Product Overview
The XCKU11P-2FFVD900E is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Kintex UltraScale+ family. This cutting-edge device delivers exceptional price-to-performance ratio with advanced 20nm FinFET technology, making it ideal for demanding applications in telecommunications, data centers, and high-performance computing.
1. Product Specifications
Core Architecture
- Device Family: Kintex UltraScale+ FPGA
- Part Number: XCKU11P-2FFVD900E
- Speed Grade: -2 (Standard Performance)
- Temperature Grade: E (Extended: 0ยฐC to +85ยฐC)
- Process Technology: 20nm FinFET
Logic Resources
- Logic Cells: 653,100 cells
- Configurable Logic Blocks (CLBs): 37,320
- Lookup Tables (LUTs): 653,100
- Flip-Flops: 1,306,200
- Block RAM: 21,100 Kbit total
- UltraRAM: 38,880 Kbit
- DSP Slices: 2,928 slices
Memory and Processing
- Memory Interface: DDR4, DDR3, LPDDR4 support
- Maximum Memory Bandwidth: High-speed memory controller
- DSP Performance: Up to 933 MHz operation
- Built-in Hard IP: PCIe Gen3, Ethernet MAC, Interlaken
I/O and Connectivity
- User I/O Pins: 408 I/O
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 900-pin FCBGA
- Package Size: 31ร31 mm
- Ball Pitch: 1.0 mm
Power and Performance
- Core Voltage (VCCINT): 0.85V nominal
- I/O Voltage: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
- Power Optimization: Fine-grained clock gating
- Performance: Up to 933 MHz fabric operation
Transceivers
- GTH Transceivers: 12 transceivers
- Line Rate: Up to 16.3 Gb/s per channel
- Protocols Supported: PCIe Gen3, 10G/40G/100G Ethernet, CPRI
- SerDes Technology: Advanced signal integrity
2. Price Information
XCKU11P-2FFVD900E pricing varies based on volume and supplier. Current market indicators show:
- Single Unit Pricing: Contact authorized distributors for current quotes
- Volume Discounts: Available for quantities of 25+ units
- Lead Time: 2-12 weeks depending on stock availability
- Authorized Distributors: Mouser, Digi-Key, Arrow Electronics, Avnet
Note: Prices fluctuate based on market conditions. Contact suppliers directly for the most current pricing information.
Price Comparison Features:
- Real-time pricing from multiple distributors
- Historical price tracking available
- Volume pricing tiers
- Regional pricing variations
3. Documents & Media
Technical Documentation
- Datasheet: XCKU11P-2FFVD900E.pdf (Available for download)
- User Guide: Kintex UltraScale+ FPGAs User Guide
- Product Selection Guide: UltraScale+ FPGAs Product Tables
- Pin Configuration: 900-pin FCBGA pinout diagrams
- Package Specifications: Mechanical drawings and thermal data
Design Resources
- Reference Designs: Available through Xilinx Design Hub
- IP Cores: Compatible with Vivado IP Catalog
- Development Boards: KCU116 Evaluation Kit recommended
- Application Notes: Power management, signal integrity guides
- Packaging Information: Thermal and mechanical specifications
Software Tools
- Vivado Design Suite: Primary development environment
- SDK/Vitis: Software development kit
- System Generator: MATLAB/Simulink integration
- ChipScope Pro: Debug and verification tools
Multimedia Resources
- Product Videos: Architecture overview and features
- Training Materials: Online courses and webinars
- Technical Presentations: Conference papers and white papers
- Community Forums: Xilinx Developer Community support
4. Related Resources
Development Kits and Evaluation Boards
- KCU116 Evaluation Kit: Recommended for XCKU11P evaluation
- Custom Development Boards: Third-party options available
- Starter Kits: Entry-level development platforms
- Academic Program: Educational discounts available
Compatible IP Cores
- Video Processing: 4K/8K video codecs
- Networking: 100G Ethernet, PCIe endpoints
- Signal Processing: FFT, FIR filters, and DSP libraries
- Memory Controllers: DDR4, HBM2 interface IP
- Security: Encryption and authentication cores
Alternative Products
- XCKU11P-1FFVD900E: Lower speed grade option
- XCKU11P-3FFVD900E: Higher performance variant
- XCKU11P-2FFVE1517E: Higher I/O count version
- Competitive Analysis: Intel Arria and Stratix alternatives
Technical Support
- Online Support: Xilinx Support Portal
- Community Forums: Peer-to-peer assistance
- Technical Documentation: Comprehensive design guides
- Training Programs: Professional development courses
- Field Application Engineers: Regional support teams
Application Examples
- 5G Wireless Infrastructure: Baseband processing
- Data Center Acceleration: Machine learning inference
- High-Performance Computing: Scientific computing
- Industrial Automation: Real-time control systems
- Medical Imaging: Signal processing applications
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Yes – Lead-free manufacturing
- WEEE Directive: Compliant with electronic waste regulations
- REACH Regulation: Substance compliance documented
- Halogen-Free: Available upon request
- Conflict Minerals: Compliant with Dodd-Frank Act
Operating Conditions
- Operating Temperature: 0ยฐC to +85ยฐC (Extended grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
- Vibration Resistance: IEC 60068-2-6 compliant
Export Classification
- ECCN (Export Control Classification Number): 3A991.d
- HTS (Harmonized Tariff Schedule): 8542390001
- TARIC Code: 8542399000
- Country of Origin: Varies by manufacturing location
- Export License: Required for certain destinations
Quality Standards
- ISO Certification: ISO 9001:2015 manufacturing
- Quality Grade: Industrial grade reliability
- MTBF: >1 million hours at 55ยฐC junction temperature
- Qualification Standards: JEDEC standards compliance
- Screening: Available for high-reliability applications
Package and Shipping
- Moisture Sensitivity Level: MSL 3
- Package Marking: Date code and traceability information
- Anti-static Protection: ESD-safe packaging
- Tray Packaging: Standard 900-FCBGA tray format
- Shipping Options: Standard, expedited, and secure shipping
Regulatory Approvals
- CE Marking: European Conformity
- FCC Compliance: Electromagnetic compatibility
- IC Certification: Industry Canada approval
- UL Recognition: Safety standards compliance
- International Standards: IEC, ANSI, JIS compliance
Key Features Summary
The XCKU11P-2FFVD900E represents Xilinx’s commitment to delivering high-performance, cost-effective FPGA solutions. With its advanced UltraScale+ architecture, extensive I/O capabilities, and comprehensive development ecosystem, this device is perfectly suited for next-generation applications requiring maximum flexibility and performance.
Primary Applications:
- 5G wireless infrastructure and baseband processing
- High-performance computing and data center acceleration
- Advanced driver assistance systems (ADAS)
- Industrial automation and machine vision
- Medical imaging and diagnostic equipment
Why Choose XCKU11P-2FFVD900E:
- Proven UltraScale+ architecture with 20nm FinFET technology
- Optimal balance of performance, power, and cost
- Comprehensive tool support with Vivado Design Suite
- Extensive IP library and reference designs
- Strong ecosystem support and community resources
