The XCKU3P-1SFVB784E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in communications, aerospace, defense, and industrial markets.
Product Specification
The XCKU3P-1SFVB784E features advanced 20nm FinFET+ technology, providing superior power efficiency and performance optimization. This FPGA incorporates 216,960 logic cells and 1,728 DSP48E2 slices, making it ideal for high-throughput digital signal processing applications.
Key specifications of the XCKU3P-1SFVB784E include:
- Logic Cells: 216,960 system logic cells
- Block RAM: 19.1 Mb total block RAM
- UltraRAM: 36 Mb UltraRAM capacity
- DSP Slices: 1,728 DSP48E2 slices
- Package: SFVB784 (23mm x 23mm)
- Speed Grade: -1 (standard performance)
- I/O Pins: 520 user I/O pins
- Operating Voltage: 0.85V core, 1.8V auxiliary
- Temperature Range: 0ยฐC to +85ยฐC (commercial grade)
The XCKU3P-1SFVB784E supports high-speed serial connectivity with up to 20 GTH transceivers operating at speeds up to 16.3 Gbps, enabling robust communication interfaces for modern system designs.
Price
Pricing for the XCKU3P-1SFVB784E varies based on quantity, distribution channel, and market conditions. Contact authorized Xilinx distributors for current pricing information and volume discounts. Educational institutions and qualifying organizations may be eligible for special pricing programs.
Documents & Media
Comprehensive technical documentation supports the XCKU3P-1SFVB784E development process:
Technical Documentation:
- Product Brief and Datasheet
- Packaging and Pinout Specifications
- Power and Thermal Design Guidelines
- PCB Design and Layout Guidelines
- Configuration User Guide
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Evaluation board documentation
- Programming and debugging guides
Software Tools:
- Vivado Design Suite support
- Vitis unified software platform compatibility
- IP core library access
- Simulation and verification tools
Related Resources
The XCKU3P-1SFVB784E ecosystem includes extensive development support and complementary products:
Development Boards:
- KCU105 Evaluation Kit (compatible family member)
- Custom carrier boards from third-party vendors
- FMC (FPGA Mezzanine Card) expansion options
IP Cores:
- High-speed communication interfaces
- Digital signal processing functions
- Memory controllers and interfaces
- Video and image processing cores
Design Services:
- Xilinx Alliance Program partners
- Training and certification programs
- Technical support and consulting services
- Community forums and user groups
Environmental & Export Classifications
The XCKU3P-1SFVB784E meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance
- Lead-free packaging and assembly
- Halogen-free materials where applicable
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive AEC-Q100 qualification available
- Military and aerospace screening options
- Extended temperature variants available
Export Classifications:
- Export Control Classification Number (ECCN) varies by configuration
- Compliance with International Traffic in Arms Regulations (ITAR)
- Dual-use technology considerations apply
- Consult export control documentation for specific requirements
Reliability Testing:
- Accelerated life testing
- Thermal cycling validation
- Humidity and corrosion resistance testing
- Electrostatic discharge (ESD) protection verification
The XCKU3P-1SFVB784E represents AMD Xilinx’s commitment to delivering high-performance, reliable FPGA solutions for next-generation system designs across multiple industries and applications.
