Advanced Field Programmable Gate Array for Professional Applications
The XCKU15P-3FFVA1760E represents AMD Xilinx’s cutting-edge Kintex UltraScale+ FPGA technology, delivering exceptional performance for demanding applications in wireless communications, data centers, and high-speed networking. This premium FPGA combines advanced FinFET technology with optimized power efficiency to meet the most challenging design requirements.
1. Product Specifications
Core Specifications
- Part Number: XCKU15P-3FFVA1760E
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Product Family: Kintex UltraScale+ FPGA
- Speed Grade: -3 (Highest Performance)
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 1760-pin
- Ball Pitch: 1.0mm
Logic Resources
- System Logic Cells: 1,143,450
- CLB Flip-Flops: 1,045,440
- Logic Array Blocks: 522,720
- Macrocells: 1,143,450
- User I/O: 512
Memory Architecture
- Block RAM: 34,600 Kbit
- UltraRAM: Integrated on-chip memory for BOM cost reduction
- Memory Interface: High-speed DDR4/DDR3 support
Power and Voltage
- Core Voltage (VCCINT): 0.85V standard operation
- Extended Voltage Range: 0.72V for low-power applications
- Technology Node: 20nm FinFET process
- Operating Frequency: Up to 650MHz
Temperature Ranges
- Extended (E): -40ยฐC to +100ยฐC
- Industrial (I): -40ยฐC to +85ยฐC
- Military (M): -55ยฐC to +125ยฐC
Key Features
- 100G Connectivity Cores: Built-in high-speed networking capabilities
- Advanced DSP: Optimized for signal processing applications
- Transceiver Support: High-speed serial connectivity
- Vivado Design Suite Compatible: Full toolchain support
2. Pricing Information
Current Market Pricing
- Pricing Status: Contact for current quotes due to market fluctuations
- Market Conditions: Semiconductor pricing affected by supply chain dynamics since 2021
- Volume Discounts: Available for bulk orders
- Lead Time: Typically 4-5 days via express shipping
Ordering Information
- Minimum Order Quantity: Contact distributor
- Packaging: Anti-static tray packaging
- RoHS Compliance: Yes, fully compliant
- Availability: In stock at authorized distributors
Note: Due to ongoing semiconductor market conditions, pricing varies significantly. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Official Datasheet: XCKU15P-3FFVA1760E Product Brief
- User Guide: Kintex UltraScale+ FPGA Configuration User Guide
- Programming Manual: Vivado Design Suite User Guide
- Package Documentation: FCBGA1760 Package Information
- Thermal Guidelines: Power and Thermal Management Guide
Design Resources
- Reference Designs: Available through Xilinx Design Hub
- Application Notes: Wireless, networking, and DSP implementations
- IP Cores: 100G Ethernet, PCIe, DDR4 controllers
- Evaluation Boards: KCU116 Evaluation Kit recommended
Software Tools
- Vivado Design Suite: Primary development environment
- Vitis Unified Software Platform: For software-defined applications
- IP Catalog: Extensive library of verified IP cores
- Vivado HLS: High-Level Synthesis tools
4. Related Resources
Development Ecosystem
- Evaluation Kits: KCU116 Evaluation Board
- Development Boards: Third-party options available
- Programming Cables: Xilinx Platform Cable USB II, SmartLynq+
- Debug Tools: Vivado Logic Analyzer, ChipScope Pro
Compatible Products
- Alternative Packages: XCKU15P-3FFVA1156E (1156-pin variant)
- Speed Variants: XCKU15P-2FFVA1760I, XCKU15P-1FFVA1760I
- Power-Optimized: XCKU15P-L2FFVA1760E low-power version
Application Solutions
- 5G Wireless Infrastructure: Massive MIMO, beamforming
- Data Center Acceleration: Machine learning inference, compression
- High-Speed Networking: 100G Ethernet, packet processing
- Video Processing: 4K/8K encode/decode, broadcast equipment
- Industrial IoT: Real-time control, sensor fusion
Technical Support
- Community Forums: Xilinx Developer Community
- Training: Xilinx University Program courses
- Application Support: Field Application Engineers available
- Documentation Portal: Comprehensive online resources
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Directive: Fully compliant (EU 2011/65/EU)
- REACH Regulation: No SVHC substances above threshold
- Conflict Minerals: 3TG compliant reporting available
- ISO 14001: Manufacturing facility certified
- Lead-Free: 100% lead-free construction
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- Schedule B Number: 8542.39.0001
- Country of Origin: Various (assembled in Asia-Pacific)
- Export Restrictions: Subject to EAR (Export Administration Regulations)
- ITAR Status: Not ITAR controlled
Safety & Standards
- UL Recognition: UL 94V-0 flammability rating
- Safety Standards: IEC 60950-1 compliant
- EMC Compliance: FCC Part 15, CE marking eligible
- Quality Standard: ISO 9001:2015 manufacturing
Packaging & Handling
- MSL Rating: Moisture Sensitivity Level 3
- ESD Protection: Class 1C ESD sensitive device
- Storage Conditions: -40ยฐC to +125ยฐC, <85% RH
- Packaging Material: Anti-static carrier tape and reel
Lifecycle Status
- Product Status: Active production
- Recommended for New Designs: Yes
- End-of-Life: Not announced
- Long-term Availability: Minimum 10-year commitment
Why Choose XCKU15P-3FFVA1760E?
The XCKU15P-3FFVA1760E delivers unmatched performance for applications requiring high-speed processing, low latency, and flexible implementation. With its advanced 20nm FinFET technology, comprehensive I/O capabilities, and integrated UltraRAM, this FPGA provides the ideal platform for next-generation wireless, networking, and data center applications.
Key Benefits:
- โ Highest Performance: -3 speed grade for maximum clock frequencies
- โ Cost-Effective: Reduced BOM costs through integrated UltraRAM
- โ Power Efficient: Multiple power options for optimal energy consumption
- โ Future-Proof: Advanced FinFET technology with long-term support
- โ Comprehensive Ecosystem: Full toolchain and IP library support
Contact authorized distributors for pricing, availability, and technical support for your XCKU15P-3FFVA1760E implementation.
