The XC7K325T-L2FBG900E is a premium field-programmable gate array (FPGA) from Xilinx’s Kintex-7 family, engineered to deliver exceptional performance for demanding digital signal processing, communications, and high-speed interface applications. This FPGA combines advanced 28nm technology with optimized power efficiency, making it an ideal choice for next-generation embedded systems and industrial solutions.
Product Specifications
The XC7K325T-L2FBG900E features robust specifications designed for high-performance applications:
Core Architecture:
- Logic Cells: 326,080
- CLB Slices: 50,950
- Block RAM: 16,020 Kb
- DSP Slices: 840
- CMTs (Clock Management Tiles): 10
- MMCM/PLL: 10/20
Memory and Processing:
- Distributed RAM: 1,188 Kb
- Maximum Memory Interfaces: 4
- PCIe Blocks: 1
- GTX Transceivers: 16
- Maximum Transceiver Speed: 12.5 Gbps
Package Details:
- Package Type: FBGA (Fine Ball Grid Array)
- Pin Count: 900 pins
- Operating Temperature: -40ยฐC to +100ยฐC (Extended Industrial)
- Supply Voltage: 1.0V core, 1.8V/2.5V/3.3V I/O
Performance Characteristics:
- Speed Grade: -2L (Low Power)
- Maximum Operating Frequency: Up to 464 MHz
- Power Consumption: Optimized for low-power applications
- Processing Performance: Up to 930 GMAC/s
Price Information
The XC7K325T-L2FBG900E pricing varies based on quantity, supplier, and market conditions. Current market pricing typically ranges from $800 to $1,200 per unit for standard quantities. Volume discounts are available for orders exceeding 100 units. For accurate pricing and availability, contact authorized Xilinx distributors or check electronic component marketplaces. Educational and development pricing may be available for qualifying institutions and projects.
Documents & Media
Essential documentation for the XC7K325T-L2FBG900E includes:
Technical Documentation:
- Kintex-7 FPGAs Data Sheet (DS182)
- XC7K325T-L2FBG900E Product Brief
- Kintex-7 FPGA Package and Pinout Specifications
- Power and Thermal Design Guidelines
- PCB Design and Layout Guidelines
Development Resources:
- Vivado Design Suite compatibility guides
- Reference designs and application notes
- Hardware description language (HDL) examples
- Constraint files and timing specifications
Quality and Reliability:
- Product Change Notifications (PCNs)
- Quality and reliability reports
- Environmental compliance certificates
- RoHS and REACH compliance documentation
Related Resources
The XC7K325T-L2FBG900E ecosystem includes comprehensive development tools and supporting components:
Development Boards:
- Kintex-7 FPGA KC705 Evaluation Kit
- Third-party development platforms
- Custom carrier boards and modules
Software Tools:
- Xilinx Vivado Design Suite
- ISE Design Suite (legacy support)
- SDK (Software Development Kit)
- ChipScope Pro Analyzer
IP Cores and Libraries:
- Xilinx LogiCORE IP portfolio
- DSP and communication IP blocks
- Interface controllers and protocols
- Custom IP development frameworks
Training and Support:
- Xilinx University Program resources
- Online training modules and webinars
- Technical support and community forums
- Application engineering assistance
Environmental & Export Classifications
The XC7K325T-L2FBG900E meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS Directive 2011/65/EU compliant
- REACH regulation compliance
- Conflict minerals reporting
- Lead-free and halogen-free options available
Quality Standards:
- ISO 9001:2015 certified manufacturing
- Automotive AEC-Q100 qualified variants
- Industrial temperature grade (-40ยฐC to +100ยฐC)
- Military and aerospace grade options
Export Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- Harmonized Tariff Schedule (HTS): 8542.31.0001
- Country of Origin: Various (consult specific part marking)
- Export license requirements may apply for certain destinations
Packaging and Handling:
- Moisture sensitivity level: MSL 3
- ESD sensitive device classification
- Tape and reel packaging for automated assembly
- Tray packaging for prototype and low-volume applications
The XC7K325T-L2FBG900E represents a premium FPGA solution that combines high performance, low power consumption, and extensive connectivity options, making it an excellent choice for advanced digital systems requiring reliable, high-speed processing capabilities.
