The XC7K325T-3FBG676E is a powerful FPGA (Field-Programmable Gate Array) from AMD Xilinx’s Kintex-7 series, designed to deliver exceptional performance for demanding applications requiring high-speed processing and advanced programmable logic capabilities.
Product Specification
The XC7K325T-3FBG676E features robust specifications that make it ideal for industrial, telecommunications, and high-performance computing applications:
Core Architecture:
- Logic Cells: 326,080 logic cells providing extensive programmable capacity
- System Gates: Approximately 5 million system gates for complex digital designs
- CLB Slices: 50,950 configurable logic block slices for flexible implementation
- Block RAM: 16.020 Kb total block RAM for efficient data storage and buffering
I/O and Connectivity:
- Package Type: FBG676 Fine-pitch Ball Grid Array
- Total I/O Pins: 400 user I/O pins for extensive connectivity options
- High-speed transceivers: 16 GTX transceivers supporting up to 12.5 Gbps data rates
- PCI Express: Native PCIe Gen2 x8 support for system integration
Performance Specifications:
- Speed Grade: -3 (highest performance grade available)
- Operating Temperature: Extended commercial temperature range
- Power Consumption: Optimized for energy-efficient operation
- Maximum Operating Frequency: Up to 464 MHz for high-speed applications
Memory and DSP Resources:
- DSP48E1 Slices: 840 dedicated DSP slices for signal processing
- Memory Controllers: Integrated memory interface blocks
- Clock Management: Advanced clocking resources with MMCMs and PLLs
Price
The XC7K325T-3FBG676E pricing varies based on quantity, supplier, and market conditions. Contact authorized Xilinx distributors for current pricing information. Volume discounts are typically available for quantities over 100 units. Lead times may vary depending on supply chain conditions and should be confirmed with suppliers.
Documents & Media
Technical Documentation:
- XC7K325T-3FBG676E Datasheet: Complete electrical and mechanical specifications
- Kintex-7 FPGAs Data Sheet: Comprehensive family overview and features
- 7 Series FPGAs Packaging and Pinout Guide: Detailed package information
- XC7K325T-3FBG676E PCN (Product Change Notifications): Latest product updates
Design Resources:
- Vivado Design Suite: Primary development environment for the XC7K325T-3FBG676E
- Reference designs and application notes specific to Kintex-7 architecture
- Power estimation tools and thermal analysis guides
- Signal integrity guidelines for FBG676 package implementation
Media Resources:
- Product selector guides and comparison charts
- Training materials and webinar recordings
- Technical articles and white papers on Kintex-7 applications
Related Resources
Development Tools:
- Xilinx Vivado Design Suite: Complete design flow for the XC7K325T-3FBG676E
- ISE Design Suite: Legacy tool support (limited for newer features)
- ChipScope Pro: Integrated logic analyzer for debugging
- System Generator for DSP: Model-based design tools
Evaluation Boards:
- KC705 Evaluation Kit: Development platform featuring similar Kintex-7 devices
- Custom evaluation boards from third-party vendors
- Reference design platforms for specific applications
IP Cores and Solutions:
- Xilinx IP catalog with hundreds of pre-verified cores
- Memory interface generators for DDR3/DDR4 implementations
- Communication protocol stacks and interface controllers
- DSP and video processing IP specifically optimized for the XC7K325T-3FBG676E
Application Areas:
- Wireless infrastructure and base station equipment
- Medical imaging and ultrasound systems
- Industrial automation and motor control
- High-frequency trading and financial systems
- Aerospace and defense applications
Environmental & Export Classifications
Environmental Compliance: The XC7K325T-3FBG676E meets stringent environmental standards including RoHS compliance for lead-free manufacturing. The device is manufactured using environmentally responsible processes and materials that comply with international environmental regulations.
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC junction temperature
- Extended commercial options available for harsh environments
- Humidity tolerance: Standard commercial specifications
- Altitude and vibration specifications per JEDEC standards
Export Classifications:
- ECCN (Export Control Classification Number): Check current export control lists
- Country of Origin: Manufactured in qualified facilities worldwide
- Trade Compliance: Subject to applicable export control regulations
- Documentation: Full traceability and compliance documentation available
Quality and Reliability:
- Automotive grade versions available (XC7K325T-3FBG676I)
- JEDEC-compliant testing and qualification
- Long-term supply commitment from AMD Xilinx
- Comprehensive quality management system certification
The XC7K325T-3FBG676E represents a proven solution for applications requiring high-performance programmable logic with excellent power efficiency and comprehensive development tool support. Its robust feature set and proven reliability make it an ideal choice for next-generation electronic systems across multiple industries.
