The XCKU11P-1FFVE1517E is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance-per-watt efficiency in advanced applications. This cutting-edge FPGA combines superior processing capabilities with cost-effective implementation, making it ideal for demanding applications in telecommunications, aerospace, industrial automation, and high-performance computing.
1. Product Specifications
Core Architecture
- Part Number: XCKU11P-1FFVE1517E
- Family: AMD Xilinx Kintex UltraScale+
- Manufacturing Process: 20nm FinFET technology
- Speed Grade: -1 (industrial temperature range)
- Package: FFVE1517 (1517-pin Flip Chip Ball Grid Array)
- Core Voltage: 0.85V (VCCINT)
Logic Resources
- Logic Cells: 653,100 system logic cells
- Logic Blocks: 298,560 configurable logic blocks (CLBs)
- Look-Up Tables (LUTs): 274,080 6-input LUTs
- Flip-Flops: 548,160 flip-flops
- I/O Pins: 512 user I/O pins
Memory Specifications
- Block RAM: 21,100 Kbit (1,560 KB) total block RAM
- UltraRAM: 56 Mb of on-chip UltraRAM for enhanced storage capacity
- Distributed RAM: Integrated within CLBs for flexible memory implementation
Digital Signal Processing
- DSP Slices: 2,520 DSP48E2 slices
- DSP Performance: Optimized for high-throughput signal processing applications
- Multiply-Accumulate Units: Advanced MAC capabilities for complex calculations
High-Speed Connectivity
- Transceivers: Up to 48 high-speed GTH transceivers
- Transceiver Speed: Up to 16.3 Gbps per channel
- PCIe Support: PCIe Gen3 x16 interface capability
- Memory Interface: DDR4, DDR3, QDR-IV support
Clock and Timing
- Clock Management: Mixed-Mode Clock Managers (MMCM) and Phase-Locked Loops (PLL)
- Maximum Operating Frequency: 667 MHz
- Clock Networks: Global and regional clock distribution networks
Operating Conditions
- Temperature Range: Extended commercial (0ยฐC to 85ยฐC)
- Core Supply Voltage: 825mV to 876mV
- I/O Supply Voltage: 1.2V to 3.3V
- Static Power: Optimized for low-power applications
2. Price Information
The XCKU11P-1FFVE1517E pricing varies based on quantity and supplier. Current market pricing from authorized distributors includes:
Volume Pricing Tiers
- Single Unit (1+): Approximately $5,400 – $6,500 USD
- Small Volume (10+): $5,100 – $6,200 USD
- Medium Volume (100+): $4,800 – $5,900 USD
- Large Volume (1000+): Contact supplier for volume discounts
Price Considerations
- Prices subject to market fluctuations and availability
- Extended lead times may affect pricing (typically 25+ weeks from manufacturer)
- Volume discounts available for quantities over 100 units
- Contact authorized distributors for current quotes and availability
Note: Pricing information is subject to change. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Official Datasheet: Available from AMD Xilinx technical documentation portal
- User Guide: UltraScale+ FPGAs Configuration User Guide (UG570)
- Package and Pinout Guide: UltraScale Architecture Package and Pinout Product Specification (UG575)
- DC and AC Switching Characteristics: Complete electrical specifications
- PCB Design Guidelines: Layout recommendations and thermal considerations
Design Resources
- Vivado Design Suite: Primary development environment for XCKU11P-1FFVE1517E
- IP Cores: Extensive library of verified IP blocks
- Reference Designs: Application-specific reference implementations
- Board Design Files: PCB footprints and 3D models available
CAD Models and Symbols
- Schematic Symbols: Compatible with major EDA tools (Altium, OrCAD, KiCad)
- PCB Footprints: FCBGA-1517 package footprint files
- 3D Models: Mechanical models for system design verification
- IBIS Models: Signal integrity simulation models
Application Notes
- Power Management: Guidelines for efficient power distribution
- Thermal Management: Heat dissipation and cooling requirements
- Signal Integrity: High-speed design best practices
- Configuration Methods: JTAG, SPI, and BPI configuration options
4. Related Resources
Development Tools
- Vivado Design Suite: Complete FPGA development environment
- Vivado HLS: High-Level Synthesis for C/C++ to hardware conversion
- PetaLinux Tools: Embedded Linux development platform
- SDK/Vitis: Software development kit for embedded applications
Evaluation Platforms
- Kintex UltraScale+ Evaluation Boards: Compatible development platforms
- FMC Connector Support: Expansion modules for rapid prototyping
- Reference Design Kits: Pre-configured development environments
Compatible Products
- XCKU15P-1FFVE1517E: Higher capacity variant in same package
- XCKU11P-2FFVE1517E: Higher speed grade (-2) version
- XCKU9P-1FFVE900I: Lower pin count alternative
Programming and Configuration
- JTAG Programming Cables: Platform Cable USB II, Vivado Programming Cable
- Configuration Memory: Compatible QSPI, BPI, and SPI flash devices
- Multi-boot Capability: Support for multiple configuration images
Technical Support
- AMD Xilinx Forums: Community-driven technical support
- Application Engineering: Direct support for complex implementations
- Training Resources: Online courses and certification programs
- Knowledge Base: Comprehensive troubleshooting and FAQ database
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant (2015/863/EU)
- REACH Compliance: No Substances of Very High Concern (SVHC) as of January 2025
- Conflict Minerals: Compliant with Dodd-Frank Act Section 1502
- WEEE Directive: Compliant with EU Waste Electrical and Electronic Equipment regulations
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7.b
- HTS Code (US): 8542390001
- TARIC Code (EU): 8542399000
- Country of Origin: Varies by manufacturing location
Quality and Reliability
- Quality Standard: ISO 9001:2015 certified manufacturing
- Automotive Grade: Not AEC-Q100 qualified (commercial grade)
- Operating Life: 20+ years typical under normal operating conditions
- MTBF: Mean Time Between Failures data available in reliability reports
Packaging and Handling
- ESD Sensitivity: Class 1 (<1000V) – ESD precautions required
- Moisture Sensitivity: Level 3 (168 hours at 30ยฐC/60% RH after bag opening)
- Storage Temperature: -55ยฐC to +150ยฐC
- Shipping Package: Anti-static tray packaging
Regulatory Approvals
- CE Marking: Compliant for European market
- FCC Part 15: Suitable for use in FCC-regulated equipment
- IC (Industry Canada): Compliant with Canadian regulations
- UL Recognition: Component recognition where applicable
The XCKU11P-1FFVE1517E represents AMD Xilinx’s commitment to delivering high-performance, power-efficient FPGA solutions for next-generation applications. This device combines the flexibility of programmable logic with the performance advantages of the UltraScale+ architecture, making it an ideal choice for demanding applications requiring superior processing capabilities and connectivity options.
Keywords: XCKU11P-1FFVE1517E, AMD Xilinx FPGA, Kintex UltraScale+, high-performance FPGA, 20nm FinFET, programmable logic, DSP slices, UltraRAM, GTH transceivers
