The XC7K325T-3FFG900C is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s Kintex-7 series, engineered to deliver exceptional performance for demanding digital signal processing, embedded processing, and connectivity applications. This powerful FPGA combines high logic density with advanced features, making it an ideal choice for engineers developing next-generation electronic systems.
Product Specifications
The XC7K325T-3FFG900C offers impressive technical capabilities designed for high-performance applications:
Logic Resources:
- 326,080 system logic cells
- 40,540 configurable logic blocks (CLBs)
- 162,240 six-input look-up tables (LUTs)
- 324,480 flip-flops
Memory and Storage:
- 16,020 Kb total block RAM
- 445 block RAM/FIFO blocks (36 Kb each)
- 890 block RAM/FIFO blocks (18 Kb each)
DSP Performance:
- 840 DSP48E1 slices for high-speed digital signal processing
- Support for complex mathematical operations and filtering
I/O and Connectivity:
- 500 user I/O pins in FFG900 package
- High-speed serial transceivers for advanced connectivity
- Support for various I/O standards including LVDS, SSTL, and HSTL
Package Details:
- FFG900 Fine-Pitch Ball Grid Array package
- Speed grade -3 for enhanced performance
- Commercial temperature range (0ยฐC to +85ยฐC)
Price Information
The XC7K325T-3FFG900C pricing varies based on quantity, distribution channel, and current market conditions. For accurate pricing information:
- Contact authorized Xilinx distributors for volume pricing
- Request quotes from electronic component suppliers
- Check official Xilinx partner websites for current availability
- Consider lead times and minimum order quantities when planning procurement
Pricing typically reflects the advanced capabilities and high logic density of this premium FPGA, positioning it competitively within the high-performance programmable logic market.
Documents & Media
Essential documentation and resources for the XC7K325T-3FFG900C include:
Technical Documentation:
- Kintex-7 FPGA Data Sheet with complete electrical specifications
- Package pinout diagrams and mechanical drawings
- Power consumption and thermal management guidelines
- Design constraint files and reference designs
Development Resources:
- Vivado Design Suite compatibility information
- IP core integration guides
- Application notes for specific use cases
- Evaluation board documentation and schematics
Software Tools:
- Xilinx Vivado Design Suite support
- SDK and embedded development tools
- Simulation and verification resources
- Programming and configuration utilities
Related Resources
Complementary products and resources that enhance XC7K325T-3FFG900C implementation:
Development Platforms:
- Kintex-7 evaluation and development boards
- Custom carrier boards and modules
- Debug and programming hardware
IP Cores and Solutions:
- Xilinx LogiCORE IP portfolio compatibility
- Third-party IP solutions and reference designs
- Protocol-specific IP cores for connectivity applications
Design Services:
- Xilinx Alliance Program partner design services
- Training and certification programs
- Technical support and consulting resources
Alternative Devices:
- Other Kintex-7 family members for scalable solutions
- Zynq-7000 series for embedded processing requirements
- Newer generation FPGAs for migration paths
Environmental & Export Classifications
The XC7K325T-3FFG900C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for chemical substances
- Conflict minerals reporting and compliance
- ISO 14001 environmental management system certification
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC junction temperature
- Industrial variants available for extended temperature ranges
- Specified voltage and power consumption parameters
- ESD protection and handling requirements
Export Classifications:
- Export Control Classification Number (ECCN) as per US Department of Commerce
- International trade compliance documentation
- Country-specific import/export requirements
- Technology transfer restrictions and guidelines
Quality Standards:
- Automotive-grade variants available (AEC-Q100 qualified)
- Military and aerospace temperature grades for specialized applications
- Long-term availability programs for critical applications
- Comprehensive quality and reliability testing
The XC7K325T-3FFG900C represents a powerful solution for engineers requiring high-performance programmable logic with extensive I/O capabilities, making it suitable for applications ranging from communications infrastructure to industrial automation and advanced driver assistance systems.
