The XC7K325T-2FF900I is a powerful Kintex-7 FPGA (Field-Programmable Gate Array) from Xilinx, designed to deliver exceptional performance for demanding digital signal processing, communications, and embedded processing applications. This industrial-grade device combines high logic density with advanced features, making it ideal for aerospace, defense, telecommunications, and industrial automation projects.
Product Specifications
The XC7K325T-2FF900I offers impressive technical capabilities in a compact package:
Core Architecture:
- Logic Cells: 326,080
- CLB Slices: 50,950
- Block RAM: 16,020 Kb total
- DSP Slices: 840
- Speed Grade: -2 (high performance)
Memory and Processing:
- Distributed RAM: 1,600 Kb
- Block RAM Blocks: 445
- Maximum Memory Interfaces: Multiple DDR3/DDR2 controllers
- Hard IP Cores: PCIe Gen2 x8, Gigabit Ethernet MAC
I/O and Connectivity:
- Package: FF900 (30mm x 30mm Fine-Pitch BGA)
- Total I/O Pins: 500
- High-Performance I/O Banks: 6
- Differential Pairs: 250
- Operating Temperature: Industrial (-40ยฐC to +100ยฐC)
Power and Performance:
- Supply Voltage: 1.0V core, 1.8V/2.5V/3.3V I/O
- Power Consumption: Optimized for energy efficiency
- Maximum Operating Frequency: Up to 464 MHz
Price Information
The XC7K325T-2FF900I pricing varies based on quantity, supplier, and market conditions. For current pricing and availability:
- Contact authorized Xilinx distributors for volume pricing
- Evaluation quantities typically available through major electronics suppliers
- Price breaks available for production quantities (100+ units)
- Extended temperature variants may carry premium pricing
Note: Prices fluctuate based on market demand and semiconductor availability. Contact suppliers directly for current quotations.
Documents & Media
Essential documentation for the XC7K325T-2FF900I includes:
Technical Documentation:
- Kintex-7 FPGA Data Sheet (DS182)
- XC7K325T-2FF900I Product Brief
- Kintex-7 FPGA Configuration User Guide
- SelectIO Resources User Guide
- Memory Interface Solutions User Guide
Design Resources:
- Vivado Design Suite compatibility guides
- Reference designs and application notes
- PCB layout guidelines for FF900 package
- Thermal management recommendations
- Power estimation spreadsheets
Software Tools:
- Vivado Design Suite (latest version recommended)
- ISE Design Suite (legacy support)
- SDK (Software Development Kit)
- ChipScope Pro debugging tools
Related Resources
The XC7K325T-2FF900I ecosystem includes comprehensive development support:
Development Boards:
- Kintex-7 FPGA KC705 Evaluation Kit
- Custom carrier boards from third-party vendors
- Prototyping platforms with XC7K325T variants
IP Cores and Libraries:
- Xilinx LogiCORE IP portfolio
- DSP48E1 optimized algorithms
- Communication protocol stacks
- Video and image processing libraries
Training and Support:
- Xilinx University Program resources
- Online training modules
- Technical support forums
- Application engineering consultation
Compatible Devices:
- Other Kintex-7 family members (XC7K70T, XC7K160T, XC7K410T)
- Zynq-7000 SoC alternatives for ARM processing needs
- Virtex-7 series for highest performance requirements
Environmental & Export Classifications
The XC7K325T-2FF900I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free construction)
- REACH regulation compliance
- Halogen-free package materials available
- Industrial temperature range: -40ยฐC to +100ยฐC
- Moisture Sensitivity Level: MSL 3
Quality and Reliability:
- Automotive-grade variants available (XC7K325T-2FF900Q)
- Extended burn-in testing options
- Statistical quality control (SQC) screening
- Radiation-tolerant versions for space applications
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Varies by manufacturing location
- Export licensing requirements apply for certain destinations
Packaging and Handling:
- ESD-sensitive device (Class 1A)
- Moisture-sensitive packaging required
- Tray or tape-and-reel packaging options
- Anti-static handling procedures mandatory
The XC7K325T-2FF900I represents a proven solution for applications requiring high-performance FPGA capabilities with industrial-grade reliability. Its combination of logic density, DSP resources, and connectivity options makes it suitable for next-generation embedded systems, communications infrastructure, and signal processing applications.
