Overview
The XCKU15P-1FFVE1517E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Kintex UltraScale+ family, engineered for demanding applications requiring exceptional processing power and energy efficiency. This advanced FPGA delivers optimal price-performance-power balance with cutting-edge FinFET technology.
1. Product Specifications
Core Architecture
- Part Number: XCKU15P-1FFVE1517E
- Family: Kintex UltraScale+
- Manufacturer: AMD (formerly Xilinx)
- Process Technology: 20nm FinFET
- Speed Grade: -1 (Extended temperature range)
- Core Voltage: 0.85V
Logic Resources
- Logic Cells: 1,143,450 cells
- CLB Flip-Flops: 2,364,480
- CLB LUTs: 591,840
- Maximum Distributed RAM: 282 Kb
- Block RAM: 34,600 Kb total
- UltraRAM: 94.5 Mb
DSP and Memory
- DSP Slices: 1,728
- System Clock Management: 8 MMCMs, 4 PLLs
- PCIe Blocks: 4 PCIe Gen3 x8 or 2 PCIe Gen4 x8
- Memory Controllers: 8 controllers
Package Details
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 1,517 pins
- Package Size: 40mm x 40mm
- I/O Pins: 512 user I/O
- Operating Temperature: 0ยฐC to +85ยฐC (Extended)
High-Speed Interfaces
- GTY Transceivers: 20 channels at up to 32.75 Gbps
- GTH Transceivers: 16 channels at up to 16.3 Gbps
- DDR4 Support: Up to 2400 Mbps
- Ethernet Support: 100G Ethernet capability
2. Price Information
Current Market Pricing (2025)
- Quantity 1: Starting from $5,418.15 USD
- Volume Pricing: Available for quantities over 100 units
- Lead Time: 8-12 weeks for standard orders
- Sample Availability: Contact authorized distributors
Authorized Distributors
- Digi-Key Electronics
- Mouser Electronics
- Avnet
- Arrow Electronics
Note: Prices subject to change based on market conditions and availability. Contact distributors for current quotes and volume pricing.
3. Documents & Media
Technical Documentation
- Official Datasheet: XCKU15P-1FFVE1517E Datasheet (PDF)
- Package Pinout: UG575 – UltraScale+ Package and Pinout Guide
- PCB Layout Guidelines: Package-specific design guides
- Thermal Management Guide: Junction temperature specifications
- Migration Guide: From UltraScale to UltraScale+
Development Resources
- Design Software: AMD Vivado Design Suite (recommended)
- IP Cores: Extensive library of pre-verified IP
- Reference Designs: Application-specific implementations
- Evaluation Boards: Compatible development platforms
Multimedia Resources
- Product overview videos
- Application demonstration videos
- Technical webinar recordings
- 3D package models for PCB design
4. Related Resources
Development Tools
- AMD Vivado Design Suite: Primary development environment
- Vitis Unified Software Platform: For embedded software development
- ChipScope Pro: Real-time debugging and analysis
- Programming Tools: JTAG-SMT2, JTAG-SMT3 programmers
Compatible Products
- XCKU11P-1FFVE1517E: Lower-density alternative
- XCKU19P-1FFVE1760E: Higher-density option
- Development Boards: ZCU102, ZCU106 evaluation platforms
- FMC Cards: FPGA Mezzanine Card ecosystem
Application Areas
- 5G Wireless Infrastructure: Baseband processing, beamforming
- Data Center Acceleration: AI/ML inference, networking
- Aerospace & Defense: Radar processing, secure communications
- Automotive: Advanced driver assistance systems (ADAS)
- Industrial IoT: Real-time control systems
- Medical Imaging: High-resolution image processing
Technical Support
- AMD Community Forums: Peer-to-peer technical discussions
- Documentation Portal: Comprehensive technical library
- Training Resources: Online courses and certification programs
- Field Application Engineers: Direct technical support
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU RoHS directive requirements
- REACH Compliant: Complies with EU chemical regulations
- Halogen-Free: Environmentally friendly packaging
- Lead-Free: MSL (Moisture Sensitivity Level) 3
- Operating Humidity: 5% to 95% non-condensing
Export Control Information
- ECCN Classification: 3A001.a.7.b
- USHTS Code: 8542390001
- TARIC Code: 8542399000
- Country of Origin: Various (Contact manufacturer for specific lot)
Packaging Information
- Shipping: Anti-static tray packaging
- Storage Temperature: -55ยฐC to +125ยฐC
- Shelf Life: Unlimited when stored properly
- Handling: ESD sensitive device – proper handling required
Quality Standards
- ISO 9001: Quality management certification
- ISO 14001: Environmental management
- JEDEC Standards: Compliant with industry standards
- Automotive: AEC-Q100 qualified variants available
Keywords: XCKU15P-1FFVE1517E, AMD FPGA, Kintex UltraScale+, Field Programmable Gate Array, 20nm FinFET, High-Performance Computing, 5G Infrastructure, Data Center Acceleration
For the latest specifications, pricing, and availability of the XCKU15P-1FFVE1517E, please contact authorized AMD distributors or visit the official AMD documentation portal.
