The XCKU11P-L2FFVE1517E is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered to deliver exceptional price-performance-watt balance for demanding applications. This advanced FPGA solution combines cutting-edge FinFET technology with low-power operation, making it ideal for high-end digital signal processing, communications systems, and aerospace applications.
1. Product Specifications
Core Architecture
- Device Family: Kintex UltraScale+
- Part Number: XCKU11P-L2FFVE1517E
- Logic Cells: 653,100 programmable logic cells
- Lookup Tables (LUTs): 298,560 configurable logic blocks
- Memory: 21,100 Kbit on-chip UltraRAM
- DSP Slices: 2,928 high-performance DSP48E2 slices
Electrical Characteristics
- Core Voltage (VCCINT): 0.72V (Low Power L-grade)
- I/O Voltage: 1.2V to 3.3V configurable
- Speed Grade: -L2 (Low Power, Grade 2)
- Temperature Range: Extended (-40ยฐC to +100ยฐC)
- Operating Frequency: Up to 933 MHz fabric performance
Package Details
- Package Type: FCBGA (Flip-Chip Ball Grid Array)
- Pin Count: 1517 pins
- Ball Pitch: 1.0mm
- Package Size: 45mm x 45mm
- I/O Pins: 512 user I/O pins
- High-Speed Transceivers: 53,964,800 total transceiver lanes
Process Technology
- Manufacturing Node: 20nm FinFET+ technology
- Power Efficiency: Optimized for low static and dynamic power consumption
- Voltage Options: Dual voltage operation (0.85V/0.72V VCCINT)
2. Pricing Information
The XCKU11P-L2FFVE1517E pricing varies by distributor, quantity, and current market conditions. Based on current market data:
Authorized Distributors
- Digi-Key Electronics: Contact for current pricing and availability
- Newark/Farnell: Competitive pricing with bulk discounts available
- Octopart: Price comparison across multiple distributors
- Mouser Electronics: Industrial-grade pricing tiers
Volume Pricing
- Sample Quantities (1-9 units): Premium pricing for prototyping
- Production Quantities (100+ units): Significant volume discounts available
- Large Volume (1000+ units): Contact AMD Xilinx for enterprise pricing
Note: Pricing fluctuates based on market demand, allocation, and lead times. Contact authorized distributors for current quotations and availability.
3. Documents & Media
Official Documentation
- Product Datasheet: UltraScale+ FPGAs Data Sheet (DS890)
- User Guide: Kintex UltraScale+ FPGAs User Guide (UG575)
- Package Pinout Files: Available in TXT and CSV formats
- Selection Guide: Kintex UltraScale+ Product Selection Guide
Design Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Extensive library of verified IP cores
- Reference Designs: Application-specific design examples
- Development Boards: Compatible evaluation platforms available
CAD Models & Files
- 3D Package Models: STEP files for mechanical design
- Symbol Libraries: Schematic symbols for major CAD tools
- Footprint Libraries: PCB layout footprints and via requirements
- Thermal Models: Junction-to-ambient thermal resistance data
4. Related Resources
Development Tools
- Vivado Design Suite: Complete FPGA design flow from synthesis to bitstream
- Vitis Unified Software Platform: Accelerated application development
- ChipScope Pro: Real-time debugging and verification
- System Generator: DSP design for MATLAB/Simulink integration
Compatible Platforms
- ZedBoard: ARM-based development platform
- Kintex UltraScale+ Evaluation Boards: Purpose-built evaluation hardware
- Custom Carrier Cards: Third-party development solutions
- FMC Modules: FPGA Mezzanine Card ecosystem
Application Areas
- 5G Wireless Infrastructure: Massive MIMO, beamforming applications
- Aerospace & Defense: Radar processing, software-defined radio
- High-Performance Computing: Acceleration engines, data analytics
- Industrial Automation: Machine vision, motor control systems
- Medical Imaging: Ultrasound processing, CT/MRI applications
Technical Support
- AMD Xilinx Forums: Community-driven technical discussions
- Application Notes: Best practices and design guidelines
- Training Courses: Online and in-person FPGA design training
- Field Application Engineers: Direct technical support
5. Environmental & Export Classifications
RoHS Compliance
- RoHS Status: Compliant (Restriction of Hazardous Substances)
- Lead-Free: Yes, meets EU RoHS directive requirements
- SVHC: No Substances of Very High Concern (as of January 15, 2019)
- REACH Compliant: Meets European chemical regulations
Environmental Standards
- Operating Temperature: -40ยฐC to +100ยฐC (Extended range)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 85% relative humidity, non-condensing
- Altitude: Up to 2000m operational altitude
Export Control Classification
- ECCN: 3A001.a.7 (Export Control Classification Number)
- Export Restrictions: Subject to U.S. export control regulations
- License Requirements: May require export license for certain destinations
- Origin: Manufactured in various locations – check with supplier
Quality & Reliability
- Qualification Standard: AEC-Q100 automotive qualified versions available
- MTBF: Mean Time Between Failures data available in reliability reports
- Quality System: ISO 9001:2015 certified manufacturing
- Traceability: Full supply chain traceability maintained
Package Handling
- Moisture Sensitivity Level: MSL 3 (maximum floor life 168 hours at โค30ยฐC/60% RH)
- ESD Sensitivity: Class 1A (โฅ1000V Human Body Model)
- Package Marking: Device marking includes part number, date code, and country of origin
- Shipping: Anti-static tray packaging for component protection
Manufacturer: AMD Xilinx
Product Family: Kintex UltraScale+ FPGAs
Lifecycle Status: Active, recommended for new designs
Availability: Available through authorized distributors worldwide
For the most current specifications, pricing, and availability information, consult with authorized AMD Xilinx distributors or visit the official AMD Xilinx website.
