The XCKU15P-1FFVE1517I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered for demanding applications requiring exceptional performance and versatility. This advanced FPGA delivers superior processing capabilities for aerospace, defense, communications, and high-performance computing applications.
Product Specifications
Core Architecture
The XCKU15P-1FFVE1517I features AMD Xilinx’s advanced UltraScale+ architecture built on TSMC’s 16nm FinFET+ process technology, providing optimal power efficiency and performance.
Key Technical Specifications:
- Logic Cells: 1,451,232 system logic cells
- CLB Flip-Flops: 2,760,960
- CLB LUTs: 663,360
- Block RAM: 38.4 Mb total block RAM
- UltraRAM: 180 Mb UltraRAM capacity
- DSP Slices: 1,968 DSP48E2 slices
- Package Type: FFVE1517 (Fine-Pitch BGA)
- Pin Count: 1,517 pins
- Speed Grade: -1 (standard performance)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Advanced Features
- High-Speed Transceivers: Up to 32 GTY transceivers supporting data rates up to 32.75 Gbps
- PCIe Support: Integrated PCIe Gen3 and Gen4 blocks
- Ethernet Connectivity: 100G Ethernet MAC support
- Memory Interface: DDR4-2666 memory controller support
- Security Features: Advanced encryption and authentication capabilities
Package Details
The XCKU15P-1FFVE1517I utilizes the FFVE1517 package, a fine-pitch Ball Grid Array (BGA) measuring 40mm x 40mm with 1.0mm ball pitch, optimized for high-density applications requiring maximum I/O capability.
Price Information
Pricing for XCKU15P-1FFVE1517I:
- Unit Price: Contact authorized distributors for current pricing
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: Typically 12-16 weeks from major distributors
- Availability: Check with AMD Xilinx partners for stock status
Note: XCKU15P-1FFVE1517I pricing varies based on quantity, delivery requirements, and market conditions. Contact authorized distributors for the most current pricing and availability.
Documents & Media
Technical Documentation
- Product Brief: XCKU15P-1FFVE1517I overview and key features
- Datasheet: Complete electrical and timing specifications
- Package and Pinout Guide: Detailed pin assignments and package information
- PCB Design Guidelines: Board layout recommendations for optimal performance
- Power and Thermal Guidelines: Power consumption and thermal management specifications
Development Resources
- Vivado Design Suite: Complete design environment for XCKU15P-1FFVE1517I development
- IP Catalog: Extensive library of verified IP cores
- Reference Designs: Pre-built designs and application examples
- User Guides: Comprehensive documentation for configuration and programming
Evaluation Tools
- Development Boards: KCU116 evaluation board featuring XCKU15P-1FFVE1517I
- Demo Applications: Ready-to-use demonstrations showcasing FPGA capabilities
- Getting Started Guides: Step-by-step tutorials for new users
Related Resources
Compatible Products
- XCZU15EG-1FFVB1156I: Zynq UltraScale+ alternative with ARM processing system
- XCKU11P-1FFVA676I: Lower-density option in the same family
- XCVU13P-1FHGA2104I: Higher-performance Virtex UltraScale+ option
Development Ecosystem
- Vitis Unified Software Platform: Accelerated application development environment
- PetaLinux Tools: Embedded Linux development framework
- SDSoC Development Environment: System-level design tools for heterogeneous computing
Application Solutions
- 5G Infrastructure: Baseband processing and beamforming applications
- Aerospace & Defense: Radar processing and secure communications
- Data Center Acceleration: Machine learning inference and network processing
- Test & Measurement: High-speed data acquisition and signal processing
Technical Support
- AMD Xilinx Forums: Community-driven technical discussions
- Application Notes: Detailed implementation guidance
- Training Resources: Online courses and certification programs
- Design Services: Professional design consultation and support
Environmental & Export Classifications
Environmental Compliance
The XCKU15P-1FFVE1517I meets stringent environmental standards and regulations:
- RoHS Compliant: Restriction of Hazardous Substances directive compliant
- REACH Regulation: European chemicals regulation compliant
- Conflict Minerals: DRC conflict-free mineral sourcing certified
- Green Packaging: Environmentally responsible packaging materials
Operating Conditions
- Junction Temperature Range: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 10% to 95% non-condensing
- Altitude: Up to 3,000 meters operational
Export Classifications
Important Export Control Information:
- ECCN (Export Control Classification Number): Subject to US export regulations
- HTS Code: Harmonized Tariff Schedule classification for customs
- Country of Origin: Manufactured in authorized facilities
- Export Licensing: May require export license for certain destinations
Compliance Notes: The XCKU15P-1FFVE1517I is subject to export administration regulations. Customers must ensure compliance with applicable export control laws and regulations in their jurisdiction. Contact AMD Xilinx for specific export classification details and guidance.
Quality Standards
- ISO 9001: Quality management system certified manufacturing
- Automotive Grade: Available in automotive-qualified versions
- Reliability Testing: Extensive qualification and reliability testing performed
- Statistical Quality Control: Continuous process monitoring and improvement
Contact Information: For technical support, pricing inquiries, or additional information about the XCKU15P-1FFVE1517I, contact authorized AMD Xilinx distributors or visit the official AMD Xilinx website for comprehensive resources and documentation.
