Product Specifications
Key Technical Features
- Memory Capacity: 2 Mbit (256K x 8-bit organization)
- Package Type: TSSOP-20 (Thin Shrink Small Outline Package)
- Pin Count: 20 pins
- Operating Voltage: 3.3V ยฑ 10%
- Technology: Serial EEPROM/Flash PROM
- Programming Interface: In-System Programmable via JTAG
Performance Characteristics
- Configuration Modes Supported:
- Master Serial Mode
- Slave Serial Mode
- Programming Standards: IEEE 1149.1/1532 Boundary-Scan (JTAG) compliant
- Fast Read/Reset Capability: Optimized for efficient FPGA configuration
- Data Retention: > 20 years at 85ยฐC
- Endurance: > 10,000 program/erase cycles
Physical Specifications
- Package Dimensions: TSSOP-20 plastic package
- Lead Pitch: 0.65mm
- Operating Temperature Range: 0ยฐC to +70ยฐC (Commercial grade)
- Storage Temperature Range: -65ยฐC to +150ยฐC
Electrical Characteristics
- Supply Current: Low power consumption design
- Input/Output Levels: CMOS compatible
- Power Consumption: Typically 10-20 mW during operation
Price
The XCF02SV0G20C is competitively priced in the electronic components market with volume pricing available:
- Small Quantities (1-147 units): Contact for pricing
- Volume Pricing (148+ units): Starting from approximately $20.23 per unit
- Large Volume (1,480+ units): Reduced to approximately $19.16 per unit
- Industrial Volume (14,800+ units): Further discounts to $18.63 per unit
Pricing may vary by distributor and market conditions. Contact authorized distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Official Datasheet: Available in PDF format from AMD/Xilinx
- Application Notes: Configuration guidelines and best practices
- PCB Footprint: CAD models available for TSSOP-20 package
- Symbol Libraries: EDA/CAD symbol files for design integration
Reference Materials
- Programming Guide: JTAG programming procedures and timing specifications
- Design Guidelines: Layout recommendations and thermal considerations
- Software Tools: Vivado Design Suite compatibility information
- Configuration Examples: Sample designs and implementation guides
Media Resources
- Product Images: High-resolution package photos and pin diagrams
- 3D Models: CAD models for mechanical design verification
- Video Tutorials: Programming and implementation demonstrations
Related Resources
Development Tools
- Vivado Design Suite: Primary development environment for Xilinx FPGAs
- Programming Cables: Compatible JTAG programming hardware
- Evaluation Boards: Development platforms featuring XCF02S family devices
Compatible FPGA Families
- Spartan Series: Optimized for cost-sensitive applications
- Artix-7 Family: Low-power, high-performance FPGAs
- Kintex Series: Mid-range FPGAs for balanced performance
- Zynq UltraScale+: SoC devices with ARM processing systems
Application Areas
- Aerospace & Defense: Avionics and military systems requiring reliable configuration storage
- Automotive Electronics: Body electronics, infotainment, and ADAS systems
- Industrial Automation: Process control, robotics, and factory automation
- Test & Measurement: Instrumentation and data acquisition systems
- Enterprise Systems: Network infrastructure and server applications
Alternative Part Numbers
- XCF02SVOG20C: Alternative ordering code for the same device
- XCF04SV0G20C: 4-Mbit version for larger configuration requirements
- XCF01SV0G20C: 1-Mbit version for smaller FPGA configurations
Environmental & Export Classifications
RoHS Compliance
The XCF02SV0G20C is fully compliant with the European Union’s Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, also known as RoHS 2. This device meets all requirements for:
- Lead-free manufacturing: Contains less than 0.1% lead by weight
- Mercury-free: No mercury content in materials or manufacturing process
- Cadmium-free: Compliant with cadmium restrictions
- Hexavalent chromium-free: No Cr6+ in manufacturing processes
- Halogen-free: Meets requirements for bromine and chlorine restrictions
REACH Compliance
Compliant with the European Union’s Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) Regulation (EC) No 1907/2006. The device contains no Substances of Very High Concern (SVHC) above the 0.1% threshold requiring disclosure.
Environmental Certifications
- Green Technology: Manufactured using environmentally responsible processes
- Recyclable Materials: Package materials are recyclable
- Energy Efficient: Low power consumption reduces environmental impact
- Conflict Minerals Compliant: Sourced materials comply with conflict minerals regulations
Export Control Information
- ECCN Classification: Check current export control classification
- Country of Origin: Manufacturing location information available upon request
- Export Restrictions: Standard semiconductor export guidelines apply
- Trade Compliance: Meets international trade requirements
Quality Standards
- ISO 9001: Manufactured under ISO 9001 quality management systems
- Automotive Grade: Available in automotive-qualified versions
- Industrial Temperature: Extended temperature range options available
- Reliability Testing: Extensive qualification and reliability testing performed
Packaging & Shipping
- Anti-static Packaging: Shipped in anti-static protective packaging
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) rated packaging
- Global Shipping: Available through worldwide distribution network
- Lead Time: Standard lead times vary by region and volume requirements
The XCF02SV0G20C represents AMD Xilinx’s commitment to providing reliable, high-performance configuration memory solutions for next-generation FPGA designs. With its robust feature set, environmental compliance, and comprehensive support ecosystem, this device is the ideal choice for applications requiring dependable FPGA configuration storage.
