Product Overview
The XCKU11P-2FFVD900I is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Kintex UltraScale+ family, delivering exceptional price/performance/watt balance in a FinFET node architecture. This industrial-grade FPGA features 408 I/O pins in a 900-ball FCBGA package, making it ideal for demanding applications in networking, data centers, wireless communications, and digital signal processing.
1. Product Specifications
Core Architecture
- Manufacturer: AMD (formerly Xilinx)
- Product Family: Kintex UltraScale+
- Part Number: XCKU11P-2FFVD900I
- Logic Cells: 653,100 cells
- System Logic Cells: 41,984,000
- Look-Up Tables (LUTs): 298,560 blocks
- Flip-Flops: 653,100 macrocells
- Block RAM: 21,100 Kbit
- UltraRAM: On-chip memory for reduced BOM cost
Package Details
- Package Type: 900-BBGA, FCBGA (Flip-Chip Ball Grid Array)
- Ball Pitch: 1 mm
- I/O Count: 408 user I/O pins
- Temperature Grade: Industrial (-I) grade
- Operating Temperature: Industrial temperature range
- Speed Grade: -2 (balanced performance and power)
Power & Performance
- Core Voltage (VCCINT): 0.85V nominal
- Technology Node: 20nm FinFET
- Power Options: Multiple power configurations for optimal performance/power balance
- Static Power: Low static power consumption
- Dynamic Power: Optimized for high-performance applications
Memory & Connectivity
- DDR3 Support: 800Mb/s DDR3 interface capability
- Memory Interface: High-speed memory controller support
- Transceivers: High-performance transceivers for 100G connectivity
- Processing Bandwidth: Highest signal processing bandwidth in mid-range devices
2. Pricing Information
The XCKU11P-2FFVD900I pricing varies based on quantity, distributor, and market conditions. For current pricing and availability:
- Request Quote: Contact authorized distributors for volume pricing
- Real-time Pricing: Monitored by global electronic component suppliers
- Volume Discounts: Available for bulk purchases
- Development Support: Programming tools and starter kits available separately
Note: Prices fluctuate based on market demand and availability. Contact authorized distributors for current quotes and lead times.
3. Documents & Media
Technical Documentation
- Datasheet: XCKU11P-2FFVD900I complete specifications (PDF format)
- User Guides: Kintex UltraScale+ architecture handbook
- Application Notes: Implementation guides and best practices
- Pinout Information: Complete pin mapping and signal descriptions
- Package Drawings: Mechanical specifications and dimensions
Development Resources
- AMD Vivado Design Suite: Primary development environment
- Design Tools: Synthesis, implementation, and debugging tools
- IP Cores: Pre-verified intellectual property blocks
- Reference Designs: Example implementations and tutorials
Support Materials
- Technical Support: Engineering assistance and troubleshooting
- Training Materials: Online courses and documentation
- Community Forums: Developer community and knowledge base
4. Related Resources
Development Platforms
- Evaluation Boards: Compatible development and evaluation platforms
- Starter Kits: Entry-level development solutions
- Reference Boards: Advanced prototyping platforms
Compatible Products
- JTAG Programmers:
- JTAG-SMT2-NC Surface-Mount Programmer
- JTAG-SMT3-NC Programming Module
- Development Boards: ZedBoard, Basys 3, Nexys4-DDR platforms
- Accessories: Programming adapters and debugging tools
Software & Tools
- AMD Vivado Design Suite: Standard and Enterprise editions available
- MicroBlaze Processor: Soft processor running 200+ DMIPs
- System Integration: SSI technology for complex system requirements
Application Areas
- Networking: Nx100G networking and data center applications
- Wireless: MIMO technology and wireless infrastructure
- Digital Signal Processing: High-bandwidth signal processing
- Packet Processing: Network packet processing and acceleration
- Industrial: Automation and control systems
5. Environmental & Export Classifications
RoHS Compliance
- RoHS Status: Compliant – Meets EU RoHS directive requirements
- Lead-Free: Compliant with lead-free soldering requirements
- Hazardous Substances: Restricted substances within allowable limits
- CE Marking: Required for EU market compliance
Environmental Certifications
- SVHC: No Substances of Very High Concern (SVHC) as of 15-Jan-2019
- REACH Compliant: Meets EU REACH regulation requirements
- Green Product: Environmentally conscious manufacturing processes
- Recyclable: Designed for end-of-life recycling
Export & Trade Classifications
- Country of Origin: Manufacturing location per export requirements
- ECCN Classification: Export Control Classification Number for trade compliance
- HTS Code: Harmonized Tariff Schedule classification
- Trade Compliance: Meets international trade regulations
Quality Standards
- ISO Certified: Manufacturing under ISO quality management systems
- Automotive: AEC-Q100 qualified versions available for automotive applications
- Industrial Grade: Extended temperature and reliability specifications
- Supply Chain: Conflict-free mineral sourcing compliance
Key Features & Benefits
Performance Advantages
- Best-in-Class: Optimal price/performance/watt ratio in FinFET technology
- High-Speed Interfaces: Support for high-speed memory and communication protocols
- Advanced DSP: Dedicated DSP blocks for signal processing applications
- Flexible Architecture: Configurable logic blocks for custom implementations
Power Efficiency
- Multiple Power Options: Configurable voltage options (0.85V/0.72V)
- Low Static Power: Reduced standby power consumption
- Dynamic Power Management: Adaptive power scaling based on workload
- Thermal Management: Efficient heat dissipation design
Design Flexibility
- Reconfigurable Logic: Field-programmable for rapid prototyping
- IP Integration: Easy integration of third-party IP cores
- System-on-Chip: Complete system implementation capability
- Scalable Performance: Multiple speed grades available
The XCKU11P-2FFVD900I represents AMD’s commitment to delivering high-performance, energy-efficient FPGA solutions for next-generation applications. With comprehensive development tools, extensive documentation, and global support, this device enables engineers to implement complex digital systems with confidence and efficiency.
