“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XC7K325T-L2FFG900E: High-Performance Kintex-7 FPGA for Advanced Digital Design

Original price was: $20.00.Current price is: $19.00.

The XC7K325T-L2FFG900E is a powerful Kintex-7 FPGA (Field-Programmable Gate Array) from AMD Xilinx, designed to deliver exceptional performance for demanding digital signal processing, communications, and high-speed interface applications. This advanced programmable logic device combines high logic density with energy efficiency, making it ideal for complex system designs.

Product Specification

The XC7K325T-L2FFG900E features impressive technical specifications that position it as a premium solution for sophisticated electronic designs:

Core Architecture:

  • Logic Cells: 325,000 system logic cells
  • CLB Slices: 50,950 configurable logic blocks
  • Block RAM: 16,020 Kb total block memory
  • DSP Slices: 840 DSP48E1 slices for high-performance signal processing

Memory and Processing:

  • Distributed RAM: 1,600 Kb
  • Memory Controllers: Integrated memory interface blocks
  • Processing Speed: Up to 464 MHz internal clock frequency
  • Architecture: 28nm HPL (High Performance Low Power) process technology

I/O and Connectivity:

  • Package: FFG900 (Fine-pitch Ball Grid Array)
  • Total I/O Pins: 500 user I/O pins
  • High-Speed Transceivers: 16 GTX transceivers supporting up to 12.5 Gbps
  • Voltage: Low-power L2 speed grade for optimized power consumption

Interface Support:

  • PCIe Gen2 x8 and Gen3 x4 endpoint and root port
  • 10/100/1000 Ethernet MAC
  • Interlaken, Aurora, and other high-speed protocols

The XC7K325T-L2FFG900E delivers exceptional performance with its advanced 28nm technology, providing the perfect balance of logic density, performance, and power efficiency for next-generation designs.

Price

The XC7K325T-L2FFG900E pricing varies based on quantity, distribution channel, and current market conditions. Contact authorized AMD Xilinx distributors for current pricing and availability information. Volume discounts are typically available for production quantities, and pricing may vary between different regions and suppliers.

For the most accurate XC7K325T-L2FFG900E pricing information, consult with:

  • Official AMD Xilinx sales representatives
  • Authorized electronic component distributors
  • Industry-specific solution providers

Documents & Media

Essential documentation and resources for the XC7K325T-L2FFG900E include:

Technical Documentation:

  • Product datasheet with complete electrical specifications
  • Kintex-7 FPGA family user guide
  • Package and pinout documentation for FFG900 package
  • Power consumption and thermal design guidelines

Design Resources:

  • Vivado Design Suite compatibility information
  • IP core integration guides
  • Reference designs and application notes
  • Development board schematics and layouts

Software Tools:

  • Vivado Design Suite for synthesis and implementation
  • SDK (Software Development Kit) for embedded processor designs
  • ChipScope Pro for debugging and verification
  • Power estimation and analysis tools

Related Resources

The XC7K325T-L2FFG900E ecosystem includes comprehensive development resources:

Development Platforms:

  • Kintex-7 evaluation boards and development kits
  • Custom carrier boards and modules
  • Third-party development platforms supporting the XC7K325T-L2FFG900E

IP Cores and Solutions:

  • Vivado IP catalog with hundreds of verified IP cores
  • DSP and communication protocol stacks
  • Memory controllers and interface IP
  • Video and image processing solutions

Design Services:

  • AMD Xilinx Alliance Partner network
  • Professional design and consulting services
  • Training and certification programs
  • Community forums and technical support

Environmental & Export Classifications

The XC7K325T-L2FFG900E meets stringent environmental and regulatory standards:

Environmental Compliance:

  • RoHS (Restriction of Hazardous Substances) compliant
  • REACH regulation compliance
  • Conflict minerals reporting compliance
  • Environmental management system certifications

Operating Conditions:

  • Commercial temperature range: 0ยฐC to +85ยฐC
  • Extended temperature variants available
  • Moisture sensitivity level and storage requirements
  • ESD (Electrostatic Discharge) protection standards

Export Classifications:

  • ECCN (Export Control Classification Number) compliance
  • International trade regulation adherence
  • Country-specific import/export requirements
  • Documentation for customs and regulatory approval

Quality Standards:

  • ISO 9001 quality management system
  • Automotive qualification standards (where applicable)
  • Military and aerospace standards compliance options
  • Comprehensive quality assurance and testing procedures

The XC7K325T-L2FFG900E represents AMD Xilinx’s commitment to delivering high-performance, reliable FPGA solutions that meet the demanding requirements of modern digital design applications while maintaining full regulatory compliance and environmental responsibility.