The XCKU13P-L2FFVE900E is a premium field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered for demanding applications requiring exceptional processing power and versatility. This advanced FPGA delivers outstanding performance for aerospace, defense, communications, and high-performance computing applications.
Product Specification
The XCKU13P-L2FFVE900E features robust technical specifications that make it ideal for complex digital signal processing and data acceleration tasks:
Core Architecture:
- Logic Cells: 1,743,616 logic cells providing extensive programmable resources
- CLB Flip-Flops: 692,160 configurable logic block flip-flops
- CLB LUTs: 346,080 look-up tables for maximum flexibility
- Block RAM: 75.9 Mb total block RAM capacity
- UltraRAM: 360 Mb of UltraRAM for high-density memory applications
Processing Capabilities:
- DSP Slices: 5,520 DSP48E2 slices for high-speed arithmetic operations
- Maximum User I/O: 520 user I/O pins
- Speed Grade: -2L (low power variant)
- Package Type: FFVE900 (fine-pitch ball grid array)
- Operating Temperature: Extended commercial range
Advanced Features:
- PCIe Gen3 x16 and Gen4 x8 connectivity
- 100G Ethernet MAC support
- Advanced security features including AES-256 encryption
- Built-in configuration memory and power management
Price
XCKU13P-L2FFVE900E pricing varies based on quantity, lead time, and supplier. Contact authorized distributors for current pricing:
- Single unit pricing: Contact for quote
- Volume pricing: Available for orders of 100+ units
- Long-term agreement pricing: Negotiable for annual contracts
- Engineering samples: Available for qualified design teams
Pricing factors include market conditions, manufacturing lead times, and customer-specific requirements. The XCKU13P-L2FFVE900E represents premium value in the high-performance FPGA segment.
Documents & Media
Comprehensive documentation supports XCKU13P-L2FFVE900E implementation:
Technical Documentation:
- Complete datasheet with electrical specifications
- Package and pinout documentation
- PCB design guidelines and reference layouts
- Power supply design recommendations
- Thermal management guidelines
Development Resources:
- Vivado Design Suite compatibility information
- IP core integration guides
- Programming and configuration procedures
- Debug and verification methodologies
- Performance optimization guidelines
Application Notes:
- High-speed design considerations
- Signal integrity best practices
- Power distribution network design
- Clock distribution strategies
- Multi-gigabit transceiver implementation
Related Resources
Development Tools:
- Vivado Design Suite (latest version recommended)
- Vitis unified software platform
- System Generator for DSP
- PetaLinux embedded Linux development kit
- Hardware Manager for device programming
Evaluation Platforms:
- Compatible development boards and evaluation kits
- Reference designs for common applications
- Demonstration projects and tutorials
- Community forums and technical support
IP Portfolio:
- Extensive library of verified IP cores
- Custom IP development services
- Third-party IP ecosystem
- Application-specific reference designs
Environmental & Export Classifications
The XCKU13P-L2FFVE900E meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals compliance
- ISO 14001 environmental management certification
Export Control Classifications:
- ECCN (Export Control Classification Number): Verify current classification
- HTS (Harmonized Tariff Schedule) code: Available upon request
- Country-specific import/export requirements vary
- Technology transfer restrictions may apply
Quality Standards:
- Automotive AEC-Q100 qualification available
- Military temperature range options
- Extended reliability testing
- Comprehensive quality assurance programs
Packaging and Shipping:
- Moisture sensitivity level (MSL) classification
- Electrostatic discharge (ESD) protection
- Environmentally responsible packaging materials
- Global logistics and distribution network
The XCKU13P-L2FFVE900E delivers exceptional performance, reliability, and flexibility for next-generation FPGA applications. Its advanced architecture and comprehensive ecosystem support make it the preferred choice for demanding high-performance computing, communications, and signal processing applications.
