Product Overview
The XCKU15P-1FFVE1760E is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family. This advanced FPGA delivers exceptional price-performance-watt balance in a FinFET node, making it the ideal solution for demanding applications requiring high-end capabilities, including transceiver and memory interface line rates, as well as 100G connectivity cores.
1. Product Specifications
Core Specifications
- Part Number: XCKU15P-1FFVE1760E
- Manufacturer: AMD (formerly Xilinx)
- Family: Kintex UltraScale+
- Speed Grade: -1 (Extended temperature range)
- Process Technology: 20nm FinFET
- Package Type: 1760-FCBGA (Flip Chip Ball Grid Array)
- Package Dimensions: 42.5mm ร 42.5mm
- Ball Pitch: 1.0mm
Logic Resources
- Logic Cells: 1,143,450 system logic cells
- CLB Flip-Flops: 1,045,440
- Configurable Logic Blocks (CLBs): 65,340
- Look-Up Tables (LUTs): Included in logic cell count
- Maximum Operating Frequency: 645 MHz
Memory Resources
- Total RAM Bits: 82,329,600
- Block RAM: Integrated high-performance memory blocks
- UltraRAM: On-chip memory for reduced BOM cost
- Distributed RAM: Available through LUT configuration
I/O and Connectivity
- Total I/O Pins: 668
- High-Performance I/O Banks: Multiple banks for flexible connectivity
- Transceivers: High-speed serial transceivers capable of multi-gigabit data rates
- PCIe Support: Integrated PCIe hard blocks
- DDR4/DDR3 Support: High-speed memory interface capability
Power Specifications
- Core Voltage (VCCINT): 0.85V (standard operation)
- Auxiliary Voltage: 1.8V
- I/O Voltage: 1.2V to 3.3V (bank dependent)
- Supply Voltage Range: 0.825V ~ 0.876V
- Low Power Options: -1LI variants available for reduced power consumption
Temperature and Environmental
- Operating Temperature Range: 0ยฐC to 100ยฐC (TJ – Junction Temperature)
- Temperature Grade: Extended (E) – suitable for commercial and extended industrial applications
- Storage Temperature: -65ยฐC to 150ยฐC
- Humidity: Non-condensing environment recommended
2. Pricing Information
Volume Pricing (USD)
- 12+ units: $5,041.43 per unit
- 24+ units: $4,705.33 per unit
- 36+ units: $4,583.12 per unit
- 60+ units: $4,467.09 per unit
- 120+ units: $4,356.79 per unit
- 300+ units: $4,251.81 per unit
- 600+ units: $4,151.76 per unit
Authorized Distributors
- DigiKey Electronics: $5,717.50 (single unit pricing)
- Octopart: Price comparison from 13+ distributors
- FPGAkey: Volume discounts available
- Micro-Semiconductor: Stock available, competitive pricing
Note: Prices are subject to change based on market conditions and availability. Contact authorized distributors for current pricing and lead times.
3. Documents & Media
Technical Documentation
- Official Datasheet: XCKU15P-1FFVE1760E.pdf
- Product Selection Guide: Kintex UltraScale+ Family overview
- Pin-out Specification: Detailed I/O mapping and package information
- Power Estimation Spreadsheet: For system power planning
- Migration Guide: For upgrading from previous FPGA families
Design Resources
- Reference Manual: Comprehensive technical specifications
- User Guide: Design implementation best practices
- Application Notes: Specific use-case implementations
- Errata Documentation: Known issues and workarounds
- Package Specifications: Mechanical drawings and thermal data
Software Tools
- Vivado Design Suite: Primary development environment
- Vivado HLS: High-Level Synthesis tool
- Software Development Kit (SDK): For embedded processor designs
- ChipScope Pro: Integrated logic analyzer
- ISE Design Suite: Legacy support (if applicable)
4. Related Resources
Development Platforms
- Kintex UltraScale+ FPGA Evaluation Kit
- XCKU15P Development Board
- Reference Design Platforms
- Third-party Development Boards (Digilent, Terasic, etc.)
Programming and Debug Tools
- JTAG-SMT2-NC Surface Mount Programmer (Digilent 410-308-B)
- JTAG-SMT2 Surface Mount Programmer (Digilent 410-251-B)
- JTAG-SMT3-NC Surface Mount Programmer (Digilent 410-357-B)
- Platform Cable USB II
- Embedded Vision Kits
Compatible IP Cores
- 100G Ethernet MAC/PCS
- PCIe Gen3/Gen4 Controllers
- DDR4/DDR3 Memory Controllers
- Video Processing IP
- DSP IP Cores
- Cryptographic Acceleration
Application Examples
- 5G Infrastructure Equipment
- Data Center Acceleration
- Machine Learning Inference
- Video Processing and Broadcasting
- High-Frequency Trading Systems
- Radar and Defense Applications
Technical Support Resources
- AMD Community Forums
- Technical Answer Records (ARs)
- Application Engineering Support
- Training and Certification Programs
- University Program Resources
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Yes – Lead-free/RoHS Compliant
- RoHS Status: Compliant with EU RoHS Directive 2011/65/EU
- REACH Compliance: No SVHC (Substances of Very High Concern) as of January 15, 2019
- Conflict Minerals: Compliant with Section 1502 of Dodd-Frank Act
- WEEE Directive: Compliant with EU Waste Electrical and Electronic Equipment Directive
Package and Material Information
- Package Material: Organic substrate with copper lead frame
- Mold Compound: Halogen-free epoxy mold compound
- Solder Ball Composition: Lead-free SAC (Tin-Silver-Copper) alloy
- Moisture Sensitivity Level (MSL): Level 3 (168 hours at 30ยฐC/60% RH)
- Peak Reflow Temperature: 260ยฐC maximum
Export Control and Trade Compliance
- Export Control Classification Number (ECCN): 3A001.a.7
- Country of Origin: Various (final assembly location may vary)
- Harmonized Tariff Schedule (HTS): 8542.39.0001
- Export License Requirements: May require export license for certain destinations
- EAR99 Classification: Subject to Export Administration Regulations
Quality and Manufacturing Standards
- ISO 9001:2015: Quality management system certification
- ISO 14001: Environmental management system
- IATF 16949: Automotive quality standard (where applicable)
- AS9100: Aerospace quality standard compliance
- IPC Standards: Compliant with IPC-A-610 acceptance criteria
Shipping and Handling
- Packaging Type: Tray packaging (standard)
- ESD Sensitivity: Class 1 (Human Body Model โฅ2000V)
- Storage Requirements: Dry environment, avoid temperature extremes
- Shelf Life: Unlimited when stored properly
- Transportation: Standard electronic component shipping protocols
Key Benefits of XCKU15P-1FFVE1760E
โ High Logic Density: Over 1.1 million logic cells for complex designs
โ Advanced Process Technology: 20nm FinFET for optimal power efficiency
โ Flexible I/O: 668 I/O pins with multiple voltage support
โ High-Speed Connectivity: Integrated transceivers and PCIe support
โ Cost-Effective: Best price-performance ratio in UltraScale+ family
โ Design Tool Support: Full Vivado Design Suite compatibility
โ Extended Temperature Range: Suitable for demanding environments
โ Multiple Speed Grades: Options for different performance requirements
The XCKU15P-1FFVE1760E represents the ideal balance of performance, power efficiency, and cost-effectiveness for next-generation FPGA designs across telecommunications, data center, automotive, and industrial applications.
