The XCKU15P-3FFVA1156E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, automotive, and high-performance computing markets.
Product Specifications
The XCKU15P-3FFVA1156E features robust specifications that make it ideal for complex digital signal processing and high-speed data applications:
Logic Resources:
- Logic Cells: 1,143,000
- CLB Flip-Flops: 1,108,800
- CLB LUTs: 554,400
- Block RAM: 38.4 Mb
- UltraRAM: 0 Mb
DSP and Processing:
- DSP Slices: 1,968
- Maximum Distributed RAM: 11.1 Mb
- Speed Grade: -3 (highest performance)
Package Details:
- Package Type: FFVA1156 (Fine Pitch BGA)
- Pin Count: 1,156 pins
- Package Size: 35mm x 35mm
- Ball Pitch: 0.8mm
I/O Capabilities:
- Maximum User I/Os: 520
- High-speed serial transceivers supporting up to 32.75 Gbps
- PCIe Gen4 support
- 100G Ethernet capability
Price Information
The XCKU15P-3FFVA1156E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities. Contact authorized distributors for current pricing, volume discounts, and lead time information. Pricing varies based on order quantity, delivery requirements, and market conditions.
Ordering Information:
- Part Number: XCKU15P-3FFVA1156E
- Availability: Production status
- Minimum Order Quantity: Varies by distributor
- Lead Time: Contact supplier for current availability
Documents & Media
Essential documentation and resources for the XCKU15P-3FFVA1156E include:
Technical Documentation:
- Product Brief and Datasheet
- Packaging and Pinout Specifications
- AC/DC Switching Characteristics
- Power and Thermal Guidelines
- PCB Design Guidelines
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Evaluation boards and development kits
- IP core compatibility matrix
Support Materials:
- Errata documents
- Migration guides from previous generations
- Thermal simulation models
- Signal integrity guidelines
Related Resources
The XCKU15P-3FFVA1156E ecosystem includes comprehensive development tools and support resources:
Development Tools:
- Vivado Design Suite (latest version recommended)
- Vitis Unified Software Platform
- System Generator for DSP
- High-Level Synthesis (HLS) tools
Evaluation Platforms:
- KCU116 Evaluation Board (compatible family member)
- Custom evaluation solutions available
- Third-party development boards
IP Portfolio:
- Xilinx IP catalog compatibility
- Third-party IP solutions
- Custom IP development services
Training and Support:
- Online training modules
- Technical support portal
- Community forums and documentation
- Professional services and consulting
Environmental & Export Classifications
The XCKU15P-3FFVA1156E meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant (lead-free)
- REACH regulation compliance
- Conflict minerals reporting template available
- Environmental product declarations
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Extended temperature variants available
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000m operational
Export Classifications:
- Export Control Classification Number (ECCN): Check current regulations
- Country of origin marking compliance
- Trade compliance documentation available
- Restricted destination screening required
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive qualification available (select variants)
- Military/aerospace screening options
- Long-term supply commitment programs
The XCKU15P-3FFVA1156E represents the pinnacle of FPGA technology, combining high logic density, advanced DSP capabilities, and flexible I/O options in a compact, high-performance package suitable for the most demanding applications.
