HLS: High-level synthesis for C/C++ to RTL conversion
- SDK/Vitis: Software development kit for embedded applications
- IP Catalog: Extensive library of verified IP cores
Application Areas
- Wireless Communications: MIMO technology and advanced signal processing
- Data Centers: High-performance computing and acceleration
- Networking: 100G and beyond connectivity solutions
- Industrial Automation: Real-time control and processing systems
- Aerospace & Defense: Mission-critical applications requiring high reliability
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Fully compliant with Restriction of Hazardous Substances directive
- MSL (Moisture Sensitivity Level): MSL 4 – 72 hours floor life after opening
- Operating Temperature: Extended range (0ยฐC to +100ยฐC)
- Storage Temperature: Specified for long-term storage and handling
Export Classifications
- USHTS Code: 8542390001
- CNHTS Code: 8542399000
- TARIC Code: 8542399000
- ECCN (Export Control Classification Number): 3A991.d
- Export Restrictions: Subject to applicable export control regulations
Packaging and Handling
- Tray Packaging: Standard tray packaging for automated assembly
- Anti-Static Protection: ESD-sensitive device requiring proper handling
- Lead-Free: Compatible with lead-free soldering processes
- Shelf Life: Extended shelf life with proper storage conditions
Key Features Summary
The XCKU3P-2FFVD900E delivers optimal price/performance/watt balance in a FinFET node, making it the ideal choice for applications requiring high-end capabilities including transceiver and memory interface line rates, 100G connectivity cores, and advanced signal processing. Its combination of high logic density, extensive I/O capabilities, and power-efficient design makes it suitable for both packet processing and DSP-intensive functions across diverse application domains.
Target Applications: Wireless MIMO technology, Nx100G networking, data center acceleration, industrial control systems, and high-performance computing solutions.
