The XCKU3P-1FFVB676I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in networking, signal processing, and data center operations. This industrial-grade FPGA combines high-performance peripherals with cost-effective system implementation, making it the ideal choice for engineers requiring optimal balance between performance and power efficiency.
1. Product Specifications
Core Architecture
- Device Family: Kintex UltraScale+ FPGA
- Part Number: XCKU3P-1FFVB676I
- Process Technology: 20nm FinFET
- Speed Grade: -1 (Industrial temperature range)
- Core Voltage: 0.85V
Logic Resources
- Logic Blocks: 162,720 configurable logic blocks (CLBs)
- System Logic Cells: 355,950 macrocells
- Look-Up Tables (LUTs): 213,600 6-input LUTs
- Flip-Flops: 427,200 flip-flops
- Block RAM: 12,700 Kbit on-chip memory
- UltraRAM: On-chip UltraRAM memory for reduced BOM cost
Package Details
- Package Type: FCBGA-676 (Flip Chip Ball Grid Array)
- Pin Count: 676 pins
- I/O Pins: 280 user I/Os
- Package Size: Compact form factor optimized for space-constrained applications
Performance Features
- GTY Transceivers: High-speed serial transceivers up to 28 Gbps
- DSP Slices: Enhanced DSP48E2 slices for signal processing
- Clock Management: Advanced clocking with UltraScale clock architecture
- Power Options: Multiple power configurations for optimal performance/power balance
Operating Conditions
- Temperature Range: Industrial (-40ยฐC to +85ยฐC)
- Voltage Range: Multiple voltage options including 0.85V and 0.72V operation
- Power Management: Advanced power gating and clock management features
2. Price Information
The XCKU3P-1FFVB676I pricing varies based on quantity and distributor. Key pricing considerations include:
- Volume Discounts: Significant price reductions available for bulk orders
- Market Fluctuations: Prices monitored in real-time across global distributors
- Lead Times: Current availability varies by supplier
- Request for Quote: Contact authorized distributors for current pricing
Authorized Distributors
- DigiKey Electronics
- Mouser Electronics
- Authorized AMD/Xilinx partners worldwide
Note: For current pricing and availability, contact authorized distributors directly as semiconductor prices fluctuate based on market conditions and supply chain factors.
3. Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and performance characteristics
- User Guide: Implementation guidelines and design recommendations
- Package Files: Pinout information in TXT and CSV formats (UG575)
- Reference Designs: Application-specific design examples
Development Resources
- Vivado Design Suite: Primary development environment
- IP Cores: Extensive library of verified IP blocks
- Application Notes: Design guidance for specific use cases
- Evaluation Boards: KCU116 and other development platforms
Design Tools
- Vivado Design Suite: Synthesis, place and route, verification tools
- System Generator: MATLAB/Simulink integration
- SDK: Software development kit for embedded applications
- Debug Tools: Integrated logic analyzer and debugging capabilities
4. Related Resources
Development Platforms
- KCU116 Evaluation Kit: Kintex UltraScale+ evaluation platform
- Third-party Boards: ALINX AXKU3 and ACKU3 development boards
- FMC Modules: FPGA Mezzanine Card compatibility
Application Examples
- 100G Networking: Packet processing and data center applications
- DSP Processing: Signal processing and wireless communications
- Medical Imaging: High-resolution imaging systems
- Wireless Infrastructure: 5G and MIMO applications
Software Ecosystem
- Vivado Design Suite: Complete FPGA design flow
- Vitis: Unified software platform for acceleration
- PetaLinux: Embedded Linux development
- MATLAB/Simulink: High-level design entry
Community Support
- AMD Developer Zone: Technical resources and forums
- Training Courses: Online and in-person FPGA training
- Application Engineers: Technical support specialists
- Partner Network: Certified design service providers
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Restriction of Hazardous Substances directive compliant
- REACH Compliance: European chemical regulation compliance
- Conflict Minerals: Compliance with conflict minerals regulations
- SVHC: No Substances of Very High Concern (as of 15-Jan-2019)
Export Control Classifications
- ECCN Code: 3A991.d (Export Administration Regulations)
- HTS Code: 8542390001 (Harmonized Tariff Schedule)
- Country of Origin: Manufactured in advanced semiconductor facilities
- Export Restrictions: Subject to US export control regulations
Quality Standards
- ISO Certification: Manufactured in ISO-certified facilities
- Automotive: AEC-Q100 qualified versions available for automotive applications
- Industrial Grade: Extended temperature range operation
- Reliability: Comprehensive qualification and reliability testing
Packaging and Handling
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classified
- ESD Protection: Electrostatic discharge handling requirements
- Storage: Proper storage conditions for device integrity
- Lead-Free: RoHS compliant lead-free package construction
Target Applications: The XCKU3P-1FFVB676I excels in cloud computing, 5G wireless infrastructure, artificial intelligence acceleration, medical equipment, industrial control systems, and high-performance networking applications requiring optimal price/performance/watt ratios.
Key Benefits: Enhanced performance with UltraRAM memory integration, reduced system cost through on-chip memory, flexible power options, and comprehensive development tool support make the XCKU3P-1FFVB676I the preferred choice for next-generation FPGA applications.
