The XC7K325T-3FFG676C is a premium field-programmable gate array (FPGA) from Xilinx’s Kintex-7 family, engineered to deliver exceptional performance for demanding digital signal processing, communications, and embedded processing applications. This advanced FPGA combines high logic density with superior power efficiency, making it an ideal choice for next-generation electronic designs.
Product Specifications
The XC7K325T-3FFG676C features robust specifications that position it as a leader in the mid-range FPGA market. This device incorporates 326,080 logic cells and 445,440 system gates, providing substantial processing capability for complex applications. The FPGA includes 890 configurable logic blocks (CLBs) and 1,600 distributed RAM blocks, ensuring flexible implementation of custom logic functions.
Memory resources in the XC7K325T-3FFG676C include 16.06 Mb of block RAM and 1,030 DSP48E1 slices optimized for high-performance digital signal processing operations. The device supports multiple I/O standards and features 400 user I/O pins in the FFG676 package format. Operating at a -3 speed grade, this FPGA delivers maximum performance with clock frequencies up to 464 MHz for demanding timing requirements.
The XC7K325T-3FFG676C utilizes advanced 28nm CMOS technology, providing an optimal balance between performance, power consumption, and cost-effectiveness. The device operates across commercial temperature ranges and supports multiple voltage levels for flexible system integration.
Price Information
Pricing for the XC7K325T-3FFG676C varies based on order quantity, distributor, and current market conditions. Commercial pricing typically ranges from $800 to $1,200 per unit for standard quantities, with volume discounts available for larger orders. Educational institutions and development projects may qualify for special pricing programs.
For current pricing and availability of the XC7K325T-3FFG676C, contact authorized Xilinx distributors or visit official semiconductor marketplace websites. Lead times can vary from immediate availability to several weeks depending on market demand and supply chain conditions.
Documents & Media
Comprehensive technical documentation supports the XC7K325T-3FFG676C implementation process. The primary datasheet provides detailed electrical specifications, timing parameters, and package information essential for design planning. The Kintex-7 family overview document offers architectural insights and feature comparisons across the product line.
Development resources include the Kintex-7 PCB Design Guide, which provides layout recommendations and signal integrity considerations for the FFG676 package. Pin-out diagrams and package drawings facilitate accurate PCB footprint creation and component placement.
Software support documentation covers Vivado Design Suite compatibility, synthesis guidelines, and implementation best practices specific to the XC7K325T-3FFG676C. Application notes address common design challenges and provide proven solutions for typical use cases.
Related Resources
The XC7K325T-3FFG676C integrates seamlessly with Xilinx’s comprehensive development ecosystem. Vivado Design Suite provides complete FPGA design flow support, including synthesis, implementation, and debugging tools optimized for Kintex-7 devices. The software includes built-in IP catalog with pre-verified intellectual property cores for rapid development.
Development boards featuring the XC7K325T-3FFG676C enable rapid prototyping and evaluation. These platforms typically include high-speed interfaces, memory subsystems, and connectivity options that showcase the FPGA’s capabilities. Reference designs demonstrate best practices for implementing common functions and interfaces.
Training resources include online courses, webinars, and hands-on workshops covering FPGA design methodology and Kintex-7 specific features. Technical support forums and documentation libraries provide ongoing assistance throughout the development process.
Third-party tool compatibility extends design options beyond Xilinx’s native toolchain. Popular simulation tools, IP providers, and specialized design software support the XC7K325T-3FFG676C for comprehensive development workflows.
Environmental & Export Classifications
The XC7K325T-3FFG676C meets stringent environmental standards for reliable operation in diverse conditions. The device complies with RoHS directives for lead-free manufacturing and environmental responsibility. Halogen-free package options support green technology initiatives and regulatory compliance requirements.
Operating temperature specifications ensure reliable performance across commercial temperature ranges from 0ยฐC to 85ยฐC for junction temperature. The device features robust electrostatic discharge (ESD) protection and latch-up immunity for enhanced reliability in challenging environments.
Export classification for the XC7K325T-3FFG676C follows international trade regulations and technology transfer restrictions. The device typically falls under standard commercial export categories, though specific applications may require additional compliance verification. Customers should consult current export control regulations for their intended use and destination countries.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade options for mission-critical applications. The XC7K325T-3FFG676C undergoes comprehensive testing protocols including burn-in, temperature cycling, and accelerated aging tests to ensure long-term reliability.
Environmental impact considerations include recyclable packaging materials and energy-efficient manufacturing processes. The device’s low-power architecture contributes to reduced system-level energy consumption and environmental footprint throughout its operational lifecycle.
The XC7K325T-3FFG676C represents proven FPGA technology for applications requiring high performance, reliability, and design flexibility. Contact authorized distributors for current availability, pricing, and technical support for your specific project requirements.
