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XCF08PV0G48BRT – Platform Flash In-System Programmable Configuration PROM

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Features

  • Memory Type: Platform Flash In-System Programmable Configuration PROM
  • Memory Capacity: 8 Megabits (1 Megabyte)
  • Supply Voltage: 1.8V ยฑ5% (1.71V to 1.89V)
  • Package Type: TSSOP-48 (Thin Shrink Small Outline Package)
  • Pin Count: 48 pins
  • Operating Temperature Range: -40ยฐC to +85ยฐC (Industrial Grade)
  • Clock Frequency: Up to 50MHz

Electrical Characteristics

  • Supply Voltage Range: 1.65V to 2.0V
  • I/O Pin Voltage Compatibility: 1.5V to 3.3V
  • Program/Erase Endurance: 20,000 cycles minimum
  • Data Retention: 20 years minimum
  • Access Time: Fast read access with serial interface

Interface and Configuration Modes

  • Interface Types: Serial, Parallel, JTAG (IEEE 1149.1/1532)
  • Supported FPGA Configuration Modes:
    • Master Serial Configuration
    • Slave Serial Configuration
    • Master SelectMAP Configuration
    • Slave SelectMAP Configuration
  • Cascadable: Supports daisy-chaining for larger bitstreams
  • Boundary-Scan Support: IEEE Standard 1149.1/1532 compliant

Physical Specifications

  • Package Dimensions: Standard TSSOP-48 footprint
  • Mounting Type: Surface Mount Device (SMD)
  • RoHS Compliance: RoHS compliant (lead-free)
  • Moisture Sensitivity Level: MSL-3

2. Pricing

Current Market Pricing (2025)

Note: Prices are subject to market conditions and availability. Contact authorized distributors for current pricing.

  • Unit Price (1-99 pieces): $35.00 – $45.00 USD
  • Volume Pricing (100-499 pieces): $28.00 – $38.00 USD
  • High Volume (1000+ pieces): $22.00 – $32.00 USD
  • Lead Time: 12-16 weeks (subject to semiconductor supply chain conditions)

Pricing Factors

  • Global semiconductor supply chain constraints
  • Demand fluctuations in FPGA market
  • Currency exchange rates
  • Minimum order quantities (MOQ) apply
  • Extended lead times due to manufacturing capacity

For accurate pricing and availability, please contact authorized AMD Xilinx distributors such as Digi-Key, Mouser Electronics, Avnet, or Arrow Electronics.

3. Documents & Media

Official Documentation

  • Product Datasheet: Platform Flash In-System Programmable Configuration PROMs (DS123)
  • Programming Guide: Platform Flash PROM Programming Guide
  • Application Notes:
    • Configuration Memory Interface Guidelines
    • FPGA Configuration Best Practices
    • Boundary-Scan Programming Procedures

Software Tools

  • AMD Vivado Design Suite: Primary development environment
  • IMPACT Programming Tool: For device programming and verification
  • iMPACT Configuration Tool: Legacy configuration utility
  • ChipScope Pro: For debugging and verification

Package Documentation

  • Package Specification: TSSOP-48 mechanical drawings
  • Footprint Guidelines: PCB layout recommendations
  • Thermal Considerations: Heat dissipation guidelines
  • Soldering Profiles: Recommended reflow soldering parameters

Reference Designs

  • Basic FPGA configuration circuits
  • Multi-device configuration examples
  • Boundary-scan test implementations
  • Power sequencing circuits

4. Related Resources

Compatible FPGA Families

  • Virtex Series: Virtex-4, Virtex-5, Virtex-6
  • Spartan Series: Spartan-3, Spartan-6
  • Kintex Series: Kintex-7 and newer (with appropriate interfaces)
  • Zynq Series: Zynq-7000 family

Development Tools

  • Evaluation Boards: Various Xilinx FPGA development boards
  • Programming Cables: Platform Cable USB, Digilent programming cables
  • Debug Tools: ChipScope integrated logic analyzer
  • Design Software: Vivado, ISE Design Suite (legacy)

Alternative Part Numbers

  • XCF08PV0G48BTT (TSOP-48 package variant)
  • XCF08PVOG48C (alternative package option)
  • XCF16PV0G48BRT (16Mb capacity version)
  • XCF04PV0G48BRT (4Mb capacity version)

Support Resources

  • AMD Xilinx Community Forums
  • Technical Support Portal
  • Application Engineering Support
  • Training and Certification Programs
  • Knowledge Base Articles

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Directive 2011/65/EU: Fully compliant (lead-free)
  • REACH Regulation: Compliant with current SVHC list
  • Conflict Minerals: 3TG conflict-free sourcing
  • ISO 14001: Environmental management system certified manufacturing

Operating Environment

  • Temperature Range: -40ยฐC to +85ยฐC (Industrial grade)
  • Humidity Range: 5% to 95% non-condensing
  • Altitude: Up to 2000 meters
  • Vibration Resistance: IEC 60068-2-6 compliant
  • Shock Resistance: IEC 60068-2-27 compliant

Export Control Classifications

  • ECCN (Export Control Classification Number): 3A991.a.2
  • HTS (Harmonized Tariff Schedule): 8542.32.0040
  • Country of Origin: Varies by manufacturing location
  • CCATS (Commodity Classification Automated Tracking System): Available upon request

Regulatory Certifications

  • CE Marking: European Conformity compliant
  • FCC: Compliant for electronic devices
  • IC: Industry Canada compliant
  • UL Recognition: Available for safety-critical applications

Packaging and Shipping

  • Packaging: Anti-static tray packaging
  • Shipping Classifications: Not hazardous material
  • Storage Requirements: Cool, dry storage conditions
  • Shelf Life: 10 years in original packaging

Manufacturer: AMD (formerly Xilinx)
Product Family: Platform Flash Configuration Memory
Part Number: XCF08PV0G48BRT
Document Version: 1.0
Last Updated: June 2025

For the most current specifications, pricing, and availability, please consult the official AMD Xilinx documentation and authorized distributors.