“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XCKU13P-2FFVE900E FPGA: High-Performance Kintex UltraScale+ Solution

Original price was: $20.00.Current price is: $19.00.

The XCKU13P-2FFVE900E is a powerful FPGA (Field-Programmable Gate Array) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing.

Product Specifications

Core Architecture

The XCKU13P-2FFVE900E features advanced 16nm FinFET+ technology, providing optimal power efficiency and performance. This FPGA incorporates:

  • Logic Cells: 1,143,000 system logic cells
  • CLB Flip-Flops: 2,286,000
  • CLB LUTs: 572,160
  • Block RAM: 75.9 Mb total block RAM
  • UltraRAM: 360 Mb distributed memory
  • DSP Slices: 1,368 DSP48E2 slices for high-speed signal processing

Package and Pin Configuration

The XCKU13P-2FFVE900E comes in a FFVE900 package with:

  • Package Type: Fine-pitch Ball Grid Array (FBGA)
  • Pin Count: 900 pins
  • Speed Grade: -2 (commercial temperature range)
  • Operating Temperature: 0ยฐC to +85ยฐC

Performance Capabilities

This FPGA delivers exceptional performance with:

  • High-speed transceivers supporting up to 32.75 Gbps
  • PCIe Gen4 connectivity
  • 100G Ethernet capability
  • Advanced clocking architecture
  • Built-in security features

Price Information

Pricing for the XCKU13P-2FFVE900E varies based on quantity, distributor, and current market conditions. Contact authorized distributors for:

  • Volume pricing options
  • Engineering sample availability
  • Custom packaging solutions
  • Extended warranty programs

Prices subject to change based on market conditions and availability.

Documents & Media

Technical Documentation

  • Datasheet: Complete electrical and timing specifications
  • User Guide: Comprehensive implementation guidelines
  • Package/Pinout Files: Detailed pin assignments and package drawings
  • Speed Files: Timing models for various operating conditions

Development Resources

  • Reference Designs: Pre-validated IP cores and example projects
  • Application Notes: Implementation best practices and optimization techniques
  • Video Tutorials: Step-by-step development guidance
  • Webinar Series: Expert insights on advanced features

Software Tools

  • Vivado Design Suite: Complete development environment
  • IP Catalog: Extensive library of verified IP blocks
  • System Generator: Model-based design tools
  • SDSoC: Software-defined development environment

Related Resources

Compatible Development Boards

  • Kintex UltraScale+ evaluation boards
  • Custom carrier cards and modules
  • Third-party development platforms

IP Cores and Solutions

  • High-speed communication interfaces
  • Video and image processing IP
  • Digital signal processing libraries
  • Security and encryption cores

Training and Support

  • Online training courses
  • Technical support forums
  • Application engineering assistance
  • Design consultation services

Competitive Products

  • Alternative Kintex UltraScale+ variants
  • Virtex UltraScale+ options for higher performance
  • Zynq UltraScale+ MPSoCs for embedded applications

Environmental & Export Classifications

Environmental Compliance

The XCKU13P-2FFVE900E meets stringent environmental standards:

  • RoHS Compliant: Lead-free manufacturing process
  • REACH Compliant: European chemical safety regulations
  • Conflict Minerals: Responsible sourcing certification
  • Green Product: Environmentally conscious design

Operating Conditions

  • Commercial Temperature Range: 0ยฐC to +85ยฐC
  • Industrial Grade Options: Available upon request
  • Humidity Tolerance: Standard commercial specifications
  • Shock and Vibration: Suitable for demanding applications

Export Classifications

  • ECCN: Export Control Classification Number available upon request
  • Country of Origin: Manufacturing location documentation provided
  • Export Licensing: Compliance with international trade regulations
  • Security Features: Built-in anti-tamper and encryption capabilities

Quality Certifications

  • ISO 9001:2015 manufacturing quality
  • Automotive-grade options available
  • Military/aerospace screening available
  • Extended reliability testing programs

The XCKU13P-2FFVE900E represents cutting-edge FPGA technology, combining high performance, power efficiency, and comprehensive development support. Whether you’re developing next-generation communication systems, implementing complex signal processing algorithms, or creating innovative embedded solutions, this FPGA provides the flexibility and performance needed for success.

For detailed technical specifications, pricing information, and design support, contact your local AMD Xilinx distributor or visit the official product page.