The XCKU11P-2FFVE1517E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and high-performance computing.
Product Specifications
Core Features of XCKU11P-2FFVE1517E
Logic Resources:
- System Logic Cells: 1,143,000
- CLB LUTs: 663,360
- CLB Flip-Flops: 1,326,720
- Block RAM: 38.5 Mb
- UltraRAM: 79.2 Mb
DSP and Processing:
- DSP Slices: 1,368
- Maximum Frequency: Up to 741 MHz
- Speed Grade: -2 (Standard Performance)
Package and I/O:
- Package Type: FFVE1517 (Fine Pitch BGA)
- Pin Count: 1,517 pins
- User I/O: 312
- Operating Temperature: Extended Commercial (0ยฐC to 85ยฐC)
Advanced Features:
- 16nm FinFET+ Process Technology
- PCIe Gen3 x16 and Gen4 x8 Support
- 100G Ethernet MAC
- 150G Interlaken
- DDR4-2666 Memory Interface
- Low Power Consumption with SmartConnect Technology
Technical Specifications Summary
| Specification | XCKU11P-2FFVE1517E |
|---|---|
| Device Family | Kintex UltraScale+ |
| Logic Cells | 1,143,000 |
| LUTs | 663,360 |
| Block RAM | 38.5 Mb |
| DSP Slices | 1,368 |
| Package | FFVE1517 |
| Speed Grade | -2 |
| Temperature Grade | Extended Commercial |
Price Information
The XCKU11P-2FFVE1517E pricing varies based on order quantity and distribution channel. For current pricing and availability:
- Small Quantities (1-99 units): Contact authorized distributors
- Volume Pricing (100+ units): Request quote from AMD Xilinx
- Lead Time: Typically 12-16 weeks for standard orders
- Minimum Order Quantity: 1 unit
Note: Prices subject to change. Contact your local AMD Xilinx representative or authorized distributor for the most current pricing and delivery schedules.
Documents & Media
Technical Documentation
- Datasheet: Kintex UltraScale+ FPGAs Data Sheet (DS922)
- User Guide: UltraScale Architecture Clocking Resources (UG572)
- PCB Design Guide: UltraScale+ FPGAs Packaging and Pinout (UG575)
- Power Estimation: UltraScale+ Power Advantage Estimator
Design Resources
- Reference Designs: Available through AMD Xilinx Vivado Design Suite
- IP Cores: Extensive library of verified IP blocks
- Application Notes: Performance optimization guides
- Evaluation Boards: ZCU111 Evaluation Kit compatible designs
Software Tools
- Vivado Design Suite: Complete design environment
- Vitis Unified Software Platform: For software-defined hardware
- System Generator: High-level synthesis tools
- ILA (Integrated Logic Analyzer): Real-time debugging
Related Resources
Compatible Development Boards
- ZCU111 Evaluation Kit: Full-featured development platform
- Custom Carrier Cards: Third-party development solutions
- FMC (FPGA Mezzanine Card): Expansion modules
Software Ecosystem
- PetaLinux: Embedded Linux development
- Vivado HLS: High-Level Synthesis
- SDSoC Development Environment: System optimization
- OpenCL Support: Parallel computing framework
Application Areas
- 5G Wireless Infrastructure: Baseband processing and beamforming
- Aerospace & Defense: Radar, sonar, and secure communications
- Data Center Acceleration: Machine learning inference
- High-Performance Computing: Scientific computing acceleration
- Video Processing: 4K/8K video transcoding and streaming
Training and Support
- AMD Xilinx University Program: Educational resources
- Technical Support: Comprehensive online knowledge base
- Design Services: Professional consulting available
- Community Forums: Peer-to-peer technical discussions
Environmental & Export Classifications
Environmental Compliance
The XCKU11P-2FFVE1517E meets stringent environmental standards:
- RoHS Compliant: Lead-free, environmentally friendly
- REACH Compliant: European chemical regulation compliance
- Conflict Minerals: 3TG conflict-free certification
- Green Package: Halogen-free and antimony-free materials
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Taiwan (Manufacturing)
- CCATS: Available upon request for specific applications
Quality and Reliability
- Automotive Grade: AEC-Q100 qualified versions available
- Military Grade: Extended temperature and screening options
- Quality System: ISO 9001:2015 certified manufacturing
- Reliability Testing: JEDEC standard qualification
Temperature and Package Information
- Operating Temperature Range: 0ยฐC to +85ยฐC (Extended Commercial)
- Storage Temperature: -65ยฐC to +150ยฐC
- Moisture Sensitivity Level: MSL 3
- Package Weight: Approximately 3.2 grams
The XCKU11P-2FFVE1517E represents the pinnacle of FPGA technology, combining high logic density with advanced processing capabilities for next-generation applications. Its robust feature set and comprehensive ecosystem make it the ideal choice for demanding hardware acceleration projects.
Keywords: XCKU11P-2FFVE1517E, Kintex UltraScale+, FPGA, AMD Xilinx, high-performance computing, 5G infrastructure, FFVE1517 package
