The XC7K355T-2FFG901C is a powerful field-programmable gate array (FPGA) from Xilinx’s Kintex-7 family, designed to deliver exceptional performance for demanding digital signal processing, embedded processing, and connectivity applications. This advanced FPGA combines high logic capacity with superior power efficiency, making it an ideal choice for aerospace, defense, communications, and industrial automation systems.
Product Specifications
The XC7K355T-2FFG901C features robust specifications that enable complex system implementations:
Logic Resources:
- Logic cells: 356,650
- Configurable Logic Blocks (CLBs): 55,650
- Block RAM: 25.2 Mb
- DSP slices: 1,440
Memory and Processing:
- Distributed RAM: 2.4 Mb total
- Block RAM blocks: 890
- 36 Kb block RAM: 445 blocks
- 18 Kb block RAM: 890 blocks
I/O and Connectivity:
- Package: FFG901 (Fine-pitch Ball Grid Array)
- Total I/O pins: 500
- User I/O: 350
- Speed grade: -2 (standard performance)
- Operating voltage: 1.0V core, 1.8V/2.5V/3.3V I/O
Advanced Features:
- Built-in ARM Cortex-A9 dual-core processor system
- Integrated memory controllers
- High-speed serial transceivers
- Advanced DSP capabilities
- Low-power consumption architecture
Pricing Information
The XC7K355T-2FFG901C pricing varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders exceeding 100 units. Educational and research institutions may qualify for special academic pricing programs.
Documents & Media
Essential documentation for the XC7K355T-2FFG901C includes:
Technical Documentation:
- Kintex-7 FPGA Data Sheet (DS182)
- XC7K355T-2FFG901C Product Brief
- Kintex-7 FPGA Packaging and Pinout Specifications
- PCB Design Guidelines for FFG901 Package
- Power and Thermal Management Guide
Design Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Evaluation board schematics and layouts
- Signal integrity simulation models
- Thermal simulation models
Software Tools:
- Vivado Design Suite support files
- IP core libraries and documentation
- Programming and configuration guides
- Debug and verification tools documentation
Related Resources
The XC7K355T-2FFG901C ecosystem includes comprehensive development resources:
Development Boards:
- Kintex-7 FPGA KC705 Evaluation Kit
- Custom evaluation platforms from third-party vendors
- Prototype development boards
IP Cores and Solutions:
- Xilinx IP core library compatibility
- DSP IP cores for signal processing applications
- Memory interface IP cores
- Communication protocol IP cores
Design Tools:
- Vivado Design Suite (synthesis, implementation, debugging)
- Vivado HLS for high-level synthesis
- SDK for embedded software development
- ChipScope Pro for real-time debugging
Community and Support:
- Xilinx Developer Zone resources
- Community forums and user groups
- Technical support channels
- Training courses and webinars
Environmental & Export Classifications
The XC7K355T-2FFG901C meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant (lead-free)
- REACH regulation compliance
- Conflict minerals compliance
- Environmental management system certifications
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Industrial temperature range: -40ยฐC to +100ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: up to 3,000 meters
Export Control Classification:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of origin classification available
- Export licensing requirements may apply for certain destinations
Quality and Reliability:
- Automotive qualification available (selected grades)
- Military temperature range options
- Extended lifecycle support programs
- Comprehensive quality assurance testing
The XC7K355T-2FFG901C represents a proven solution for high-performance FPGA applications, offering the flexibility, performance, and reliability required for next-generation electronic systems. Its combination of advanced features, comprehensive development ecosystem, and regulatory compliance makes it suitable for a wide range of commercial, industrial, and aerospace applications.
