The XCKU11P-2FFVA1156E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered for demanding applications requiring exceptional processing power and versatility. This advanced FPGA delivers outstanding performance for data center acceleration, 5G wireless infrastructure, test and measurement equipment, and high-performance computing applications.
Product Specifications
Core Architecture
- Part Number: XCKU11P-2FFVA1156E
- Family: Kintex UltraScale+
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 914,400
- CLB LUTs: 457,200
- Block RAM: 38.4 Mb total block RAM
- UltraRAM: 22.5 Mb UltraRAM capacity
Advanced Processing Features
- DSP Slices: 1,968 DSP48E2 slices for high-speed signal processing
- PCIe: PCIe Gen3 x16 and PCIe Gen4 x8 interfaces
- Transceivers: 16 GTY transceivers supporting up to 32.75 Gbps
- Speed Grade: -2 (high performance)
- Package: FFVA1156 (1156-pin flip chip array)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
Memory and Connectivity
The XCKU11P-2FFVA1156E features extensive memory resources including distributed RAM, block RAM, and UltraRAM for flexible data storage solutions. Advanced I/O capabilities support DDR4-2666 memory interfaces and various high-speed protocols.
Power and Performance
Built on TSMC’s 16nm FinFET+ process technology, the XCKU11P-2FFVA1156E delivers up to 1.5X better power efficiency compared to previous generation FPGAs while maintaining exceptional performance density.
Price Information
XCKU11P-2FFVA1156E pricing varies based on quantity, distribution channel, and current market conditions. Contact authorized distributors for:
- Volume pricing tiers
- Lead time information
- Custom packaging options
- Engineering support packages
Note: Prices subject to change. Contact suppliers for current XCKU11P-2FFVA1156E pricing and availability.
Documents & Media
Technical Documentation
- Datasheet: Complete XCKU11P-2FFVA1156E specifications and electrical characteristics
- User Guide: Kintex UltraScale+ FPGA implementation guidelines
- Migration Guide: Transitioning from previous FPGA generations
- Package Information: FFVA1156 pinout diagrams and mechanical drawings
Development Resources
- Vivado Design Suite: Latest version compatibility for XCKU11P-2FFVA1156E development
- Reference Designs: Pre-validated IP cores and example implementations
- Application Notes: Best practices for XCKU11P-2FFVA1156E optimization
- Video Tutorials: Step-by-step design flow demonstrations
Software Tools
- Vivado ML: AI-enabled design tools optimized for XCKU11P-2FFVA1156E
- Vitis Unified Platform: Accelerated application development
- IP Catalog: Extensive library of verified IP blocks
Related Resources
Development Boards
- Kintex UltraScale+ Evaluation Boards featuring XCKU11P-2FFVA1156E
- Custom carrier boards for specific application requirements
- FMC expansion modules for enhanced connectivity
Compatible Products
- Memory Solutions: DDR4 SODIMM modules and QDR-IV SRAM
- Power Management: Optimized PMICs for XCKU11P-2FFVA1156E power rails
- Cooling Solutions: Heat sinks and thermal management for high-performance applications
Technical Support
- Community Forums: XCKU11P-2FFVA1156E user discussions and solutions
- Application Engineering: Direct support for complex implementations
- Training Courses: FPGA design methodology and XCKU11P-2FFVA1156E optimization
Third-Party Ecosystem
- Design Services: Certified partners for XCKU11P-2FFVA1156E development
- IP Providers: Specialized cores optimized for Kintex UltraScale+ architecture
- Test Equipment: Validation tools supporting XCKU11P-2FFVA1156E interfaces
Environmental & Export Classifications
Environmental Compliance
The XCKU11P-2FFVA1156E meets stringent environmental standards:
- RoHS Compliant: Lead-free manufacturing and materials
- WEEE Directive: Compliant with electronic waste regulations
- REACH Regulation: Substance of Very High Concern (SVHC) compliance
- Conflict Minerals: Responsible sourcing certification
Export Control Information
- ECCN Classification: Export Control Classification Number per US regulations
- Country of Origin: Manufacturing location details
- Trade Compliance: International shipping and customs documentation
- Restricted Countries: Export limitation guidelines
Quality and Reliability
- Automotive Grade: AEC-Q100 qualified versions available
- Military/Aerospace: Extended temperature and radiation-tolerant variants
- Quality Standards: ISO 9001 certified manufacturing
- Reliability Testing: Comprehensive qualification and characterization data
Package and Shipping
- Moisture Sensitivity: Level 3 (MSL-3) classification
- Anti-Static Protection: ESD-safe packaging and handling requirements
- Traceability: Full lot tracking and quality documentation
- Shelf Life: Storage recommendations and handling guidelines
The XCKU11P-2FFVA1156E represents the pinnacle of FPGA technology, combining exceptional performance, power efficiency, and design flexibility for next-generation applications. Contact authorized distributors for detailed specifications, pricing, and technical support.
