The XCKU3P-1FFVB676E is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding digital signal processing, networking, and acceleration applications. This advanced FPGA combines high logic density with energy efficiency, making it ideal for next-generation embedded systems and high-performance computing solutions.
Product Specifications
The XCKU3P-1FFVB676E features robust specifications that meet the requirements of complex digital designs:
Core Architecture:
- Logic Cells: 356,160 logic cells providing extensive programmable logic resources
- CLB Flip-Flops: 712,320 flip-flops for sequential logic implementation
- CLB LUTs: 356,160 lookup tables for combinational logic functions
- Block RAM: 11.6 Mb total block RAM for on-chip memory requirements
- UltraRAM: 22.5 Mb of UltraRAM for large memory applications
DSP and Processing:
- DSP Slices: 1,968 DSP48E2 slices for high-speed arithmetic operations
- Processing System: ARM Cortex-A53 quad-core processor (if applicable to variant)
- Maximum Operating Frequency: Up to 741 MHz for high-speed applications
Package and I/O:
- Package Type: FFVB676 Fine-Pitch Ball Grid Array
- Total I/O Pins: 338 user I/O pins
- High-Performance I/O: Support for various I/O standards including LVDS, TMDS
- Speed Grade: -1 (standard performance grade)
Price Information
The XCKU3P-1FFVB676E pricing varies based on quantity, distributor, and current market conditions. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume discounts are typically available for large quantity orders. Lead times may vary depending on global semiconductor supply chain conditions.
Documents & Media
Technical Documentation:
- Product Data Sheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation and design guidelines
- Package and Pinout Information: Detailed pin assignments and package drawings
- Errata Documents: Known issues and workarounds
- Application Notes: Design best practices and implementation examples
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and IP cores
- Evaluation board documentation (if applicable)
- Power estimation and thermal management guides
Related Resources
Development Tools:
- AMD Vivado Design Suite for FPGA design and implementation
- Vitis Unified Software Platform for acceleration development
- Hardware Debug Tools for system verification
- IP Catalog with pre-verified intellectual property cores
Evaluation Platforms:
- Compatible evaluation boards for rapid prototyping
- Reference design examples
- Third-party development boards supporting the XCKU3P-1FFVB676E
Support Resources:
- AMD Xilinx Community Forums
- Technical support documentation
- Training materials and webinars
- Application engineering support
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Meets European Union Restriction of Hazardous Substances directive
- Operating Temperature Range: Commercial grade (0ยฐC to +85ยฐC)
- Storage Temperature: -65ยฐC to +150ยฐC
- Moisture Sensitivity Level: MSL-3 per JEDEC standards
Export Control Information:
- Export Control Classification Number (ECCN): Check current AMD Xilinx export control documentation
- Country of Origin: Manufactured in accordance with AMD Xilinx global supply chain
- Trade Compliance: Subject to applicable export control regulations
Quality and Reliability:
- Automotive qualified versions available (consult AMD Xilinx for specific grades)
- Industrial temperature range options
- Extended reliability testing per JEDEC standards
- ISO 9001 certified manufacturing processes
The XCKU3P-1FFVB676E represents a compelling solution for engineers developing high-performance FPGA-based systems requiring substantial logic resources, DSP capabilities, and flexible I/O options. Its combination of performance, features, and reliability makes it suitable for aerospace, defense, communications, and industrial applications where processing power and programmability are essential.
