The XCKU15P-1FFVA1760E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Kintex UltraScale+ family, designed to deliver exceptional price-performance-per-watt ratio for advanced digital signal processing and high-speed connectivity applications.
1. Product Specifications
Key Technical Specifications
- Part Number: XCKU15P-1FFVA1760E
- Manufacturer: AMD (formerly Xilinx)
- Family: Kintex UltraScale+
- Speed Grade: -1 (Extended temperature range)
- Package: FFVA1760 (1760-pin Flip-chip Fine Pitch BGA)
- Process Technology: 20nm FinFET node
- Core Voltage (VCCINT): 0.85V
Logic Resources
- System Logic Cells: 1,143,450
- CLB (Configurable Logic Blocks): 65,340
- Look-up Tables (LUTs): 522,720 blocks
- Flip-flops: 1,045,440 CLB flip-flops
- Memory: 34,600 Kbit block RAM
- UltraRAM: On-chip memory for reduced BOM cost
I/O and Connectivity
- User I/O: 512 pins
- I/O Voltage Support: Multiple voltage standards supported
- Package Dimensions: 42.5mm x 42.5mm BGA
- Pin Pitch: 1.0mm ball pitch
- Pin Count: 1760 total pins
Operating Conditions
- Temperature Range: Extended (-40ยฐC to +100ยฐC)
- Power Options: Optimized for balance between performance and power consumption
- Dual Voltage Operation: Can operate at 0.85V or 0.72V VCCINT for power flexibility
2. Price
Pricing Information:
- Price varies by quantity and distributor
- Available from authorized distributors including Digi-Key, Avnet, Mouser, and regional suppliers
- Contact distributors for current pricing and volume discounts
- Lead time: Typically 52 weeks from manufacturer
- Stock availability varies by supplier
Available Distributors:
- Digi-Key Electronics
- Micro-Semiconductor.com
- FPGAkey
- Avnet
- Authorized regional distributors
3. Documents & Media
Technical Documentation
- Official Datasheet: Available from AMD/Xilinx documentation portal
- Kintex UltraScale+ Data Sheet: DC and AC switching characteristics
- Package Information: FFVA1760 package specifications
- Pin Assignment: Complete pinout documentation
- Application Notes: Design guidelines and best practices
CAD Resources
- ECAD Models: Schematic symbols available
- PCB Footprints: BGA-FFVA1760 footprint libraries
- 3D Models: For mechanical design verification
- IBIS Models: For signal integrity analysis
Software Support
- Vivado Design Suite: Primary development environment
- IP Catalog: Extensive library of verified IP cores
- Documentation: User guides, tutorials, and reference manuals
4. Related Resources
Development Platforms
- Evaluation Boards: Various Kintex UltraScale+ development boards available
- Reference Designs: Application-specific starting points
- IP Cores: High-speed connectivity, DSP, and memory controllers
Design Tools
- Vivado Design Suite: Synthesis, implementation, and debugging
- System Generator: MATLAB/Simulink integration for DSP design
- SDK/Vitis: Software development environment for embedded processors
Support Resources
- Technical Support: AMD/Xilinx technical support portal
- Community Forums: User community and expert assistance
- Training: Online courses and certification programs
- Application Engineering: Field application engineer support
Compatible Accessories
- Development Boards: ZedBoard, Nexys4-DDR, Terasic DE10-Nano
- FMC Modules: VITA 57.1 compliant mezzanine cards
- Debug Tools: ChipScope Pro, Vivado Logic Analyzer
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Lead-free and RoHS compliant
- REACH Compliance: Compliant with REACH regulations
- Conflict Minerals: Compliant with conflict minerals regulations
- Halogen-Free: Available in halogen-free versions
Quality and Reliability
- Moisture Sensitivity Level: MSL 4
- Operating Life: 10+ years expected operational life
- Quality Standards: ISO 9001 manufacturing quality system
- Reliability Testing: Extensive qualification and reliability testing
Export Classifications
- Country of Origin: Taiwan
- ECCN Code: 3A001.A.7.B (Export control classification)
- HTS Code: 8542.39.00.01 (Harmonized tariff schedule)
- Export License: May require export license for certain destinations
Package and Storage
- Package Type: Anti-static tray packaging
- Storage Conditions: Controlled temperature and humidity
- Shelf Life: Extended shelf life with proper storage
- Handling: ESD-sensitive device requiring proper handling procedures
Key Benefits of XCKU15P-1FFVA1760E:
- Superior price-performance-per-watt ratio in 20nm FinFET technology
- High-density logic resources with extensive memory options
- Flexible power management with dual voltage operation
- Comprehensive development tool support with Vivado Design Suite
- Extensive ecosystem of IP cores and reference designs
- Industry-leading signal processing capabilities for next-generation applications
The XCKU15P-1FFVA1760E represents the ideal solution for applications requiring high-performance FPGA capabilities including 100G networking, advanced DSP processing, medical imaging, 4K/8K video processing, and wireless infrastructure implementations.
