The XC7K325T-2FF676I is a powerful field-programmable gate array (FPGA) from Xilinx’s Kintex-7 family, designed to deliver exceptional performance for demanding digital signal processing, communications, and high-speed computing applications. This versatile FPGA combines advanced 28nm technology with comprehensive connectivity options to meet the requirements of modern electronic systems.
Product Specifications
Core Architecture
The XC7K325T-2FF676I features Xilinx’s proven 7 Series architecture, offering optimal balance between performance, power consumption, and cost. This FPGA incorporates advanced programmable logic, high-speed transceivers, and dedicated processing blocks to handle complex computational tasks efficiently.
Key Technical Parameters
- Logic Cells: 326,080 logic cells providing extensive programmable resources
- Package Type: FF676 – Fine-pitch Ball Grid Array (BGA) for high-density applications
- Speed Grade: -2 speed grade ensuring reliable performance across operating conditions
- Temperature Range: Industrial grade (-40ยฐC to +100ยฐC) suitable for harsh environments
- Block RAM: Substantial embedded memory resources for data buffering and processing
- DSP Slices: Dedicated digital signal processing blocks for arithmetic operations
- I/O Pins: Comprehensive selection of user-configurable I/O pins
- Power Supply: Multiple voltage domains supporting various interface standards
Package and Physical Characteristics
The XC7K325T-2FF676I utilizes a 676-pin Fine-pitch Ball Grid Array (FF676) package, measuring 27mm x 27mm with 1.0mm ball pitch. This compact footprint enables high-density board designs while maintaining excellent thermal performance and signal integrity.
Pricing Information
XC7K325T-2FF676I pricing varies based on quantity, distribution channel, and current market conditions. For the most competitive pricing and availability:
- Small Quantities (1-9 units): Contact authorized distributors for current pricing
- Volume Pricing (10+ units): Significant discounts available for production quantities
- OEM Pricing: Custom pricing programs available for high-volume applications
- Sampling: Engineering samples may be available through Xilinx direct or authorized partners
Note: Prices fluctuate based on market demand and silicon availability. Contact your preferred supplier for real-time pricing and delivery schedules.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Comprehensive implementation guidelines and design recommendations
- Pin-out Documentation: Detailed pin assignments and package drawings
- Errata: Known issues and recommended workarounds for current silicon revision
- Migration Guide: Guidelines for upgrading from previous FPGA generations
Design Resources
- Reference Designs: Proven implementations for common applications
- Application Notes: Detailed guidance for specific use cases and optimization techniques
- Simulation Models: SPICE and IBIS models for signal integrity analysis
- PCB Design Guidelines: Layout recommendations and routing considerations
- Thermal Design Guide: Heat dissipation strategies and thermal management
Software and Tools
- Vivado Design Suite: Complete development environment for the XC7K325T-2FF676I
- IP Catalog: Pre-verified intellectual property cores and interfaces
- Debugging Tools: Integrated logic analyzer and system-level debugging capabilities
Related Resources
Development Platforms
- Evaluation Boards: Ready-to-use development platforms featuring the XC7K325T-2FF676I
- Starter Kits: Complete development systems with tutorials and example projects
- Third-Party Boards: Partner-developed platforms optimizing specific applications
Training and Support
- Online Training: Web-based courses covering FPGA design methodology
- Technical Support: Direct access to Xilinx applications engineers
- Community Forums: Peer-to-peer support and knowledge sharing
- Design Services: Professional consulting for complex implementations
Compatible Products
- Configuration Devices: Non-volatile memory solutions for FPGA configuration
- Power Management: Optimized power supply solutions for multi-rail requirements
- Clock Generation: Low-jitter clock sources and distribution networks
- Interface Solutions: Level translators and signal conditioning circuits
Environmental & Export Classifications
Environmental Compliance
The XC7K325T-2FF676I meets stringent environmental standards ensuring responsible manufacturing and deployment:
- RoHS Compliant: Lead-free manufacturing process meeting European Union directives
- REACH Compliant: Conforming to chemical substance regulations
- Conflict Minerals: Compliant with conflict mineral reporting requirements
- ISO 14001: Manufactured under certified environmental management systems
Operating Conditions
- Operating Temperature: -40ยฐC to +100ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC for long-term storage
- Humidity: Up to 85% relative humidity, non-condensing
- Altitude: Operational up to 2000 meters above sea level
Export and Trade Classifications
- ECCN: Export Control Classification Number compliance for international shipping
- Country of Origin: Manufactured under controlled supply chain management
- Export Licensing: Specific requirements may apply based on end-use and destination
- Trade Compliance: Adherence to international trade regulations and sanctions
Quality and Reliability
- Qualification Standards: Automotive and industrial qualification testing
- MTBF Rating: Mean Time Between Failures exceeding industry standards
- Quality System: ISO 9001 certified manufacturing and testing processes
- Traceability: Complete lot traceability for quality control and field support
The XC7K325T-2FF676I represents an excellent choice for engineers requiring high-performance FPGA capabilities in a compact, industrial-grade package. Its combination of advanced features, comprehensive support resources, and proven reliability makes it ideal for next-generation electronic systems across multiple industries.
