The XC7K325T-2FBG900I is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s Kintex-7 family, designed to deliver exceptional performance for demanding digital signal processing, communications, and embedded applications. This industrial-grade device combines high logic capacity with advanced features, making it ideal for professional development and production environments.
Product Specifications
The XC7K325T-2FBG900I offers impressive technical capabilities that set it apart in the FPGA market. This device features 325,000 logic cells with 407,600 configurable logic blocks (CLBs), providing substantial processing power for complex algorithms and designs. The FPGA includes 840 DSP48E1 slices optimized for digital signal processing operations, along with 16.06 Mb of block RAM for efficient data storage and buffering.
Built on advanced 28nm technology, the XC7K325T-2FBG900I operates at industrial temperature ranges from -40ยฐC to +100ยฐC, ensuring reliable performance in harsh environments. The device features a 900-pin Fine-Pitch Ball Grid Array (FBGA) package, offering high I/O density with 500 user I/O pins. The speed grade -2 designation indicates optimized performance characteristics for high-frequency applications.
Key specifications include support for DDR3-1866 memory interfaces, PCIe Gen2 x8 connectivity, and multiple high-speed serial transceivers capable of operating up to 12.5 Gbps. The integrated memory controller and advanced clocking architecture enable efficient system-level integration and timing closure.
Price Information
Pricing for the XC7K325T-2FBG900I varies based on quantity, distribution channel, and current market conditions. Industrial-grade FPGAs like this model typically command premium pricing due to their extended temperature range and enhanced reliability specifications. For current pricing and availability, customers should contact authorized Xilinx distributors or check electronic component suppliers.
Volume pricing discounts are generally available for production quantities, making the XC7K325T-2FBG900I cost-effective for large-scale deployments. Educational institutions and startups may qualify for special pricing programs through Xilinx’s various support initiatives.
Documents & Media
Comprehensive documentation supports the XC7K325T-2FBG900I development process. The official Xilinx datasheet provides detailed electrical specifications, timing parameters, and package information essential for design planning. The Kintex-7 FPGA Data Sheet includes DC and AC characteristics, power consumption data, and recommended operating conditions.
Supporting documentation includes the Kintex-7 FPGA Configuration User Guide, which details programming options and configuration interfaces. The 7 Series FPGAs Packaging and Pinout Specification offers complete pin assignments and package mechanical drawings for PCB design.
Development resources include reference designs, application notes covering DSP implementation, memory interfacing, and high-speed I/O design. Xilinx provides comprehensive IP core libraries optimized for the XC7K325T-2FBG900I, accelerating development time and ensuring reliable implementation.
Related Resources
The XC7K325T-2FBG900I integrates seamlessly with Xilinx’s development ecosystem. Vivado Design Suite provides the primary development environment, offering synthesis, implementation, and debugging tools specifically optimized for Kintex-7 devices. The software includes built-in IP integrator for system-level design and comprehensive timing analysis capabilities.
Development boards featuring the XC7K325T-2FBG900I enable rapid prototyping and evaluation. These platforms typically include DDR3 memory, high-speed connectors, and various peripheral interfaces for comprehensive system testing. Third-party development boards expand the available options for specific application requirements.
Related Kintex-7 family members offer scalability options, with devices ranging from XC7K70T to XC7K480T providing different logic capacities while maintaining architectural compatibility. This family approach enables design reuse and simplified migration between devices as requirements evolve.
Environmental & Export Classifications
The XC7K325T-2FBG900I meets stringent environmental and regulatory standards required for industrial applications. The device carries RoHS compliance certification, ensuring lead-free construction compatible with modern manufacturing processes. Industrial temperature rating (-40ยฐC to +100ยฐC) qualifies the device for automotive, aerospace, and industrial control applications.
Export classification follows standard semiconductor regulations, with the XC7K325T-2FBG900I falling under standard commercial technology categories. Customers should verify current export requirements for their specific applications and destinations, as regulations may vary by end-use and geographic location.
Environmental testing includes humidity resistance, thermal cycling, and mechanical shock specifications that exceed commercial-grade requirements. The robust construction and industrial qualification make the XC7K325T-2FBG900I suitable for mission-critical applications where reliability is paramount.
Quality certifications include ISO manufacturing standards and automotive-grade testing where applicable. The extended lifecycle support typical of industrial-grade components ensures long-term availability for production applications requiring multi-year supply commitments.
The XC7K325T-2FBG900I represents cutting-edge FPGA technology, combining high performance with industrial reliability for demanding applications across multiple market segments.
