The XCKU11P-1FFVD900E is a premium field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered for demanding applications requiring exceptional processing power and versatility. This advanced FPGA delivers outstanding performance for telecommunications, aerospace, defense, and high-performance computing applications.
Product Specifications
The XCKU11P-1FFVD900E features robust architecture designed for complex digital signal processing and high-speed data applications:
Core Specifications:
- Device Family: Kintex UltraScale+
- Logic Cells: 1,143,000 system logic cells
- Package Type: FFVD900 (Fine-Pitch Ball Grid Array)
- Speed Grade: -1 (standard performance)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Total I/O Pins: 624 user I/O pins
- DSP Slices: 1,968 DSP48E2 slices for advanced signal processing
Memory and Processing:
- Block RAM: 38.4 Mb total block RAM capacity
- UltraRAM: 360 Mb distributed memory
- Configuration Memory: 164 Mb for bitstream storage
- Processing Power: Up to 926 GMACs peak DSP performance
Advanced Features:
- 16nm FinFET+ process technology for optimal power efficiency
- High-speed serial transceivers supporting up to 32.75 Gbps
- PCIe Gen4 compatibility for modern system integration
- 100G Ethernet MAC support for network applications
Price
The XCKU11P-1FFVD900E is available through authorized distributors with competitive pricing based on volume requirements. Contact AMD Xilinx partners for current pricing and availability. Educational discounts and volume pricing options are available for qualifying customers.
Typical lead times range from 12-16 weeks for standard orders, with expedited delivery options available for urgent requirements.
Documents & Media
Technical Documentation:
- Product Brief and datasheet with complete electrical specifications
- UltraScale+ FPGA configuration user guide
- Package thermal and mechanical specifications
- Pin assignment and PCB layout guidelines
- Power estimation tools and thermal analysis guides
Development Resources:
- Vivado Design Suite compatibility matrix
- Reference designs for common applications
- Application notes for optimal implementation
- Video tutorials and webinar recordings
- Community forum support and knowledge base
Software Tools:
- Vivado ML Enterprise Edition support
- Vitis unified software platform compatibility
- IP catalog with pre-verified intellectual property cores
- System-level design tools and simulation models
Related Resources
Compatible Development Boards:
- Kintex UltraScale+ evaluation kits
- Third-party development platforms supporting XCKU11P-1FFVD900E
- Custom carrier board reference designs
IP Cores and Solutions:
- High-speed connectivity IP (PCIe, Ethernet, USB)
- Digital signal processing IP library
- Video and imaging processing solutions
- Cryptographic and security IP cores
Training and Support:
- AMD Xilinx University Program resources
- Technical training courses and certification programs
- Design consulting services and application support
- Global technical support network
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant lead-free package assembly
- REACH regulation compliance for European markets
- Conflict minerals reporting compliance
- ISO 14001 environmental management certification
Export Control Information:
- ECCN (Export Control Classification Number): 3A991.a.2
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Various (final assembly location dependent)
- Export licensing requirements may apply for certain destinations
Quality and Reliability:
- AEC-Q100 automotive qualification available in select variants
- Military temperature grade options (-55ยฐC to +125ยฐC)
- Extended reliability testing and qualification data
- Statistical quality control and traceability documentation
The XCKU11P-1FFVD900E represents cutting-edge FPGA technology, combining high performance with development flexibility for next-generation electronic systems. Its comprehensive feature set and robust support ecosystem make it an ideal choice for engineers developing advanced digital solutions across multiple industries.
