The XCKU11P-1FFVD900I is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications requiring high-speed processing and advanced connectivity. This FPGA combines cutting-edge 16nm FinFET+ technology with versatile I/O capabilities, making it ideal for aerospace, defense, communications, and high-performance computing applications.
Product Specifications
The XCKU11P-1FFVD900I features robust specifications that make it suitable for complex digital signal processing and system integration tasks. This Kintex UltraScale+ FPGA includes 1,143,000 system logic cells and 5,712 DSP slices, providing substantial computational resources for parallel processing applications.
Key technical specifications for the XCKU11P-1FFVD900I include a speed grade of -1, indicating optimized performance characteristics for demanding timing requirements. The device utilizes the FFVD900 package, which is a 900-pin fine-pitch ball grid array (BGA) that provides excellent thermal performance and signal integrity. Operating temperature range spans from 0ยฐC to 85ยฐC for commercial applications.
The XCKU11P-1FFVD900I incorporates 38.4 Mb of block RAM and 75.9 Mb of UltraRAM, offering flexible memory options for data buffering and storage. Advanced clocking resources include 24 clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs) for precise timing control.
High-speed transceivers are a standout feature of the XCKU11P-1FFVD900I, with 32 GTY transceivers supporting data rates up to 32.75 Gbps. These transceivers enable high-bandwidth communication protocols and interfaces essential for modern system designs.
Price Information
Pricing for the XCKU11P-1FFVD900I varies based on quantity, distribution channel, and market conditions. Contact authorized AMD Xilinx distributors for current pricing and availability information. Volume pricing discounts are typically available for production quantities.
Educational and research institutions may qualify for special academic pricing programs. Development boards and evaluation kits containing the XCKU11P-1FFVD900I are available at different price points to support prototyping and proof-of-concept development.
Documents & Media
Comprehensive documentation supports the XCKU11P-1FFVD900I implementation and design process. The official datasheet provides detailed electrical specifications, timing parameters, and package information essential for board-level design and integration.
AMD Xilinx provides extensive design resources including the Kintex UltraScale+ FPGA Data Sheet, which covers the complete XCKU11P-1FFVD900I family specifications. Additional resources include application notes, reference designs, and white papers demonstrating best practices for implementing designs with this FPGA.
The Vivado Design Suite documentation includes specific guidance for targeting the XCKU11P-1FFVD900I, covering synthesis, implementation, and debugging procedures. Training materials and video tutorials are available through AMD Xilinx’s online learning platform.
Product selection guides help engineers compare the XCKU11P-1FFVD900I against other Kintex UltraScale+ devices to ensure optimal device selection for specific application requirements.
Related Resources
Development tools and software support for the XCKU11P-1FFVD900I include the Vivado Design Suite, which provides a complete design environment for FPGA development. The Vitis unified software platform enables software-defined hardware acceleration and embedded software development.
Evaluation boards and development kits featuring the XCKU11P-1FFVD900I accelerate prototype development and design verification. These platforms include reference designs, example code, and hardware interfaces that demonstrate the FPGA’s capabilities.
Third-party IP cores and design services are available from AMD Xilinx Alliance Program partners, providing pre-verified solutions for common functions like signal processing, communications protocols, and interface standards.
The AMD Xilinx Developer Zone offers community forums, design examples, and technical support resources specifically for Kintex UltraScale+ devices including the XCKU11P-1FFVD900I.
Environmental & Export Classifications
The XCKU11P-1FFVD900I meets stringent environmental and reliability standards required for commercial and industrial applications. RoHS compliance ensures environmental responsibility in manufacturing and disposal processes.
Export classification information for the XCKU11P-1FFVD900I is available through AMD Xilinx’s export control documentation. Engineers should consult current export regulations and classification codes when designing products for international markets or applications subject to export controls.
Operating temperature range, storage conditions, and reliability specifications are detailed in the device datasheet. The XCKU11P-1FFVD900I is designed to meet automotive and industrial temperature requirements for extended operational life in demanding environments.
Quality and reliability testing includes accelerated life testing, thermal cycling, and electromagnetic compatibility (EMC) validation to ensure consistent performance across production lots and operating conditions.
The XCKU11P-1FFVD900I represents AMD Xilinx’s commitment to delivering high-performance FPGA solutions for next-generation applications requiring advanced processing capabilities and flexible connectivity options.
