The XCKU3P-1SFVB784I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ series, designed to deliver exceptional performance for demanding applications in communications, aerospace, defense, and industrial sectors.
Product Specifications
The XCKU3P-1SFVB784I features robust technical specifications that make it ideal for high-performance computing applications:
Core Architecture:
- Logic Cells: 356,160 logic cells providing extensive programmable logic capacity
- CLB Flip-Flops: 712,320 configurable logic block flip-flops
- LUTs: 178,080 Look-Up Tables for flexible logic implementation
- Block RAM: 27 Mb total block RAM for efficient data storage
- UltraRAM: 180 Mb UltraRAM for high-density memory applications
Processing Power:
- DSP Slices: 2,760 DSP48E2 slices for high-speed signal processing
- Speed Grade: -1 speed grade optimizing power and performance balance
- Operating Voltage: 0.85V core voltage for enhanced power efficiency
Package Details:
- Package Type: SFVB784 – Fine-pitch Ball Grid Array
- Pin Count: 784 pins providing extensive I/O connectivity
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- Package Size: Compact form factor suitable for space-constrained designs
Connectivity Features:
- Gigabit Transceivers: High-speed serial connectivity options
- PCIe Support: Integrated PCIe blocks for system connectivity
- Memory Controllers: DDR4/DDR3 memory interface support
- I/O Standards: Support for multiple voltage and signaling standards
Price Information
The XCKU3P-1SFVB784I is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities. Contact authorized distributors for current pricing and volume discounts. Pricing varies based on:
- Order quantities and volume commitments
- Regional market conditions
- Current market availability
- Extended warranty and support options
- Development kit bundles and evaluation packages
Documents & Media
Comprehensive technical documentation supports the XCKU3P-1SFVB784I implementation:
Technical Documentation:
- Complete datasheet with electrical specifications
- Pin-out diagrams and package drawings
- Power consumption guidelines and thermal analysis
- PCB design recommendations and layout guidelines
- Migration guides from previous FPGA generations
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- IP core integration guides
- Timing constraint examples
- Power estimation spreadsheets
Quality and Reliability:
- Quality and reliability reports
- Device characterization data
- Environmental stress testing results
- Long-term reliability projections
Related Resources
The XCKU3P-1SFVB784I ecosystem includes extensive development and support resources:
Development Tools:
- Vivado Design Suite for synthesis and implementation
- Vitis unified software platform for embedded development
- ChipScope Pro for real-time debugging
- Power Design Manager for power optimization
- Clock Wizard and other IP configurators
Evaluation Platforms:
- Compatible evaluation boards and development kits
- Reference design demonstrations
- Online training modules and tutorials
- Community forums and technical support
Companion Devices:
- Compatible power management solutions
- Clock generation and distribution devices
- High-speed connector and cable assemblies
- Thermal management solutions
Application Areas:
- 5G wireless infrastructure and base stations
- Aerospace and defense radar systems
- High-performance computing acceleration
- Machine learning and AI inference
- Video processing and broadcast equipment
Environmental & Export Classifications
The XCKU3P-1SFVB784I meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant construction with lead-free materials
- REACH regulation compliance for European markets
- Halogen-free package options available
- Conflict minerals reporting compliance
Operating Environment:
- Industrial temperature range operation (-40ยฐC to +100ยฐC)
- Humidity resistance per JEDEC standards
- Vibration and shock resistance certification
- Extended operating lifetime ratings
Export Classifications:
- Export Control Classification Number (ECCN) designation
- Country-specific export licensing requirements
- International Traffic in Arms Regulations (ITAR) status
- Encryption capability classifications where applicable
Quality Standards:
- ISO 9001 manufacturing quality certification
- Automotive qualification standards support
- Military and aerospace grade options
- Statistical quality control and testing protocols
The XCKU3P-1SFVB784I represents the pinnacle of FPGA technology, combining high performance, flexibility, and reliability in a single device. Its comprehensive feature set makes it the ideal choice for next-generation applications requiring exceptional processing capabilities and system integration flexibility.
