The XC7K325T-2FBG676I is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Kintex-7 family, designed to deliver exceptional performance for demanding digital signal processing, wireless communications, and high-speed networking applications. This versatile FPGA combines advanced 28nm technology with optimized power efficiency, making it an ideal choice for engineers developing next-generation electronic systems.
Product Specifications
The XC7K325T-2FBG676I features impressive technical specifications that set it apart in the FPGA market. This device incorporates 326,080 logic cells and 50,950 CLB slices, providing substantial processing power for complex applications. The FPGA includes 890 DSP48E1 slices for high-performance digital signal processing operations, essential for applications requiring intensive mathematical computations.
Memory capabilities of the XC7K325T-2FBG676I include 16,020 Kb of block RAM and 1,670 Kb of distributed RAM, offering flexible storage options for various data buffering requirements. The device supports 500 user I/O pins in the FBG676 package, enabling extensive connectivity options for system integration.
Operating at a speed grade of -2, the XC7K325T-2FBG676I delivers reliable performance across industrial temperature ranges from -40ยฐC to +100ยฐC. The device utilizes a 676-pin Fine-Pitch Ball Grid Array (FBGA) package, measuring 27mm x 27mm with a 1.0mm ball pitch, optimizing board space utilization while maintaining excellent thermal characteristics.
Power consumption specifications include static power consumption of approximately 2.5W and dynamic power scaling based on application requirements. The device operates with core voltages of 1.0V (VCCINT) and auxiliary voltages of 1.8V (VCCAUX), providing stable operation across various system configurations.
Price Information
The XC7K325T-2FBG676I pricing varies based on quantity, distribution channel, and current market conditions. As a high-performance FPGA targeting professional and industrial applications, this device typically commands premium pricing reflecting its advanced capabilities and extensive feature set.
For current pricing information on the XC7K325T-2FBG676I, customers should contact authorized Xilinx distributors or visit official semiconductor marketplaces. Volume pricing discounts are typically available for production quantities, with additional cost considerations including development tools, licensing fees, and support services.
Budget planning for XC7K325T-2FBG676I implementations should account for associated costs including PCB design complexity, power supply requirements, configuration memory, and development software licensing. These factors contribute to the total system cost beyond the base FPGA price.
Documents & Media
Comprehensive documentation for the XC7K325T-2FBG676I includes detailed datasheets, user guides, and design reference materials available through Xilinx’s official documentation portal. The primary datasheet provides complete electrical specifications, timing parameters, and package information essential for successful implementation.
Design documentation includes PCB layout guidelines, thermal management recommendations, and power distribution strategies specific to the XC7K325T-2FBG676I. These resources help engineers optimize board designs for maximum performance and reliability.
Application notes covering common use cases, design methodologies, and troubleshooting procedures provide valuable insights for XC7K325T-2FBG676I development projects. Video tutorials and webinars offer additional learning resources for both experienced and novice FPGA developers.
Development tool documentation includes Vivado Design Suite guides, IP core integration instructions, and debugging methodologies specifically tailored for Kintex-7 devices. These materials accelerate development cycles and improve design quality.
Related Resources
The XC7K325T-2FBG676I ecosystem includes extensive development tools, IP cores, and reference designs that accelerate time-to-market for new projects. Xilinx Vivado Design Suite provides comprehensive development environment support, including synthesis, implementation, and debugging capabilities optimized for Kintex-7 architecture.
IP core libraries compatible with the XC7K325T-2FBG676I encompass communication protocols, signal processing functions, and interface standards. These pre-verified components reduce development risk and accelerate system integration processes.
Development boards and evaluation kits featuring the XC7K325T-2FBG676I or similar Kintex-7 devices enable rapid prototyping and proof-of-concept development. These platforms include essential peripherals, connectivity options, and example designs that demonstrate device capabilities.
Training resources include online courses, certification programs, and hands-on workshops focused on Kintex-7 FPGA development. These educational materials help engineering teams maximize their investment in XC7K325T-2FBG676I-based designs.
Community forums and technical support channels provide ongoing assistance throughout the development lifecycle, connecting XC7K325T-2FBG676I users with experienced developers and Xilinx technical experts.
Environmental & Export Classifications
The XC7K325T-2FBG676I meets stringent environmental compliance standards, including RoHS (Restriction of Hazardous Substances) directive compliance for lead-free manufacturing processes. The device undergoes rigorous testing to ensure reliability under various environmental conditions typical of industrial and commercial applications.
Temperature specifications for the XC7K325T-2FBG676I include industrial-grade operation from -40ยฐC to +100ยฐC junction temperature, enabling deployment in challenging environmental conditions. Humidity resistance and thermal cycling capabilities ensure long-term reliability in diverse operating environments.
Export classification information for the XC7K325T-2FBG676I includes ECCN (Export Control Classification Number) and HTS (Harmonized Tariff Schedule) codes required for international shipping and customs documentation. These classifications help ensure compliance with applicable export control regulations.
Environmental impact considerations include packaging materials, manufacturing processes, and end-of-life disposal recommendations. Xilinx provides guidance for responsible disposal and recycling of XC7K325T-2FBG676I devices in accordance with local environmental regulations.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade qualification testing where applicable. These certifications demonstrate the XC7K325T-2FBG676I’s suitability for mission-critical applications requiring exceptional reliability and performance consistency.
The XC7K325T-2FBG676I represents a powerful solution for engineers seeking high-performance FPGA capabilities in a compact, efficient package. Its combination of processing power, flexibility, and comprehensive ecosystem support makes it an excellent choice for advanced digital system development across multiple industries and applications.
