The XC7K325T-2FFG676C is a powerful field-programmable gate array (FPGA) from Xilinx’s Kintex-7 family, designed to deliver exceptional performance for demanding digital signal processing, wireless communications, and high-speed networking applications. This versatile programmable logic device combines advanced 28nm technology with comprehensive I/O capabilities to meet the requirements of modern electronic systems.
Product Specifications
The XC7K325T-2FFG676C features robust architecture optimized for high-throughput applications. This FPGA contains 325,824 logic cells and 445 user I/O pins, providing extensive programmable resources for complex digital designs. The device operates with a -2 speed grade, ensuring reliable performance across various operating conditions.
Key technical specifications include 16,825 configurable logic blocks (CLBs), 840 DSP48E1 slices for high-performance digital signal processing, and 890 block RAM blocks totaling 19,080 Kb of memory. The XC7K325T-2FFG676C supports multiple I/O standards including LVDS, SSTL, and HSTL, making it compatible with a wide range of interface requirements.
The device utilizes a 676-pin fine-pitch ball grid array (FFG676) package, measuring 27mm x 27mm with a 1.0mm ball pitch. This compact form factor enables high-density board designs while maintaining excellent thermal and electrical performance characteristics.
Price
Pricing for the XC7K325T-2FFG676C varies based on order quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors or sales representatives for current pricing information and volume discounts. Educational institutions and qualifying customers may be eligible for special pricing programs.
Documents & Media
Comprehensive technical documentation supports XC7K325T-2FFG676C implementation and design optimization. Essential resources include the Kintex-7 FPGA Data Sheet containing detailed electrical specifications, timing parameters, and recommended operating conditions. The package and pinout documentation provides critical information for PCB layout and signal routing.
Design methodology guides offer best practices for clock management, power distribution, and high-speed design techniques specific to the XC7K325T-2FFG676C. Configuration and programming documentation covers JTAG, SelectMAP, and other configuration interfaces supported by this device.
Application notes demonstrate practical implementation examples for common use cases including digital signal processing chains, high-speed serial interfaces, and memory controller designs. These resources help accelerate development time and ensure optimal performance from the XC7K325T-2FFG676C.
Related Resources
The XC7K325T-2FFG676C integrates seamlessly with Xilinx’s comprehensive development ecosystem. Vivado Design Suite provides complete implementation flow from RTL synthesis through bitstream generation, with specialized optimization algorithms for Kintex-7 devices.
IP catalog includes pre-verified intellectual property cores optimized for the XC7K325T-2FFG676C, covering memory controllers, communication protocols, and DSP functions. These IP cores reduce development time while ensuring reliable operation and optimal resource utilization.
Development boards featuring the XC7K325T-2FFG676C enable rapid prototyping and evaluation. These platforms include reference designs, example projects, and hardware debugging capabilities to streamline the development process.
Software development kits support embedded processor implementations within the XC7K325T-2FFG676C, including bare-metal applications and real-time operating system integration. Cross-compilation tools and debugging interfaces facilitate software development for embedded applications.
Environmental & Export Classifications
The XC7K325T-2FFG676C meets stringent environmental standards for commercial and industrial applications. Operating temperature range spans from 0ยฐC to +85ยฐC for commercial grade devices, with extended temperature variants available for harsh environment applications.
RoHS compliance ensures environmentally responsible manufacturing practices, while halogen-free package options support green electronics initiatives. The device maintains reliable operation across specified voltage and temperature ranges with comprehensive electrostatic discharge (ESD) protection.
Export classification information for the XC7K325T-2FFG676C is available through official channels to ensure compliance with international trade regulations. Customers should verify current export control status before international shipment or use in regulated applications.
Quality certifications include ISO standards compliance and automotive-grade options where applicable. Comprehensive reliability testing validates long-term performance characteristics under various environmental stress conditions, ensuring dependable operation throughout the product lifecycle.
The XC7K325T-2FFG676C represents proven FPGA technology suitable for diverse applications requiring high performance, flexibility, and reliability in a compact package format.
