The XCKU15P-L2FFVA1760E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding embedded applications. This advanced FPGA combines high logic density with superior power efficiency, making it ideal for aerospace, defense, communications, and industrial automation systems.
Product Specifications
The XCKU15P-L2FFVA1760E features robust specifications that set it apart in the FPGA marketplace:
Core Architecture:
- Logic Cells: 1,451,188 cells providing extensive programmable logic capacity
- CLB Flip-Flops: 1,725,300 for complex sequential logic implementations
- Maximum Distributed RAM: 253 Kb for efficient data buffering
- Block RAM: 31.9 Mb total memory for large data storage requirements
Processing Capabilities:
- DSP Slices: 1,368 slices optimized for signal processing applications
- 16nm FinFET+ technology node for enhanced performance and reduced power consumption
- Speed Grade: -2L (Low Power) variant balancing performance with energy efficiency
- Operating temperature range: -40ยฐC to +100ยฐC (Extended Commercial)
Package Details:
- Package Type: FFVA1760 (Fine Pitch Ball Grid Array)
- Pin Count: 1,760 pins providing extensive I/O connectivity
- Package Dimensions: 42.5mm x 42.5mm footprint
- Ball Pitch: 1.0mm for high-density PCB routing
I/O and Connectivity:
- High-performance I/O banks supporting multiple voltage standards
- Integrated high-speed transceivers for advanced communication protocols
- PCIe Gen3 and Gen4 compatibility for system integration
- Support for DDR4, DDR3, and LPDDR4 memory interfaces
Price Information
Pricing for the XCKU15P-L2FFVA1760E varies based on order quantity, lead times, and distribution channels. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities, with sample units available for evaluation purposes.
Pricing Factors:
- Unit quantities vs. volume pricing tiers
- Lead time requirements (stock vs. extended delivery)
- Geographic region and distributor markup
- Additional services (programming, testing, logistics)
Documents & Media
Comprehensive technical documentation supports the XCKU15P-L2FFVA1760E implementation:
Essential Documentation:
- Product Data Sheet: Complete electrical and mechanical specifications
- User Guide: Detailed implementation guidelines and best practices
- Package and Pinout Information: Mechanical drawings and signal assignments
- Power Estimation Tools: Xilinx Power Estimator (XPE) compatibility
- Design Methodology Guide: Step-by-step development workflows
Development Resources:
- Vivado Design Suite compatibility and optimization guides
- Reference designs and application notes
- Simulation models and timing analysis reports
- Programming and configuration documentation
- Thermal management guidelines and recommendations
Media Resources:
- High-resolution package photos and 3D models
- Block diagrams and architecture overviews
- Video tutorials and webinar recordings
- Case studies and application examples
Related Resources
The XCKU15P-L2FFVA1760E ecosystem includes numerous supporting products and resources:
Development Tools:
- Vivado Design Suite: Complete FPGA design environment
- Vitis Unified Software Platform: Hardware and software co-development
- ChipScope Pro: Integrated logic analyzer for debugging
- System Generator for DSP: MATLAB/Simulink integration
Evaluation Boards:
- Kintex UltraScale+ KCU116 Evaluation Kit
- Custom carrier boards from third-party vendors
- FMC (FPGA Mezzanine Card) compatible development platforms
Related FPGA Variants:
- XCKU15P family members with different package options
- Pin-compatible alternatives within the UltraScale+ lineup
- Migration paths from previous generation devices
Technical Support:
- AMD Xilinx technical forums and community support
- Application engineering consultation services
- Training courses and certification programs
- Third-party design service partnerships
Environmental & Export Classifications
The XCKU15P-L2FFVA1760E meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance for chemical safety
- Conflict minerals reporting compliance
- ISO 14001 environmental management system certified manufacturing
Quality Standards:
- Automotive qualification available (contact AMD Xilinx for details)
- Industrial grade temperature range operation
- JEDEC standard package and reliability testing
- Six Sigma quality processes throughout manufacturing
Export Classifications:
- Export Control Classification Number (ECCN) designation applies
- Subject to U.S. Export Administration Regulations (EAR)
- International Traffic in Arms Regulations (ITAR) considerations for specific applications
- Country-specific import/export documentation requirements
Reliability Specifications:
- Mean Time Between Failures (MTBF) calculations available
- Accelerated life testing data and failure rate projections
- Qualification test reports including thermal cycling and mechanical stress
- Electrostatic discharge (ESD) protection ratings
The XCKU15P-L2FFVA1760E represents the pinnacle of FPGA technology, combining advanced 16nm process technology with comprehensive development tool support. Whether you’re developing next-generation 5G infrastructure, implementing AI acceleration solutions, or creating sophisticated embedded systems, this powerful FPGA provides the performance, flexibility, and reliability required for success in today’s demanding applications.
For detailed technical specifications, pricing information, and application support, consult with authorized AMD Xilinx distributors and field application engineers who can provide customized guidance for your specific implementation requirements.
